Reducing backside deposition in a substrate processing apparatus through
the use of a shadow ring
    10.
    发明授权
    Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring 失效
    通过使用阴影环来减少衬底处理设备中的背面沉积

    公开(公告)号:US5476548A

    公开(公告)日:1995-12-19

    申请号:US263617

    申请日:1994-06-20

    摘要: A substrate processing apparatus for processing a substrate having a peripheral edge, an upper surface for processing and a lower surface lying on a support. The apparatus includes a processing chamber which houses the substrate support, in the form of a heater pedestal including a substrate receiving surface for receiving the lower surface of the substrate. A circumscribing shadow ring is located around the pedestal to cover peripheral edge portion of the substrate. The shadow ring also defines a cavity, between itself and the pedestal, at the peripheral edge of the substrate. In operation, the chamber receives processing gas at a first pressure and purge gas is introduced into the cavity, between the ring and the pedestal, at a second pressure which is greater than the first pressure. Fluid conduits are provided to enhance the flow of the purge gas away from the peripheral edge of the substrate.

    摘要翻译: 一种基板处理装置,用于处理具有外围边缘的基板,用于加工的上表面和位于支撑件上的下表面。 该设备包括处理室,该处理室以加热器底座的形式容纳衬底支撑件,该加热器基座包括用于接收衬底的下表面的衬底接收表面。 位于基座周围的外接阴影环覆盖基板的周边部分。 阴影环还在基板的周边边缘处限定了在其自身与基座之间的空腔。 在操作中,室以第一压力接收处理气体,并且净化气体以大于第一压力的第二压力被引入空腔中,在环和基座之间。 提供流体导管以增强净化气体远离衬底的周边边缘的流动。