公开(公告)号：US20080185178A1

公开(公告)日：2008-08-07

申请号：US12011725

申请日：2008-01-29

申请人： Rikiya Okimoto ,  Yoji Ueda ,  Satoru Tomekawa ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Rikiya Okimoto ,  Yoji Ueda ,  Satoru Tomekawa ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H05K1/11

CPC分类号： H01L23/49838 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the electrical insulating base that is arranged at an outermost layer. According to a method for manufacturing a circuit board of the present invention, includes the steps of: forming a via hole in an electrical insulating base; filling the via hole with a conductive paste; laminating a metal foil or a releasing sheet on the electrical insulating base, and placing a jig for pressing above and below the lamination, followed by hot-pressing so as to apply heat and pressure thereto, so as to form a conductive portion made of the conductive paste in the via hole; and forming a land for mounting only on at least one surface of the electrical insulating base that is arranged at an outermost layer. Thereby, a circuit board can be provided, having a land for mounting formed with a narrow pitch.

摘要翻译： 本发明的电路板包括：电绝缘层，其包括至少一层电绝缘基底; 以及形成在设置在电绝缘基底中的通孔中的导电部分。 仅用于安装的地面设置在布置在最外层的电绝缘基底的至少一个表面上。 根据本发明的电路基板的制造方法，其特征在于，包括以下步骤：在电绝缘基体中形成通孔; 用导电膏填充通孔; 在电绝缘基底上层叠金属箔或脱模片，并且在层压体的上下配置压入夹具，然后进行热压，以对其进行加热和加压，从而形成由 导电膏在通孔中; 并且形成用于仅安装在布置在最外层的电绝缘基底的至少一个表面上的平台。 由此，可以提供具有窄间距形成的用于安装的台面的电路板。

公开(公告)号：US20050124197A1

公开(公告)日：2005-06-09

申请号：US11003680

申请日：2004-12-03

申请人： Rikiya Okimoto ,  Yoji Ueda ,  Satoru Tomekawa ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Rikiya Okimoto ,  Yoji Ueda ,  Satoru Tomekawa ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H01L23/498 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01R13/62

CPC分类号： H01L23/49838 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the electrical insulating base that is arranged at an outermost layer. According to a method for manufacturing a circuit board of the present invention, includes the steps of: forming a via hole in an electrical insulating base; filling the via hole with a conductive paste; laminating a metal foil or a releasing sheet on the electrical insulating base, and placing a jig for pressing above and below the lamination, followed by hot-pressing so as to apply heat and pressure thereto, so as to form a conductive portion made of the conductive paste in the via hole; and forming a land for mounting only on at least one surface of the electrical insulating base that is arranged at an outermost layer. Thereby, a circuit board can be provided, having a land for mounting formed with a narrow pitch.

摘要翻译： 本发明的电路板包括：电绝缘层，其包括至少一层电绝缘基底; 以及形成在设置在电绝缘基底中的通孔中的导电部分。 仅用于安装的地面设置在布置在最外层的电绝缘基底的至少一个表面上。 根据本发明的电路基板的制造方法，其特征在于，包括以下步骤：在电绝缘基体中形成通孔; 用导电膏填充通孔; 在电绝缘基底上层叠金属箔或脱模片，并且在层压体的上下配置压入夹具，然后进行热压，以对其进行加热和加压，从而形成由 导电膏在通孔中; 并且形成用于仅安装在布置在最外层的电绝缘基底的至少一个表面上的平台。 由此，可以提供具有窄间距形成的用于安装的台面的电路板。

公开(公告)号：US20090032285A1

公开(公告)日：2009-02-05

申请号：US11814698

申请日：2005-01-27

申请人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

发明人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

IPC分类号： H05K3/46 ,  H05K1/14 ,  H05K1/00

CPC分类号： H05K1/024 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10T428/24843

摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

摘要翻译： 一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。

公开(公告)号：US06774316B1

公开(公告)日：2004-08-10

申请号：US09890145

申请日：2001-07-26

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Satoru Tomekawa ,  Yoshihiro Bessho ,  Tousaku Nishiyama ,  Tetsuyoshi Ogura

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Satoru Tomekawa ,  Yoshihiro Bessho ,  Tousaku Nishiyama ,  Tetsuyoshi Ogura

IPC分类号： H01R1204

CPC分类号： H05K3/462 ,  H05K1/0373 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  Y10T29/49165

摘要： The present invention aims to provide a wiring substrate highly reliable in insulation and connection and a method for manufacturing the wiring substrate. A wiring substrate having two or more wiring layers, insulation layers interposed between the neighboring wiring layers and containing an organic resin, and a via formed in the insulation layers and extended between neighboring wiring layers. The via including functional substances, as well as some of the voids (first voids) where at least the organic resins from the insulation layers exist and the remaining voids (second voids) where a gas exists.

