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公开(公告)号:US20210320077A1
公开(公告)日:2021-10-14
申请号:US17108140
申请日:2020-12-01
发明人: JUBIN SEO , SUJEONG PARK , KWANGJIN MOON , MYUNGJOO PARK
IPC分类号: H01L23/00
摘要: Disclosed is a semiconductor device comprising a semiconductor substrate, an under-bump pattern on the semiconductor substrate and including a first metal, a bump pattern on the under-bump pattern, and an organic dielectric layer on the semiconductor substrate and in contact with a sidewall of the bump pattern. The bump pattern includes a support pattern in contact with the under-bump pattern and having a first width, and a solder pillar pattern on the support pattern and having a second width. The first width is greater than the second width. The support pattern includes at least one of a solder material and an intermetallic compound (IMC). The intermetallic compound includes the first metal and the solder material.
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公开(公告)号:US20220199469A1
公开(公告)日:2022-06-23
申请号:US17691178
申请日:2022-03-10
发明人: YI KOAN HONG , TAESEONG KIM , KWANGJIN MOON
IPC分类号: H01L21/768 , H01L21/02
摘要: Disclosed are semiconductor devices including through vias and methods of fabricating the same. The methods may include forming a first structure including a metal pattern and a second structure on the first structure. The metal pattern includes an upper surface facing the second structure. The methods may also include etching the second structure to form a via hole exposing the metal pattern, oxidizing a first etch residue in the via hole to convert the first etch residue into an oxidized first etch residue, and removing the oxidized first etch residue. After removing the oxidized first etch residue, the upper surface of the metal pattern may include a first portion that includes a recess and has a first surface roughness and a second portion that is different from the first portion and has a second surface roughness. The first surface roughness may be greater than the second surface roughness.
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公开(公告)号:US20200098599A1
公开(公告)日:2020-03-26
申请号:US16397552
申请日:2019-04-29
发明人: TAEYEONG KIM , MINSOO HAN , JUN HYUNG KIM , HOONJOO NA , KWANGJIN MOON
IPC分类号: H01L21/67 , H01L21/683 , H01L21/687
摘要: A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.
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公开(公告)号:US20220037236A1
公开(公告)日:2022-02-03
申请号:US17316970
申请日:2021-05-11
发明人: JUBIN SEO , KWANGJIN MOON , KUNSANG PARK , MYUNGJOO PARK , SUJEONG PARK , JAEWON HWANG
IPC分类号: H01L23/48 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/065 , H01L23/522 , H01L23/532 , H01L23/528
摘要: A semiconductor device includes a semiconductor substrate having a first surface and a second surface, which are opposite to each other, an active pattern protruding from the first surface of the semiconductor substrate, the active pattern including a source/drain region, a power rail electrically connected to the source/drain region, a power delivery network disposed on the second surface of the semiconductor substrate, and a penetration via structure penetrating the semiconductor substrate and electrically connected to the power rail and the power delivery network. The penetration via structure includes a first conductive pattern electrically connected to the power rail and a second conductive pattern electrically connected to the power delivery network. The first conductive pattern includes a material different from the second conductive pattern.
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公开(公告)号:US20210351112A1
公开(公告)日:2021-11-11
申请号:US17381287
申请日:2021-07-21
发明人: MYUNGJOO PARK , JAEWON HWANG , KWANGJIN MOON , KUNSANG PARK
IPC分类号: H01L23/48 , H01L23/538 , H01L21/48 , H01L23/00
摘要: A semiconductor device and a method of manufacturing the semiconductor device are disclosed. The semiconductor device includes a substrate, a first through substrate via configured to penetrate at least partially through the substrate, the first through substrate via having a first aspect ratio, and a second through substrate via configured to penetrate at least partially through the substrate. The second through substrate via has a second aspect ratio greater than the first aspect ratio, and each of the first through substrate via and the second through substrate via includes a first conductive layer and a second conductive layer. A thickness in a vertical direction of the first conductive layer of the first through substrate via is less than a thickness in the vertical direction of the first conductive layer of the second through substrate via.
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公开(公告)号:US20170358545A1
公开(公告)日:2017-12-14
申请号:US15440621
申请日:2017-02-23
发明人: JU-IL CHOI , HYOJU KIM , KWANGJIN MOON , SUJEONG PARK , JUBIN SEO , NAEIN LEE , HO-JIN LEE
IPC分类号: H01L23/00
CPC分类号: H01L24/13 , H01L24/05 , H01L24/11 , H01L2224/0345 , H01L2224/0401 , H01L2224/05022 , H01L2224/05564 , H01L2224/05572 , H01L2224/05582 , H01L2224/05647 , H01L2224/1146 , H01L2224/11462 , H01L2224/1147 , H01L2224/11614 , H01L2224/11849 , H01L2224/13007 , H01L2224/13017 , H01L2224/13018 , H01L2224/13026 , H01L2224/1308 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/16146 , H01L2224/16237 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
摘要: A pad is disposed on a substrate. A bump structure is disposed on the pad and electrically connected to the pad. The bump structure includes a first copper layer and a second copper layer sequentially stacked on the pad and a solder ball on the second copper layer. A first X-ray diffraction (XRD) peak intensity ratio of (111) plane to (200) plane of the first copper layer is greater than a second XRD peak intensity ratio of (111) plane to (200) plane of the second copper layer.
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公开(公告)号:US20200381301A1
公开(公告)日:2020-12-03
申请号:US16734456
申请日:2020-01-06
发明人: YI KOAN HONG , TAESEONG KIM , KWANGJIN MOON
IPC分类号: H01L21/768 , H01L21/02
摘要: Disclosed are semiconductor devices including through vias and methods of fabricating the same. The methods may include forming a first structure including a metal pattern and a second structure on the first structure. The metal pattern includes an upper surface facing the second structure. The methods may also include etching the second structure to form a via hole exposing the metal pattern, oxidizing a first etch residue in the via hole to convert the first etch residue into an oxidized first etch residue, and removing the oxidized first etch residue. After removing the oxidized first etch residue, the upper surface of the metal pattern may include a first portion that includes a recess and has a first surface roughness and a second portion that is different from the first portion and has a second surface roughness. The first surface roughness may be greater than the second surface roughness.
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