Display panel including a light control layer and a capping layer

    公开(公告)号:US11574962B2

    公开(公告)日:2023-02-07

    申请号:US17022598

    申请日:2020-09-16

    Abstract: A display panel and a manufacturing method of a display panel are provided. A display panel includes: a base substrate in which a pixel area and a peripheral area adjacent to the pixel area are defined; a light emitting element located on the base substrate to overlap the pixel area, and configured to generate first light; a light control layer on the light emitting element; a color filter layer on the light control layer; and a capping layer contacting at least the light control layer and including silicon oxynitride (SiON), and the capping layer contains about 34 at % to about 41 at % of oxygen, and about 18 at % to about 25 at % of nitrogen. Luminous efficiency of the display panel may be increased while maintaining durability of the display panel.

    Display panel
    6.
    发明授权

    公开(公告)号:US11522035B2

    公开(公告)日:2022-12-06

    申请号:US16929830

    申请日:2020-07-15

    Abstract: A display panel includes a base layer, a circuit layer, a light emitting element, a pixel defining film, an encapsulation layer, and a first dam. The base layer may include a display area and a non-display area adjacent to the display area. The encapsulation layer may include a first inorganic film, an organic film, and a second inorganic film. The first dam may be disposed between the first inorganic film and the second inorganic film, and outside the organic film. The first dam may overlap the non-display area and the pixel defining film on a plane. Therefore, in the display panel of an embodiment, the non-display area may be reduced.

    DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20180287085A1

    公开(公告)日:2018-10-04

    申请号:US15846015

    申请日:2017-12-18

    Abstract: A display device includes a organic light emitting device and an encapsulation structure disposed on the organic light emitting device that seals the organic light emitting device. The encapsulation structure includes a first inorganic encapsulation layer disposed on the organic light emitting device, an organic layer disposed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer disposed on the organic layer. The organic layer includes a first organic layer disposed on the first inorganic encapsulation layer and a second organic layer disposed on the first organic layer. An atomic ratio of carbon to silicon in the first organic layer is less than an atomic ratio of carbon to silicon in the second organic layer.

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