公开(公告)号：US20070137838A1

公开(公告)日：2007-06-21

申请号：US11314567

申请日：2005-12-21

申请人： Jimmy Foster ,  Donna Hardee ,  Don Keener ,  Robert Wolford

发明人： Jimmy Foster ,  Donna Hardee ,  Don Keener ,  Robert Wolford

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28F3/02 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for distributing a thermal load is disclosed that includes two or more base plates connected and oriented around a central axis of the heat sink, at least one base plate receiving the thermal load, each base plate having thermal transport paths, the thermal transport paths oriented among the base plates so as to have the capability of accepting thermal transports having a plurality of lengths for thermal distribution between at least two base plates, heat-dissipating fins connected to each base plate, the heat-dissipating fins spaced apart in parallel and extending from each base plate towards the central axis of the heat sink, and a thermal transport connected between the base plate receiving the thermal load and at least one other base plate so as to distribute the thermal load among the base plates of the heat sink.

摘要翻译： 公开了一种用于分配热负荷的散热器，其包括连接并定向在散热片的中心轴线周围的两个或更多个基板，至少一个接收热负载的基板，每个基板具有热传输路径，热传输 在基板之间定向的路径，以便具有接受具有多个长度以用于在至少两个基板之间进行热分配的热传输的能力，连接到每个基板的散热翅片，平行间隔开的​​散热翅片 并且从每个基板朝向散热器的中心轴线延伸，以及连接在接收热负载的基板和至少一个其它基板之间的热传输，以便将热负载分布在散热器的基板中 。

公开(公告)号：US20070044310A1

公开(公告)日：2007-03-01

申请号：US11553491

申请日：2006-10-27

申请人： Robert Wolford ,  Jimmy Foster ,  Donna Hardee ,  Don Keener

发明人： Robert Wolford ,  Jimmy Foster ,  Donna Hardee ,  Don Keener

IPC分类号： B21D53/02

CPC分类号： F28F1/16 ,  F28D15/0233 ,  F28F2215/10 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49378 ,  Y10T29/49384 ,  H01L2924/00

摘要： A heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and runs (preferably) the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process. The interior fins provide additional conduction cooling to a heat transferring fluid circulating within the pipe.

摘要翻译： 用于冷却集成电路的热管。 热管包括通过挤出单片材料（例如导热金属）形成的管和径向翅片。 每个径向翅片远离管道延伸并且（优选地）延伸管道的长度。 每个径向翅片具有通常取向的亚烯烃，其向径向翅片提供额外的热对流表面区域。 在管内是内部翅片，也是在材料挤压过程中形成的。 内部翅片为在管道内循环的传热流体提供额外的传导冷却。

公开(公告)号：US20060113065A1

公开(公告)日：2006-06-01

申请号：US11000583

申请日：2004-12-01

申请人： Robert Wolford ,  Jimmy Foster ,  Donna Hardee ,  Don Keener

发明人： Robert Wolford ,  Jimmy Foster ,  Donna Hardee ,  Don Keener

IPC分类号： F28D15/00

CPC分类号： F28F1/16 ,  F28D15/0233 ,  F28F2215/10 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49378 ,  Y10T29/49384 ,  H01L2924/00

摘要： A heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and runs (preferably) the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process. The interior fins provide additional conduction cooling to a heat transferring fluid circulating within the pipe

摘要翻译： 用于冷却集成电路的热管。 热管包括通过挤出单片材料（例如导热金属）形成的管和径向翅片。 每个径向翅片远离管道延伸并且（优选地）延伸管道的长度。 每个径向翅片具有通常取向的亚烯烃，其向径向翅片提供额外的热对流表面区域。 在管内是内部翅片，也是在材料挤压过程中形成的。 内部翅片为在管道内循环的传热流体提供额外的传导冷却

公开(公告)号：US20070151706A1

公开(公告)日：2007-07-05

申请号：US11326565

申请日：2006-01-05

申请人： Jimmy Foster ,  Donna Hardee ,  Don Keener ,  Robert Wolford

发明人： Jimmy Foster ,  Donna Hardee ,  Don Keener ,  Robert Wolford

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F3/02 ,  F28F2275/025 ,  H01L21/4882 ,  H01L23/367 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for dissipating a thermal load is disclosed that includes one or more heat sink bases configured around a central axis of the heat sink so as to define an interior space, at least one heat sink base receiving the thermal load, a thermal transport connected to the at least one heat sink base receiving the thermal load so as to distribute the thermal load in the heat sink, and heat-dissipating fins connected to each heat sink base, the heat-dissipating fins extending from each heat sink base into the interior space of the heat sink, each heat-dissipating fin shaped according to the location of the heat-dissipating fin with respect to the location of the thermal load and the location of the distributed thermal load in the heat sink.

