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    Methods of making and using integrated and testable sensor array
    1.
    发明授权
    Methods of making and using integrated and testable sensor array 有权
    制作和使用集成和可测量传感器阵列的方法

    公开(公告)号：US07781238B2

    公开(公告)日：2010-08-24

    申请号：US11951360

    申请日：2007-12-06

    申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    IPC分类号： H01L21/66

    CPC分类号： H01L22/20 ,  H01L22/14

    摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

    摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

    METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY
    2.
    发明申请
    METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY 有权
    制造和使用集成和可测传感器阵列的方法

    公开(公告)号：US20090148967A1

    公开(公告)日：2009-06-11

    申请号：US11951360

    申请日：2007-12-06

    申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

    IPC分类号： H01L21/66

    CPC分类号： H01L22/20 ,  H01L22/14

    摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

    摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

    Tileable sensor array
    4.
    发明授权
    Tileable sensor array 有权
    可分层传感器阵列

    公开(公告)号：US08659148B2

    公开(公告)日：2014-02-25

    申请号：US12956194

    申请日：2010-11-30

    申请人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    发明人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    IPC分类号： H01L23/34

    CPC分类号： H01L27/20 ,  A61B8/4483 ,  H01L27/14634 ,  H01L27/14658 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.

    摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。

    TILEABLE SENSOR ARRAY
    5.
    发明申请
    TILEABLE SENSOR ARRAY 有权
    可传感器阵列

    公开(公告)号：US20120133001A1

    公开(公告)日：2012-05-31

    申请号：US12956194

    申请日：2010-11-30

    申请人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    发明人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

    IPC分类号： H01L27/00 ,  H01L31/18 ,  H01L21/60

    CPC分类号： H01L27/20 ,  A61B8/4483 ,  H01L27/14634 ,  H01L27/14658 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.

    摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。

    Monitoring or imaging system with interconnect structure for large area sensor array
    7.
    发明授权
    Monitoring or imaging system with interconnect structure for large area sensor array 有权
    具有互连结构的大面积传感器阵列的监控或成像系统

    公开(公告)号：US07892176B2

    公开(公告)日：2011-02-22

    申请号：US11743391

    申请日：2007-05-02

    申请人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

    发明人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

    IPC分类号： A61B8/14

    CPC分类号： H01L27/0207 ,  A61B8/0833 ,  A61B8/4483 ,  B06B1/0629 ,  H01L27/11803 ,  H01L27/14634

    摘要： An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.

    摘要翻译： 用探针单元形成超声波监测系统。 在一个示例中，换能器单元的阵列沿着沿着第一方向以第一间距沿第一平面形成的行和列布置。 包括电路单元阵列的集成电路沿与第一平面平行的第二平面形成。 电路单元沿着第一方向以比第一间距小的第二间距分开。 换能器单元中的第一个沿着垂直于一个平面的方向与第一个电路单元垂直对齐并且具有与其的连接。 第二个换能器单元相对于第二电路单元的位置偏离垂直对准，以便不覆盖第二电路单元。 连接子系统位于换能器单元阵列和电路单元阵列之间，被配置为形成第一换能器单元与第一电路单元的连接以及第二换能器单元与第二电路单元的连接。

    ULTRASOUND SYSTEM WITH THROUGH VIA INTERCONNECT STRUCTURE
    8.
    发明申请
    ULTRASOUND SYSTEM WITH THROUGH VIA INTERCONNECT STRUCTURE 审中-公开
    超声波系统通过互连结构

    公开(公告)号：US20080315331A1

    公开(公告)日：2008-12-25

    申请号：US11767554

    申请日：2007-06-25

    申请人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

    发明人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

    IPC分类号： H01L21/00 ,  H01L27/14

    CPC分类号： B06B1/0629 ,  G01S7/52079 ,  G01S15/8925 ,  G01S15/8927 ,  G10K11/004

    摘要： An ultrasound monitoring system. In one embodiment, an array of transducer cells is formed along a first plane and an integrated circuit structure, formed along a second plane parallel to the first plane, includes an array of circuit cells. A connector provides electrical connections between the array of transducer cells and the array of circuit cells, and an interconnection structure is connected to transfer signals between the circuit cells and processing and control circuitry. The integrated circuit structure includes a semiconductor substrate and a plurality of conductive through-die vias formed through the substrate to provide Input/Output (I/O) connections between the transducer cells and the interconnection structure. The monitoring system may be configured as an imaging system and the processing and control circuitry may be external to the probe unit.

    摘要翻译： 超声波监测系统。 在一个实施例中，沿着第一平面形成一组换能器单元，并且沿着平行于第一平面的第二平面形成的集成电路结构包括电路单元阵列。 连接器提供换能器阵列阵列与电路单元阵列之间的电连接，并且连接互连结构以在电路单元和处理和控制电路之间传送信号。 集成电路结构包括半导体衬底和通过衬底形成的多个导电贯通管道通孔，以在换能器单元和互连结构之间提供输入/输出（I / O）连接。 监视系统可以被配置为成像系统，并且处理和控制电路可以在探针单元的外部。

    MONITORING OR IMAGING SYSTEM WITH INTERCONNECT STRUCTURE FOR LARGE AREA SENSOR ARRAY
    9.
    发明申请
    MONITORING OR IMAGING SYSTEM WITH INTERCONNECT STRUCTURE FOR LARGE AREA SENSOR ARRAY 有权
    用于大面积传感器阵列的互连结构的监测或成像系统

    公开(公告)号：US20080273424A1

    公开(公告)日：2008-11-06

    申请号：US11743391

    申请日：2007-05-02

    申请人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

    发明人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

    IPC分类号： H02N2/00

    CPC分类号： H01L27/0207 ,  A61B8/0833 ,  A61B8/4483 ,  B06B1/0629 ,  H01L27/11803 ,  H01L27/14634

    摘要： An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.

    摘要翻译： 用探针单元形成超声波监测系统。 在一个示例中，换能器单元的阵列沿着沿着第一方向以第一间距沿第一平面形成的行和列布置。 包括电路单元阵列的集成电路沿与第一平面平行的第二平面形成。 电路单元沿着第一方向以比第一间距小的第二间距分开。 换能器单元中的第一个沿着垂直于一个平面的方向与第一个电路单元垂直对齐并且具有与其的连接。 第二个换能器单元相对于第二电路单元的位置偏离垂直对准，以便不覆盖第二电路单元。 连接子系统位于换能器单元阵列和电路单元阵列之间，被配置为形成第一换能器单元与第一电路单元的连接以及第二换能器单元与第二电路单元的连接。