摘要翻译： 本发明的目的在于提供一种绝缘和连接高度可靠的布线基板和布线基板的制造方法。 具有两层以上布线层的布线基板，位于相邻配线层之间并含有有机树脂的绝缘层，以及形成在绝缘层中并在相邻布线层之间延伸的通孔。 通孔包括功能性物质，以及至少存在绝缘层的有机树脂和存在气体的剩余空隙（第二空隙）的一些空隙（第一空隙）。

公开(公告)号：US20050014035A1

公开(公告)日：2005-01-20

申请号：US10890329

申请日：2004-07-12

申请人： Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

发明人： Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

IPC分类号： C08J5/04 ,  D04H1/42 ,  D04H13/00 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  C04B35/64 ,  B28B1/00 ,  B28B3/00 ,  B28B5/00 ,  B32B3/00 ,  B32B5/02 ,  B32B9/00 ,  C04B33/32 ,  C04B33/36 ,  D04H1/00 ,  D04H3/00 ,  D04H5/00 ,  H01R12/04 ,  H05K1/11

CPC分类号： H05K1/0366 ,  C08J5/046 ,  D04H1/4318 ,  D04H1/64 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T442/20

摘要： A prepreg for a printed wiring board includes fluorocarbon fibers as a reinforcing material, and the reinforcing material is impregnated with a resin. The fluorocarbon fibers include short fibers having a branch structure. The reinforcing material includes a nonwoven fabric formed by interlacing the fluorocarbon fibers in the thickness direction. The proportion of the fluorocarbon fibers among the fibers constituting the nonwoven fabric ranges from 50 wt % to 100 wt %, and the remaining fibers are synthetic fibers or inorganic fibers. The nonwoven fabric is heat-treated at 330° C. to 390° C., then annealed at 200° C. to 270° C., and impregnated with the resin. This prepreg can used to provide a printed wiring board with low Interstitial Via Hole connection resistance and high connection stability and a method for manufacturing the printed wiring board.

摘要翻译： 用于印刷线路板的预浸料包括作为增强材料的氟碳纤维，并且增强材料用树脂浸渍。 氟碳纤维包括具有分支结构的短纤维。 增强材料包括通过使碳氟化合物纤维沿厚度方向交织而形成的无纺布。 构成无纺布的纤维中的氟碳纤维的比例为50重量％〜100重量％，剩余的纤维为合成纤维或无机纤维。 无纺布在330℃至390℃下热处理，然后在200℃下退火至270℃，并用树脂浸渍。 该预浸料可用于提供具有低间隙通孔连接电阻和高连接稳定性的印刷线路板以及印刷线路板的制造方法。

公开(公告)号：US06518514B2

公开(公告)日：2003-02-11

申请号：US09928869

申请日：2001-08-13

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

IPC分类号： H01R1204

CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

公开(公告)号：US06691409B2

公开(公告)日：2004-02-17

申请号：US10280964

申请日：2002-10-25

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

IPC分类号： H01K300

CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

摘要翻译： 电路板被构造成在布线层之间包括不少于两个布线层，用于电绝缘的绝缘体层和在绝缘体层的厚度方向上设置在绝缘体层中的内通孔导电构件， 用于布线层之间的电连接。 绝缘体层由包含有机树脂和热膨胀系数小于有机树脂的材料的复合材料制成，并且包括以所述顺序层压的表面部分，芯部分和表面部分， 表面部分具有高含量的有机树脂，芯部分的有机树脂含量低。 所述布线层具有与所述内通孔导电部件连接的台面部，所述接合部嵌入以与所述芯部大体接触，所述内通孔导电部件的厚度基本上 等于芯部的厚度。 根据该结构，将金属箔的一部分嵌入到绝缘体层中以与芯层接触。 因此，能够提供能够选择性地压缩导电材料的部分的电路基板，由此能够确保层之间的稳定的连接。

