Method for temperature compensation of a microelectromechanical sensor, and microelectromechanical sensor

    公开(公告)号:US11874291B2

    公开(公告)日:2024-01-16

    申请号:US17661039

    申请日:2022-04-27

    申请人: Robert Bosch GmbH

    IPC分类号: G01P1/00 G01P15/08

    摘要: A method for temperature compensation of a MEMS sensor. The method includes: in a balancing step, a temperature gradient is produced by a thermal element and a first and a second temperature are determined at a first and a second temperature measurement point, wherein a deflection of a movable structure produced by the temperature gradient is measured and a compensation value is ascertained dependent on the first and second temperature and the deflection; in a measurement step, a physical stimulus is measured by way of a deflection of the movable structure and a third and fourth temperature is determined at the first and second temperature measurement points; in a compensation step, a measured value of the physical stimulus is ascertained dependent on the measured deflection, the third and fourth temperature and the compensation value. A method is also provided including: a regulation step, and a measurement step.

    MICROMECHANICAL STRUCTURE AND MICROMECHANICAL SENSOR

    公开(公告)号:US20220091154A1

    公开(公告)日:2022-03-24

    申请号:US17447876

    申请日:2021-09-16

    申请人: Robert Bosch GmbH

    IPC分类号: G01P15/08 G01P15/125 B81B3/00

    摘要: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

    MICROMECHANICAL SENSOR
    5.
    发明申请

    公开(公告)号:US20210214213A1

    公开(公告)日:2021-07-15

    申请号:US17059729

    申请日:2019-06-06

    申请人: Robert Bosch GmbH

    摘要: A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.

    MEMS microphone element
    6.
    发明授权

    公开(公告)号:US09998828B2

    公开(公告)日:2018-06-12

    申请号:US14884959

    申请日:2015-10-16

    申请人: Robert Bosch GmbH

    发明人: Rolf Scheben

    IPC分类号: H04R7/10 H04R19/00 H04R19/04

    CPC分类号: H04R7/10 H04R19/005 H04R19/04

    摘要: A concept is provided which permits the implementation of MEMS microphone elements having a very good SNR, high microphone sensitivity and a large frequency bandwidth. The microphone structure of the MEMS element is implemented in a layer structure and includes at least one sound pressure-sensitive diaphragm (210), an acoustically permeable counter element (220) and a capacitor system for detecting the diaphragm deflections, the diaphragm (210) and the counter element (220) being situated on top of each other and a distance apart from one another in the layer structure and each bring equipped with at least one electrode of the capacitor system. According to the invention, the layer structure of the diaphragm (210) includes at least one thin closed layer (1) and at least one thick structured layer (2), a grid structure (100) covering the entire diaphragm area being provided in the thick layer (2), which determines the stiffness of the diaphragm (210).

    MEMS COMPONENT INCLUDING A SOUND-PRESSURE-SENSITIVE DIAPHRAGM ELEMENT
    8.
    发明申请
    MEMS COMPONENT INCLUDING A SOUND-PRESSURE-SENSITIVE DIAPHRAGM ELEMENT 有权
    MEMS组件,包括声压敏感膜片元件

    公开(公告)号:US20170022046A1

    公开(公告)日:2017-01-26

    申请号:US15212334

    申请日:2016-07-18

    申请人: Robert Bosch GmbH

    IPC分类号: B81B3/00 H04R3/00 H04R19/04

    摘要: A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.

    摘要翻译: 在MEMS部件的层结构中形成包括至少一个声压敏膜片元件的MEMS麦克风部件,其跨越层结构中的开口。 隔膜元件通过开口的中心区域中的至少一个柱元件附接到部件的层结构。 借助于至少一个压敏电路元件来检测隔膜元件的偏转,压敏电路元件实现在隔膜元件的层结构中,并且位于隔膜元件附接到柱元件的区域中。

    Micromechanical sensor
    10.
    发明授权

    公开(公告)号:US11485630B2

    公开(公告)日:2022-11-01

    申请号:US17059729

    申请日:2019-06-06

    申请人: Robert Bosch GmbH

    摘要: A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.