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    METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD
    7.
    发明申请
    METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD 审中-公开
    制备化学机械抛光垫的复合抛光层的方法

    公开(公告)号：US20160375554A1

    公开(公告)日：2016-12-29

    申请号：US15163184

    申请日：2016-05-24

    申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. ,  Dow Global Technologies LLC

    发明人： Bainian Qian ,  Teresa Brugarolas Brufau ,  Julia Kozhukh ,  David Michael Veneziale ,  Yuhua Tong ,  Diego Lugo ,  George C. Jacob ,  Jeffrey B. Miller ,  Tony Quan Tran ,  Marc R. Stack ,  Andrew Wank ,  Jeffrey James Hendron

    IPC分类号： B24D18/00 ,  B24B37/04 ,  B24B53/017 ,  B24B37/24

    CPC分类号： B24D18/0009 ,  B24B37/044 ,  B24B37/24 ,  B24B53/017

    摘要： A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 5 to 1,000 m/sec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.

    摘要翻译： 提供一种形成化学机械抛光垫复合抛光层的方法，包括：提供具有多个周期性凹槽的第一连续非易失性聚合物相的第一抛光层组分; 以5〜1000m /秒的速度向第一研磨层成分排出组合，以组合填充多个周期性的凹部; 允许组合在多个周期性凹槽中固化，形成提供复合结构的第二非易失性聚合物相; 从所述复合结构导出所述化学机械抛光垫复合抛光层，其中所述化学机械抛光垫复合抛光层在所述第一抛光层组分的抛光侧上具有抛光表面; 并且其中所述抛光表面适于抛光衬底。

    METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD
    8.
    发明申请
    METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD 有权
    制备化学机械抛光垫的复合抛光层的方法

    公开(公告)号：US20160375552A1

    公开(公告)日：2016-12-29

    申请号：US14751410

    申请日：2015-06-26

    申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. ,  Dow Global Technologies LLC

    发明人： Bainian Qian ,  Teresa Brugarolas Brufau ,  Julia Kozhukh ,  David Michael Veneziale ,  Yuhua Tong ,  Diego Lugo ,  George C. Jacob ,  Jeffrey B. Miller ,  Tony Quan Tran ,  Marc R. Stack ,  Andrew Wank ,  Jeffrey James Hendron

    IPC分类号： B24D18/00 ,  B24B37/22 ,  B24B37/24

    CPC分类号： B24D18/00 ,  B24B37/22 ,  B24B37/24

    摘要： A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 10 to 300 msec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.

    摘要翻译： 提供一种形成化学机械抛光垫复合抛光层的方法，包括：提供具有多个周期性凹槽的第一连续非易失性聚合物相的第一抛光层组分; 以10〜300msec的速度向第一研磨层组分排出组合，用该组合填充多个周期性凹槽; 允许组合在多个周期性凹槽中固化，形成提供复合结构的第二非易失性聚合物相; 从所述复合结构导出所述化学机械抛光垫复合抛光层，其中所述化学机械抛光垫复合抛光层在所述第一抛光层组分的抛光侧上具有抛光表面; 并且其中所述抛光表面适于抛光衬底。