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公开(公告)号：US20120120613A1
公开(公告)日：2012-05-17
申请号：US13384502
申请日：2010-07-15
CPC分类号： H05K3/284 , H01L21/561 , H01L21/565 , H01L23/3121 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2924/01019 , H01L2924/3025 , H01L2924/3511 , H05K1/0218 , H05K1/0313 , H05K2203/1316
摘要： An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.
摘要翻译： 电子模块10包括：具有第一表面和与第一表面相对的第二表面的电路板12; 以及安装在其上的多个电子部件14。 电子部件14被密封在电路板12的第一表面，模具体16由树脂组合物构成。 屏蔽层28形成在模体16的表面上。包括在模体16中的树脂的玻璃化转变温度分别高于包括在电路板12和屏蔽层28中的树脂的玻璃化转变温度 。 模具体在25℃下的弹性模量为10〜18GPa，电路基板的厚度为0.3〜1.0mm。
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公开(公告)号：US08482931B2
公开(公告)日：2013-07-09
申请号：US12632270
申请日：2009-12-07
CPC分类号： H05K1/144 , H05K2201/042 , H05K2201/10189 , H05K2201/10515 , H05K2201/2036
摘要： A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.
摘要翻译： 封装结构包括：第一印刷线路板，其安装在顶表面上，多个电子部件包括至少一个第一电子部件，堆叠在第一印刷线路板的顶面侧的第二印刷线路板，以及多个 连接构件，用于机械地连接第一和第二印刷线路板，同时保持它们之间的恒定的间隙，所述连接构件包括用于将至少一个第一电子部件的顶表面接合到第二印刷线路板的底表面的第一固化树脂 。
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3.发明授权Surface mount adhesive, mounting structure including the same, and method for producing mounting structure 失效表面贴装粘合剂，包括其的安装结构以及安装结构的制造方法公开(公告)号：US08481629B2
公开(公告)日：2013-07-09
申请号：US12431303
申请日：2009-04-28
CPC分类号： H05K3/305 , C08K3/34 , C09J163/00 , H05K2201/0209 , H05K2201/0266 , H05K2201/10689 , Y02P70/613
摘要： A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 μm, and the second filler has a largest particle size of 1 to 100 μm, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of 2 to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.
摘要翻译： 表面贴装粘合剂包括环氧树脂，固化剂，促进剂，第一填料和第二填料。 第二填料的比重为第一填料的比重为1.1〜3倍，第二填料的硬度比第一填料的硬度高。 第一填料的最大粒度为1-100μm，第二填料的最大粒径为1-100μm，比重为1.7〜4.5，修饰的莫氏硬度为2〜12。重量比 的第一填料与第二填料的比例为1:3至3:1，表面粘合剂的比重为1.2至1.5。 当表面贴装粘合剂被分配时，抑制分配故障，并提高分配稳定性。
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公开(公告)号：US09072204B2
公开(公告)日：2015-06-30
申请号：US13384502
申请日：2010-07-15
CPC分类号： H05K3/284 , H01L21/561 , H01L21/565 , H01L23/3121 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2924/01019 , H01L2924/3025 , H01L2924/3511 , H05K1/0218 , H05K1/0313 , H05K2203/1316
摘要： An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.
摘要翻译： 电子模块10包括：具有第一表面和与第一表面相对的第二表面的电路板12; 以及安装在其上的多个电子部件14。 电子部件14被密封在电路板12的第一表面，模具体16由树脂组合物构成。 屏蔽层28形成在模体16的表面上。包括在模体16中的树脂的玻璃化转变温度分别高于包括在电路板12和屏蔽层28中的树脂的玻璃化转变温度 。 模具体在25℃下的弹性模量为10〜18GPa，电路基板的厚度为0.3〜1.0mm。
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公开(公告)号：US20100159719A1
公开(公告)日：2010-06-24
申请号：US12632270
申请日：2009-12-07
IPC分类号： H01R12/00
CPC分类号： H05K1/144 , H05K2201/042 , H05K2201/10189 , H05K2201/10515 , H05K2201/2036
摘要： A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.