公开(公告)号：US08604350B2

公开(公告)日：2013-12-10

申请号：US13143490

申请日：2011-02-22

申请人： Tsuyoshi Himori ,  Shogo Hirai ,  Hiroyuki Ishitomi ,  Satoru Tomekawa ,  Yutaka Nakayama

发明人： Tsuyoshi Himori ,  Shogo Hirai ,  Hiroyuki Ishitomi ,  Satoru Tomekawa ,  Yutaka Nakayama

IPC分类号： H05K1/09 ,  H05K1/11 ,  H01K3/10

CPC分类号： H05K3/4069 ,  H05K3/4623 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/0272 ,  H05K2203/0425

摘要： A multilayer wiring board includes an insulating resin layer, wirings laid on their respective opposite surfaces of the insulating resin layer, and a via-hole conductor for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes first metal regions including a joined unit made of copper particles for connecting the wirings, second metal regions mainly composed of, for example, tin, a tin-copper alloy, or a tin-copper intermetallic compound, and third metal regions mainly composed of bismuth and in contact with the second metal regions. The copper particles forming the joined unit are in plane contact with one another to form plane contact portions, and the second metal regions at least partially are in contact with the first metal regions.

摘要翻译： 多层布线板包括绝缘树脂层，布置在其绝缘树脂层的相应相对表面上的布线，以及用于电连接布线的通孔导体。 通孔导体包括金属和树脂部分。 金属部分包括第一金属区域，其包括由用于连接布线的铜颗粒形成的接合单元，主要由例如锡，锡 - 铜合金或锡 - 铜金属间化合物构成的第二金属区域和第三金属区域 主要由铋组成并与第二金属区域接触。 形成接合单元的铜粒子彼此平面接触以形成平面接触部分，并且第二金属区域至少部分地与第一金属区域接触。

公开(公告)号：US07752749B2

公开(公告)日：2010-07-13

申请号：US11886533

申请日：2006-03-17

申请人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

发明人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75822 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2203/0195 ,  H05K2203/048 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/05599

摘要： One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XYθ direction.

摘要翻译： 电子部件的电极端子和布线基板的连接端子之一预先设置有焊料，确保了布线基板和电子部件中的一个，使电极端子和连接端子彼此抵接 保持布线基板和电子部件中的任一个（取决于不固定的）。 电子部件被加热使得焊料熔化，并且焊料在保持电子部件的同时固化，使得电极端子和连接端子通过焊料彼此接合。 此外，在通过熔融的焊料在布线基板和电子部件之间形成的间隔被保持的同时，电极端子和连接端子相对于布线基板的XY面上的表面相对于彼此微细移动; 方向。

公开(公告)号：US07184617B2

公开(公告)日：2007-02-27

申请号：US11076068

申请日：2005-03-10

申请人： Tsuguhiro Korenaga ,  Kunio Hibino ,  Nobuki Itoh ,  Mikihiro Shimada ,  Yoshihiro Tomita ,  Yasushi Nakagiri ,  Satoru Tomekawa ,  Seiji Karashima

发明人： Tsuguhiro Korenaga ,  Kunio Hibino ,  Nobuki Itoh ,  Mikihiro Shimada ,  Yoshihiro Tomita ,  Yasushi Nakagiri ,  Satoru Tomekawa ,  Seiji Karashima

IPC分类号： G02B6/00 ,  G02B6/12

CPC分类号： G02B6/43 ,  G02B6/1221 ,  G02B6/3608 ,  G02B6/4214 ,  G02B6/4224 ,  H04M1/0214

摘要： A portable device has a configuration such that a plurality of housings are connected functionally, wherein the thickness of a connection section between the housings is reduced so that the portability is improved. The portable device includes a first housing; a first board provided in the first housing; a second housing; a second board provided in the second housing; a connection section for connecting the first housing with the second housing in such a manner that their relative position can be changed; and an optical waveguide film having at least one optical waveguide for connecting the first board with the second board through optical wiring.

摘要翻译： 便携式设备具有这样的结构，使得多个壳体在功能上连接，其中壳体之间的连接部分的厚度减小，从而提高了便携性。 便携式设备包括：第一壳体; 设置在第一壳体中的第一板; 第二个住房; 设置在第二壳体中的第二板; 连接部，其以能够改变其相对位置的方式连接第一壳体与第二壳体; 以及具有至少一个光波导的光波导膜，用于通过光布线将第一板与第二板连接。