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    ELECTRONIC MODULE AND PRODUCTION METHOD THEREFOR
    2.
    发明申请
    ELECTRONIC MODULE AND PRODUCTION METHOD THEREFOR 有权
    电子模块及其生产方法

    公开(公告)号：US20120120613A1

    公开(公告)日：2012-05-17

    申请号：US13384502

    申请日：2010-07-15

    申请人： Ryo Kuwabara ,  Atsushi Yamaguchi ,  Masahiro Ono ,  Hidenori Miyakawa

    发明人： Ryo Kuwabara ,  Atsushi Yamaguchi ,  Masahiro Ono ,  Hidenori Miyakawa

    IPC分类号： H05K7/00 ,  H05K3/32

    CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/552 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0218 ,  H05K1/0313 ,  H05K2203/1316

    摘要： An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.

    摘要翻译： 电子模块10包括：具有第一表面和与第一表面相对的第二表面的电路板12; 以及安装在其上的多个电子部件14。 电子部件14被密封在电路板12的第一表面，模具体16由树脂组合物构成。 屏蔽层28形成在模体16的表面上。包括在模体16中的树脂的玻璃化转变温度分别高于包括在电路板12和屏蔽层28中的树脂的玻璃化转变温度 。 模具体在25℃下的弹性模量为10〜18GPa，电路基板的厚度为0.3〜1.0mm。

    SECONDARY BATTERY UNIT
    3.
    发明申请
    SECONDARY BATTERY UNIT 审中-公开
    二次电池组

    公开(公告)号：US20130344369A1

    公开(公告)日：2013-12-26

    申请号：US14003269

    申请日：2012-10-29

    申请人： Hidenori Miyakawa ,  Masahiro Ono ,  Tsuyoshi Nomura

    发明人： Hidenori Miyakawa ,  Masahiro Ono ,  Tsuyoshi Nomura

    IPC分类号： H01M10/50

    CPC分类号： H01M10/663 ,  H01M2/1077 ,  H01M2/1083 ,  H01M2/1094 ,  H01M10/625 ,  H01M10/627 ,  H01M10/653 ,  H01M10/6551 ,  H01M10/6554 ,  H01M10/6567 ,  H01M10/6571 ,  H01M10/658

    摘要： A secondary battery unit arranged within a heat source unit that is internally provided with a heat source. The secondary battery unit comprises: a secondary battery; a heat transfer material layer which is arranged so as to contact the outer peripheral surface of the secondary battery; a heating device which is arranged to heat the secondary battery with the heat transfer material layer therebetween; a heat insulation material layer which is arranged on the outer peripheries of the heat transfer material layer and the heating device so as to face the heat source and which has a lower thermal conductivity and a shorter length than the heat transfer material layer; and a heat dissipation part which contacts the heat transfer material layer and an external heat dissipation part of the heat source unit and dissipates the heat from the secondary battery to the outside of the heat source unit.

    摘要翻译： 布置在内部设置有热源的热源单元内的二次电池单元。 二次电池单元包括：二次电池; 布置成与二次电池的外周表面接触的传热材料层; 加热装置，其设置成在其间具有传热材料层来加热二次电池; 绝热材料层，其布置在传热材料层的外周和加热装置上，以面对热源并且具有比传热材料层更低的导热性和更短的长度; 以及与传热材料层接触的散热部和热源单元的外部散热部，将来自二次电池的热量散发到热源单元的外部。

    Switching fluorescent nanoparticle probe and fluorescent particle imaging method using same
    5.
    发明授权
    Switching fluorescent nanoparticle probe and fluorescent particle imaging method using same 有权
    开关荧光纳米粒子探针和荧光颗粒成像方法使用相同

    公开(公告)号：US09370589B2

    公开(公告)日：2016-06-21

    申请号：US13818392

    申请日：2011-08-08

    申请人： Isao Hara ,  Eiichi Ozeki ,  Hideo Saji ,  Shunsaku Kimura ,  Masahiro Ono ,  Takashi Temma

    发明人： Isao Hara ,  Eiichi Ozeki ,  Hideo Saji ,  Shunsaku Kimura ,  Masahiro Ono ,  Takashi Temma

    IPC分类号： A61K9/14 ,  A61K49/00

    CPC分类号： A61K49/0089 ,  A61K49/0032 ,  A61K49/0093 ,  Y10S977/773 ,  Y10S977/927

    摘要： The present invention provides a novel fluorescent nanoparticle imaging probe having a switching function (a function to quench a fluorescent dye during nanoparticle preparation, and emit fluorescence during imaging). A switching fluorescent nanoparticle probe comprising: a molecular assembly composed of an amphiphilic block polymer having a hydrophilic block chain and a hydrophobic block chain; and a fluorescent dye encapsulated in the molecular assembly, wherein (a) the hydrophilic block chain comprises, as an essential hydrophilic structural unit, a unit selected from a sarcosine unit and an alkylene oxide unit, (b) the hydrophobic block chain comprises, as an essential hydrophobic structural unit, a unit selected from the group consisting of an amino acid unit and a hydroxylic acid unit, and (c) the fluorescent dye is a cyanine compound represented by the formula (I): and two or more molecules of the fluorescent dye are encapsulated in the single molecular assembly.