摘要翻译： 公开了一种用于耗散热负荷的散热器，其包括围绕散热器的中心轴线构造的一个或多个散热器基座，以便限定内部空间，至少一个容纳热负荷的散热器基座， 到所述至少一个散热器基座，其接收所述热负荷，以将散热器中的热负荷分配，以及连接到每个散热器基座的散热翅片，所述散热片从每个散热器基座延伸到内部 散热片的空间，每个散热翅片根据散热翅片的位置相对于热负荷的位置和分布式热负荷在散热器中的位置而成形。

公开(公告)号：US20060120043A1

公开(公告)日：2006-06-08

申请号：US11006247

申请日：2004-12-07

申请人： Robert Wolford ,  Donna Hardee ,  Jimmy Foster ,  Don Keener

发明人： Robert Wolford ,  Donna Hardee ,  Jimmy Foster ,  Don Keener

IPC分类号： H05K7/20

CPC分类号： H05K1/0272 ,  H05K1/144 ,  H05K7/20136 ,  H05K2201/09063

摘要： An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB containment housing. A second PCB is disposed above the first PCB within the housing to define a substantially enclosed upper chamber above the lower chamber. The second PCB includes one or more airflow apertures defined therethrough and providing vertical air flow coupling between the upper and lower chambers. An airflow actuating device is utilized to generate a primary forced airflow within the upper chamber which is substantially parallel to the surface plane of the second PCB. The primary forced airflow further induces a negative air pressure in the upper chamber such that a mixed convection airflow is established between the upper and lower chambers via the second PCB apertures.

摘要翻译： 用于冷却垂直堆叠的印刷电路板（PCB）的设备，系统和方法。 在一个实施例中，第一PCB布置在PCB容纳壳体内部的基本封闭的下室内。 第二PCB设置在壳体内的第一PCB上方，以在下腔室上限定基本封闭的上腔室。 第二PCB包括一个或多个通过其限定的气流孔，并且在上室和下室之间提供垂直的气流联接。 气流致动装置用于在上室内产生基本上平行于第二PCB表面的初级强制气流。 主要的强制气流进一步在上部室中引起负空气压力，使得经由第二PCB孔径在上部室和下部室之间建立混合的对流气流。

公开(公告)号：US20070151712A1

公开(公告)日：2007-07-05

申请号：US11326566

申请日：2006-01-05

申请人： Jimmy Foster ,  Donna Hardee ,  Don Keener ,  Robert Wolford

发明人： Jimmy Foster ,  Donna Hardee ,  Don Keener ,  Robert Wolford

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/42 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for distributing a thermal load is disclosed that includes a base receiving the thermal load, the base having a front surface, a back surface, an inner surface, and an outer surface, the outer surface shaped generally as a cylinder and having a flat mounting region, and the inner surface shaped as a cylinder so as to define a cylindrical receiving space, a cylindrical thermal transport connected to the inner surface of the base so as to distribute the thermal load along the inner surface of the base, and heat-dissipating fins connected to the cylindrical thermal transport and extending from the cylindrical thermal transport towards a central axis of the cylindrical receiving space.

摘要翻译： 公开了一种用于分配热负荷的散热器，其包括接收热负荷的基座，所述基座具有前表面，后表面，内表面和外表面，所述外表面大致为圆柱形，并且具有 平坦安装区域，内表面形状为圆筒形，以便限定圆柱形容纳空间，圆柱形热传输件连接到基座的内表面，以便沿着基座的内表面分布热负荷，并且加热 散热片连接到圆柱形热传输并从圆柱形热传输方向朝向圆柱形容纳空间的中心轴线延伸。

公开(公告)号：US20070119583A1

公开(公告)日：2007-05-31

申请号：US11289025

申请日：2005-11-29

申请人： Jimmy Foster ,  Donna Hardee ,  Don Keener ,  Robert Wolford

发明人： Jimmy Foster ,  Donna Hardee ,  Don Keener ,  Robert Wolford

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  F28D15/0233 ,  F28D15/0266 ,  F28F3/02 ,  H01L23/373 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for distributing a thermal load is disclosed that includes a bottom plate, a top plate, a right plate, and a left plate, the plates connected along edges so as to define a space generally cubical in shape with four closed sides and two open ends; heat-dissipating fins connected to each plate, the fins spaced apart in parallel and extending from each plate towards a central axis of the heat sink; and a thermal transport connected to the plate receiving the thermal load and to at least one of the other plates so as to distribute the thermal load among the plates of the heat sink.