摘要翻译： 封装结构包括：第一印刷线路板，其安装在顶表面上，多个电子部件包括至少一个第一电子部件，堆叠在第一印刷线路板的顶面侧的第二印刷线路板，以及多个 连接构件，用于机械地连接第一和第二印刷线路板，同时保持它们之间的恒定的间隙，所述连接构件包括用于将至少一个第一电子部件的顶表面接合到第二印刷线路板的底表面的第一固化树脂 。
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6.发明授权Electrically conductive paste, and electrical and electronic device comprising the same 有权导电膏，以及包含该导电膏的电气和电子设备公开(公告)号：US08540903B2
公开(公告)日：2013-09-24
申请号：US12744994
申请日：2008-11-21
CPC分类号： H05K3/321 , H01B1/22 , H05K2201/0272 , H05K2203/0425 , Y10T29/49128 , Y10T29/4913
摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
摘要翻译： 公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部形成的导电路径中的空隙生长水平降低， 其含有减少量的粘度调节/触变性添加剂。 选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。
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公开(公告)号：US08410377B2
公开(公告)日：2013-04-02
申请号：US12260219
申请日：2008-10-29
IPC分类号： H01L23/28
CPC分类号： H05K3/3484 , B23K35/264 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/284 , H05K3/321 , H05K3/3463 , H01L2924/3512 , H01L2924/00
摘要： A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.
摘要翻译： 多个半导体元件通过熔点为200℃以下的焊料相邻地安装在基板上，除了半导体元件之外的电子部件通过焊料与相邻安装的半导体元件之间的基板安装在基板上 熔点为200℃以下，多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子部件之间的空间与成形树脂一体成型 。
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公开(公告)号：US08217275B2
公开(公告)日：2012-07-10
申请号：US12517311
申请日：2007-12-03
IPC分类号： H05K1/00
CPC分类号： H01L21/563 , C08G59/4021 , C08L63/00 , C09K3/10 , C09K2200/0645 , C09K2200/0647 , C09K2200/065 , H01L23/293 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , Y02P20/582 , Y10T29/4913 , Y10T29/49146 , Y10T29/49726 , H01L2924/00
摘要： A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ΔE/ΔT in a range of from 0.5 MPa/° C. to 30 MPa/° C. wherein ΔE/ΔT represents a ratio of change (ΔE) in storage elastic modulus (E) relative to a temperature change (ΔT) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material.
摘要翻译： 提供了一种密封材料，其在将电子部件安装在基板上时具有低应力和高可靠性的密封特性，并且在密封之后具有良好的可维修性。 密封材料含有热固性树脂组分，其特征在于：在0.5MPa /℃至30MPa /℃的范围内，其中＆Dgr; E /＆Dgr; T表示比例 的变化（＆Dgr; E）相对于温度变化（＆Dgr; T）的储存弹性模量（E），当储存弹性模量（E）在包括玻璃化转变点（Tg） ）固化的密封材料。
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9.发明授权公开(公告)号：US08205327B2
公开(公告)日：2012-06-26
申请号：US12094219
申请日：2006-11-13
IPC分类号： H05K3/30
CPC分类号： H05K3/323 , H05K3/321 , Y10T29/49114 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165
摘要： A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.
摘要翻译： 一种制造其上安装有电子部件的电路板的方法至少包括以下步骤：（a）将包含分散在其中的导电粒子的液体光聚合性粘合剂供应到印刷电路板的表面上，以形成粘合剂层 板表面; （b）用紫外线照射光聚合性粘合剂变成凝胶，以提供粘合剂层的粘附性; 以及（c）从粘合剂层的上表面侧将电子部件压靠在印刷基板的部件安装部上，形成电子部件与部件安装部之间的电连接，在该方法中， 可聚合粘合剂是延迟的反应性粘合剂。
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公开(公告)号：US20110095423A1
公开(公告)日：2011-04-28
申请号：US13000391
申请日：2009-10-27
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L23/49894 , H01L21/563 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/10126 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13566 , H01L2224/16058 , H01L2224/16225 , H01L2224/73203 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3452 , H05K3/3463 , H05K3/3484 , H05K2201/10977 , H05K2201/10992 , Y02P70/613 , H01L2924/01083 , H01L2924/00014 , H01L2924/0105
摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.
摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块和第二电极之间的多个接合部件 第二电极，经由凸块将第一电极与第二电极电连接;以及多个加强树脂部件，分别位于接合部件周围，以至少覆盖接合部件和接合部件与凸块之间的接合区域。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。
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