    摘要翻译： 本发明提供了具有开关功能（在纳米颗粒制备期间淬灭荧光染料并在成像期间发射荧光的功能）的新型荧光纳米颗粒成像探针。 一种开关荧光纳米颗粒探针，包括：由具有亲水嵌段链和疏水性嵌段链的两亲嵌段聚合物组成的分子组合; 以及包封在分子组合中的荧光染料，其中（a）所述亲水性嵌段链包含作为必需亲水性结构单元的选自肌氨酸单元和烯化氧单元的单元，（b）所述疏水性嵌段链包含： 必需的疏水结构单元，选自氨基酸单元和羟基酸单元的单元，和（c）荧光染料是由式（I）表示的花青化合物：和 荧光染料被封装在单分子组装中。

    CONNECTOR
    6.
    发明申请
    CONNECTOR 有权
    连接器

    公开(公告)号：US20140302724A1

    公开(公告)日：2014-10-09

    申请号：US14123285

    申请日：2012-03-14

    申请人： Masahiro Ono

    发明人： Masahiro Ono

    IPC分类号： H01R13/42

    CPC分类号： H01R13/42 ,  H01R13/4364 ,  H01R13/502 ,  H01R24/86

    摘要： A connector, including a plug terminal of a plug connected to a first electric signal line and inserted in a terminal hole of a plug body, a socket terminal of a socket connected to a second electric signal line and inserted in a terminal hole of a socket body, a plug holder of the plug, and a socket holder of the socket, where the plug holder and the socket holder are connected to each other, where the plug terminal is press fitted in and electrically connected to the socket terminal, where a position in an axial center direction is controlled by sandwiching one end portion of at least one of the plug terminal and the socket terminal between the body and a terminal holder made of an insulating material.

    摘要翻译： 一种连接器，包括连接到第一电信号线并插入插头主体的端子孔中的插头的插头端子，插座的插座端子连接到第二电信号线并插入插座的端子孔中 主体，插头的插头座和插座的插座座，其中插头保持器和插座保持器彼此连接，其中插头端子被压配合并电连接到插座端子，其中位置 通过将插头端子和插座端子中的至少一个的一个端部夹在主体和由绝缘材料制成的端子座之间来控制轴向中心方向。

    Packet scheduling method and apparatus for downlink transmission to mobile terminals
    9.
    发明授权
    Packet scheduling method and apparatus for downlink transmission to mobile terminals 有权
    用于下行链路传输到移动终端的分组调度方法和装置

    公开(公告)号：US07697567B2

    公开(公告)日：2010-04-13

    申请号：US10345311

    申请日：2003-01-16

    申请人： Masahiro Ono ,  Yasuhiko Matsunaga

    发明人： Masahiro Ono ,  Yasuhiko Matsunaga

    IPC分类号： H04J3/16

    CPC分类号： H04W28/14 ,  H04L47/10 ,  H04L47/14 ,  H04L47/2441 ,  H04L47/41 ,  H04L47/50 ,  H04L47/6215 ,  H04L47/626

    摘要： In a packet repeater of a wireless base station, a packet analyzer receives uplink packets from mobile terminals and stores data indicating quality of each wireless link between the base station and each mobile terminal in a memory. A packet sorter receives downlink packets from a network and stores the received packets into buffers according to the destinations of downlink packets and their service classes. According to the data stored in the memory, packets in the buffers are into a first group of queues in which quality of service is not satisfied and a second group of queues in which quality of service is satisfied. A packet scheduler sequentially transmits all packets from the first-group queues to mobile terminals, and reorders the second-group queues in a descending order of their qualities of wireless links and sequentially transmits all packets from the reordered queues to the mobile terminals.

    摘要翻译： 在无线基站的分组中继器中，分组分析器从移动终端接收上行分组，并存储表示基站与每个移动终端之间的每个无线链路的质量的数据。 分组排序器从网络接收下行链路分组，并根据下行链路分组的目的地及其服务类别将接收的分组存储到缓冲器中。 根据存储在存储器中的数据，缓冲器中的数据包进入不满足服务质量的第一组队列和满足服务质量的第二组队列。 分组调度器顺序地将所有分组从第一组队列发送到移动终端，并且以其无线链路的质量的降序重新排序第二组队列，并且将所有分组从重新排序的队列顺序地发送到移动终端。

    BOARD STRUCTURE AND ELECTRONIC DEVICE
    10.
    发明申请
    BOARD STRUCTURE AND ELECTRONIC DEVICE 审中-公开
    板结构和电子设备

    公开(公告)号：US20100044100A1

    公开(公告)日：2010-02-25

    申请号：US12065042

    申请日：2006-08-03

    申请人： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

    发明人： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

    IPC分类号： H01L23/28

    CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K7/20463 ,  H05K9/0083 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018 ,  H01L2224/0401

    摘要： A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided.A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.

    摘要翻译： 具有通过一次操作涂覆多个电子部件的树脂部件的基板结构被确定，并且确保了电子部件相对于基板的安装强度，并且提供了包括该基板结构的电子设备。 基板结构10包括基板11，沿着基板11安装的多个电子部件12以及与基板11保持紧密接触的，用树脂18涂覆各电子部件12的树脂部13。 同时保持与基板11紧密接触的每个电子部件12的框体15和封闭框体15中的开口16的盖部17，并且树脂18填充在框体15的内部。