摘要翻译： 公开了一种用于分配热负荷的散热器，其包括底板，顶板，右板和左板，所述板沿着边缘连接以便限定具有四个封闭侧面和两个侧面的大致立方体的空间 开放端 连接到每个板的散热翅片，翅片平行间隔开并从每个板向散热器的中心轴线延伸; 以及连接到接收热负荷的板的热传递和至少一个其它板以便将热负荷分布在散热片的板之间。

公开(公告)号：US20070141914A1

公开(公告)日：2007-06-21

申请号：US11306294

申请日：2005-12-21

申请人： Robert Wolford ,  Jonathan Duncan ,  Daniel Kelaher

发明人： Robert Wolford ,  Jonathan Duncan ,  Daniel Kelaher

IPC分类号： H01R24/00

CPC分类号： H01R12/721

摘要： A method, apparatus and system are disclosed for a Peripheral Component Interconnect (“PCI”) Express connection device that supports use of device bus widths different than the size of the connector in communication of data processing, addressing and/or control signals between electronic and/or computer devices. Specifically, a PCI Express connector is disclosed that allows installation of a PCI Express adapter having a larger bus width than that of the connector itself, by including an opening (or “notch”) in at least one end of the connector to physically accommodate the larger dimension(s) of the adapter.

摘要翻译： 公开了一种用于外围部件互连（“PCI”）Express连接装置的方法，装置和系统，该连接装置支持使用不同于连接器的尺寸的设备总线宽度，该数据处理，寻址和/或控制信号在电子和 /或计算机设备。 具体地，公开了一种PCI Express连接器，其允许安装具有比连接器本身更大的总线宽度的PCI Express适配器，通过在连接器的至少一端中包括开口（或“凹口”）以物理容纳 适配器尺寸较大。

公开(公告)号：US5765008A

公开(公告)日：1998-06-09

申请号：US708102

申请日：1996-08-08

申请人： Dhruv M. Desai ,  Bruce A. Smith ,  Robert Wolford ,  Akitoshi Katoh

发明人： Dhruv M. Desai ,  Bruce A. Smith ,  Robert Wolford ,  Akitoshi Katoh

IPC分类号： G06F13/40 ,  G06F13/00

CPC分类号： G06F13/409

摘要： A computer having a riser card with a riser card interface that connects to an industry standard system board and has slots for expansion cards is provided with support circuitry that enables the computer system to perform personalized functions not provided for by the industry standard system board, including security functions. The placing of the support circuitry on the riser card allows the use of an industry standard system board and the personalization of the system to perform different IBM PS/2 functions depending on the installed riser card, in conjunction with Micro Channel and PCI bus architecture.

摘要翻译： 具有连接到工业标准系统板并且具有用于扩展卡的插槽的具有转接卡接口的转接卡的计算机设置有支持电路，其使得计算机系统能够执行行业标准系统板未提供的个性化功能，包括 安全功能。 将支持电路放置在转接卡上允许使用工业标准系统板，并且根据安装的转接卡，结合Micro Channel和PCI总线架构，系统的个性化可执行不同的IBM PS / 2功能。

公开(公告)号：US20070050499A1

公开(公告)日：2007-03-01

申请号：US11216408

申请日：2005-08-31

申请人： William Atherton ,  Fernando Lopez ,  Robert Wolford

发明人： William Atherton ,  Fernando Lopez ,  Robert Wolford

IPC分类号： G06F15/173

CPC分类号： G06F11/3466 ,  G06F11/3438 ,  G06F11/348 ,  G06F2201/86

摘要： An apparatus, system, and method are disclosed for accessing system information. The apparatus includes an observation module, a monitoring module, and an action module. The observation module receives input device signals. The monitoring module recognizes selected inputs from among input data. The action module, working independently of the local system, selectively or automatically causes system information or action to be conveyed to a user.

摘要翻译： 公开了一种用于访问系统信息的装置，系统和方法。 该装置包括观察模块，监视模块和动作模块。 观察模块接收输入设备信号。 监控模块从输入数据中识别所选择的输入。 操作模块独立于本地系统工作，选择性地或自动地将系统信息或动作传达给用户。