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14 条记录 (耗时 0.038 秒)

    Device for using in an electronic controller
    5.
    发明授权
    Device for using in an electronic controller 失效
    在电子控制器中使用的装置

    公开(公告)号：US5880935A

    公开(公告)日：1999-03-09

    申请号：US800950

    申请日：1997-02-14

    申请人： Thomas Wiesa ,  Ralph Schimitzek ,  Dieter Karr

    发明人： Thomas Wiesa ,  Ralph Schimitzek ,  Dieter Karr

    IPC分类号： H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36

    CPC分类号： H05K1/147 ,  H05K1/141 ,  H05K3/363 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/10666 ,  H05K3/284 ,  H05K3/341 ,  H05K3/4691 ,  Y10T29/49128

    摘要： A device, in particular for use in an electronic controller, includes a card rack and a subassembly. The device is manufactured by soldering over a large area the unpopulated back side of the subassembly to this card rack. The soldering can be performed using a reflow soldering process and can be automated, and thus suitable for mass production. The electrical connections of the subassembly are led spatially and electrically separately from the mechanical attachment of the subassembly to the card rack. The subassembly can be an additional component mounted on the card rack with a new additional function, so that the controller can be flexibly adapted to a given requirement profile in a simple manner by combining, in a flexible manner, a plurality of subassemblies with different layouts and modes of operation on the card rack.

    摘要翻译： 特别是用于电子控制器的装置包括卡架和子组件。 该装置是通过将大部分未组装的子组件的背面焊接到该卡架上来制造的。 焊接可以使用回流焊接工艺进行，并且可以自动化，因此适合于批量生产。 子组件的电气连接在空间上和电气上分开地从子组件的机械附件引导到卡架上。 子组件可以是安装在卡架上的附加部件，具有新的附加功能，使得通过以灵活的方式组合具有不同布局的多个子组件，控制器可以以简单的方式灵活地适应给定的需求简档 和卡架上的操作模式。

    HEAT DISSIPATION FROM A CONTROL UNIT
    6.
    发明申请
    HEAT DISSIPATION FROM A CONTROL UNIT 有权
    从控制单元散热

    公开(公告)号：US20110205711A1

    公开(公告)日：2011-08-25

    申请号：US13003749

    申请日：2009-06-17

    申请人： Andre Lischeck ,  Thomas Wiesa

    发明人： Andre Lischeck ,  Thomas Wiesa

    IPC分类号： H05K7/20 ,  H05K13/00

    CPC分类号： H05K7/20454 ,  H05K7/20854 ,  Y10T29/49002

    摘要： A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.

    摘要翻译： 控制单元，特别是用于机动车辆的控制单元，该控制单元具有壳体，该壳体具有至少一个散热区域，至少一个具有至少一个散热元件的电气和/或电子模块位于该散热区域中， 所述散热元件通过导热介质导热地连接到散热区域，所述导热介质至少在被引入时通过至少一个壳体开口被引入到所述壳体的内部并且具有糊状稠度。 还描述了用于制造控制单元的相应方法。

    Heat dissipation from a control unit
    7.
    发明授权
    Heat dissipation from a control unit 有权
    来自控制单元的散热

    公开(公告)号：US08885343B2

    公开(公告)日：2014-11-11

    申请号：US13003749

    申请日：2009-06-17

    申请人： Andre Lischeck ,  Thomas Wiesa

    发明人： Andre Lischeck ,  Thomas Wiesa

    IPC分类号： H05K7/20 ,  H05K1/00 ,  H01J5/00 ,  F28F7/00

    CPC分类号： H05K7/20454 ,  H05K7/20854 ,  Y10T29/49002

    摘要： A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.

    摘要翻译： 控制单元，特别是用于机动车辆的控制单元，该控制单元具有壳体，该壳体具有至少一个散热区域，至少一个具有至少一个散热元件的电气和/或电子模块位于该散热区域中， 所述散热元件通过导热介质导热地连接到散热区域，所述导热介质至少在被引入时通过至少一个壳体开口被引入到所述壳体的内部并且具有糊状稠度。 还描述了用于制造控制单元的相应方法。

    Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid
    9.
    发明授权
    Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid 失效
    用于对至少一个印刷电路板或至少一个压制屏幕和至少一个混合物进行金属化的方法

    公开(公告)号：US06197208B1

    公开(公告)日：2001-03-06

    申请号：US09214665

    申请日：1999-01-07

    申请人： Thomas Wiesa

    发明人： Thomas Wiesa

    IPC分类号： H05K336

    CPC分类号： H05K1/148 ,  H05K1/141 ,  H05K1/142 ,  H05K3/0041 ,  H05K3/361 ,  H05K3/363 ,  H05K3/4092 ,  H05K2201/0154

    摘要： A method for contacting at least one printed circuit board or at least one punched grid and at least one hybrid includes the steps of: forming contact elements in a contacting foil, positioning the contacting foil over the hybrid in such a way that the contact elements are arranged at preselected positions between the printed circuit traces of the hybrid and the printed circuit traces of the printed circuit board, and etching away at least a portion of the contacting foil, such that the contact elements are at least partially freely accessible.

    摘要翻译： 用于接触至少一个印刷电路板或至少一个冲孔格栅和至少一个混合物的方法包括以下步骤：在接触箔中形成接触元件，将接触箔定位在混合物上，使得接触元件为 布置在混合物的印刷电路迹线和印刷电路板的印刷电路迹线之间的预选位置处，并蚀刻掉接触箔的至少一部分，使得接触元件至少部分地可自由接近。