-
公开(公告)号:US11598863B2
公开(公告)日:2023-03-07
申请号:US17476879
申请日:2021-09-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Myeonggyun Kye , Seungchul Shin , Minsun Keel
IPC: G01S7/486 , G01S7/4865 , H04N5/369 , H04N5/376 , H04N5/378
Abstract: An imaging device includes a light source configured to operate by a light control signal having a first duty ratio; a pixel array in which a plurality of pixels are disposed, each of the plurality of pixels including a photodiode for generating electrical charges in response to a light reception signal output by the light source and reflected from a subject, and a pixel circuit for outputting a pixel signal corresponding to electrical charges of the photodiode; and a logic circuit configured to generate raw data for generating a depth image using the pixel signal, wherein the logic circuit inputs a photo control signal having a second duty ratio to the pixel circuit connected to the photodiode in each of the plurality of pixels, and wherein the first duty ratio is not an integer multiple of the second duty ratio.
-
公开(公告)号:US12244942B2
公开(公告)日:2025-03-04
申请号:US17720883
申请日:2022-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Myeonggyun Kye , Kyumin Kyung , Minsun Keel , Seungchul Shin
IPC: H04N25/42 , G01B11/22 , H04N25/46 , H04N25/50 , H04N25/705 , H04N25/75 , H04N25/772
Abstract: A depth sensor for measuring a distance to an object and an image signal processor configured to change a binning mode based on ambient light are provided. A method for operating a depth sensor for measuring a distance to an object includes outputting a pixel signal from at least one depth pixel included in a pixel array, generating ambient light information based on an intensity of ambient light outside the depth sensor, the intensity of the ambient light being measured using the pixel signal, and setting a binning mode of the depth sensor to an analog binning mode or a digital binning mode based on the ambient light parameter value.
-
公开(公告)号:US20240072084A1
公开(公告)日:2024-02-29
申请号:US18137684
申请日:2023-04-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngjae Choi , Sungho Suh , Minsun Keel
IPC: H01L27/146
CPC classification number: H01L27/14618 , H01L27/14603 , H01L27/14632 , H01L27/14636
Abstract: Provided are an image sensor package with improved reliability and a method of fabricating the same. The image sensor package includes: a package substrate; an image sensor chip provided on the package substrate, and including a pixel area and a peripheral area surrounding the pixel area; a dam in the peripheral area, the dam having a rectangular ring shape and surrounding the pixel area; a transparent cover provided on the dam and covering an upper portion of the image sensor chip; and a sealing material sealing the image sensor chip and covering side surfaces of the transparent cover. The dam includes a stress relaxation layer (SRL) and a body layer on the SRL, and the SRL has a lower viscosity than a viscosity of the body layer.
-
公开(公告)号:US11818484B2
公开(公告)日:2023-11-14
申请号:US17381777
申请日:2021-07-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bumsik Chung , Minsun Keel , Myoungoh Ki , Daeyun Kim
CPC classification number: H04N25/75 , G01S7/4808 , G01S17/26 , G01S17/89 , H04N23/80 , H04N25/40 , H04N25/745
Abstract: An imaging device includes a light source operated by an optical control signal generated using a first reference signal having a first frequency and a second reference signal, having a second frequency different from the first frequency, a plurality of pixels, each of the plurality of pixels including a pixel circuit outputting a pixel signal corresponding to the electrical charge of a photodiode, and a logic circuit configured to generate raw data to generate a depth image, using the pixel signal. The plurality of pixels include first pixels and second pixels, and the logic circuit inputs a first photo control signal, having the first frequency, to the pixel circuit connected to a photodiode in each of the first pixels, and inputs a second photo control signal, having the second frequency, to the pixel circuit connected to a photodiode in each of the second pixels.