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公开(公告)号：US12004296B2
公开(公告)日：2024-06-04
申请号：US17712327
申请日：2022-04-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Uk Lee , Chi Won Hwang , Eun Sun Kim , Yong Wan Ji , Young Hun You
CPC classification number: H05K1/115 , H05K1/0218 , H05K1/0265 , H05K1/0298 , H05K2201/0191 , H05K2201/096
Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.
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公开(公告)号：US11758657B2
公开(公告)日：2023-09-12
申请号：US17475747
申请日：2021-09-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Eun Sun Kim , Jin Uk Lee , Young Hun You
Abstract: A printed circuit board includes a first insulating layer; a first wiring layer disposed on one surface of the first insulating layer and including a pad; a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer; a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern; a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer. The cavity includes a non-through groove in the one surface of the first insulating layer.
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公开(公告)号：US20230141270A1
公开(公告)日：2023-05-11
申请号：US17691772
申请日：2022-03-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chi Seong Kim , Won Seok Lee , Guh Hwan Lim , Jin Uk Lee , Jin Oh Park
CPC classification number: H05K1/119 , H05K1/183 , H05K3/0038 , H05K3/0044 , H05K3/0035 , H05K2201/09854 , H05K2201/09827
Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
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公开(公告)号：US09519366B2
公开(公告)日：2016-12-13
申请号：US14273459
申请日：2014-05-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jang Ho Park , Woon Chun Kim , Jin Uk Lee , Nam Keun Oh
CPC classification number: G06F3/041 , G06F3/044 , G06F3/045 , G06F2203/04103 , G06F2203/04112
Abstract: A touch sensor includes a transparent substrate, and an electrode pattern formed on the transparent substrate. The electrode pattern is formed by stacking at least two or more electrode layers, thereby enhancing the anti-corrosion and visibility of electrode patterns and ensuring the adhesive reliability of the transparent substrate and the electrode patterns.
Abstract translation: 触摸传感器包括透明基板和形成在透明基板上的电极图案。 通过层叠至少两个以上的电极层来形成电极图案，从而提高电极图案的防腐蚀和可视性，并确保透明基板和电极图案的粘合可靠性。
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公开(公告)号：US20140184936A1
公开(公告)日：2014-07-03
申请号：US13845486
申请日：2013-03-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Hwan Oh , Jin Uk Lee
IPC: G02F1/1333
CPC classification number: G06F3/044 , G02F1/133707 , G02F1/134336 , G06F2203/04103 , G06F2203/04112
Abstract: Disclosed herein is a touch panel. In the touch panel, electrode patterns included in the touch panel may be orthogonal to each other in an intersecting point, and formed of a combination of unit patterns having a bent straight line shape. Accordingly, it is possible to prevent a contact area of the electrode patterns that intersect in the intersecting point from being increasing, thereby reducing visibility of the electrode pattern.
Abstract translation: 这里公开了触摸面板。 在触摸面板中，包括在触摸面板中的电极图案可以在交叉点处彼此正交，并且由具有弯曲直线形状的单元图案的组合形成。 因此，可以防止在交叉点相交的电极图案的接触面积增加，从而降低电极图案的可视性。
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Patent Agency Ranking
公开(公告)号：US20130186679A1
公开(公告)日：2013-07-25
申请号：US13735813
申请日：2013-01-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Uk Lee , Woo Jin Lee , Dong Hwan Lee
CPC classification number: H05K3/4038 , H05K1/115 , H05K3/403
Abstract: The multilayer wiring structure includes: a substrate; a connection hole formed to pass through one surface and another surface of the substrate; and electrode wirings formed on the substrate, wherein the electrode wirings includes: a plurality of first wirings formed on one surface of the substrate; a plurality of second wirings formed on another surface of the substrate; and a plurality of connection wirings formed on an inner surface of the connection hole and electrically connecting the plurality of first wirings and the plurality of second wirings, respectively.
Abstract translation: 多层布线结构包括：基板; 形成为穿过基板的一个表面和另一个表面的连接孔; 以及形成在所述基板上的电极布线，其中所述电极布线包括：形成在所述基板的一个表面上的多个第一布线; 形成在所述基板的另一表面上的多个第二布线; 以及形成在所述连接孔的内表面上并分别电连接所述多个第一配线和所述多个第二配线的多个连接配线。
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公开(公告)号：US12262470B2
公开(公告)日：2025-03-25
申请号：US17578864
申请日：2022-01-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Uk Lee , Chi Won Hwang , Eun Sun Kim , Yong Wan Ji
Abstract: A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.
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公开(公告)号：US11903129B2
公开(公告)日：2024-02-13
申请号：US17691772
申请日：2022-03-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chi Seong Kim , Won Seok Lee , Guh Hwan Lim , Jin Uk Lee , Jin Oh Park
CPC classification number: H05K1/119 , H05K1/183 , H05K3/0035 , H05K3/0038 , H05K3/0044 , H05K2201/09827 , H05K2201/09854
Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
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公开(公告)号：US20220322533A1
公开(公告)日：2022-10-06
申请号：US17476980
申请日：2021-09-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Eun Sun Kim , Jin Uk Lee , Young Hun You , Chi Seong Kim
Abstract: A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.
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公开(公告)号：US11348722B2
公开(公告)日：2022-05-31
申请号：US16281801
申请日：2019-02-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Hun Kim , Jin Uk Lee
Abstract: A coil component includes a body; an internal insulating layer buried in the body; insulating walls disposed on the internal insulating layer, and including openings each having a planar coil shape having at least one turn; coil patterns including first conductive layers disposed in the openings, and second conductive layers disposed between the first conductive layers and internal surfaces of the openings, and each having a first surface in contact with the internal insulating layer and a second surface opposing the first surface; and a recessed portion formed on the second surface of each of the coil patterns and exposing at least portions of the openings of the internal walls.
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