公开(公告)号：US20130029477A1

公开(公告)日：2013-01-31

申请号：US13624609

申请日：2012-09-21

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  GENITECH, INC.

Inventor： Seok-jun WON ,  Yong-min YOO ,  Dae-youn KIM ,  Young-hoon KIM ,  Dae-jin KWON ,  Weon-hong KIM

IPC: H01L21/205

CPC classification number: C23C16/45544 ,  C23C16/0272 ,  C23C16/403 ,  C23C16/405 ,  C23C16/4402 ,  C23C16/45561 ,  C23C16/45574 ,  H01L21/00 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/28556 ,  H01L21/28562 ,  Y10T137/0318

Abstract: An apparatus and method for fabricating a semiconductor device using a 4-way valve with improved purge efficiency by improving a gas valve system by preventing dead volume from occurring are provided. The apparatus includes a reaction chamber in which a substrate is processed to fabricate a semiconductor device; a first processing gas supply pipe supplying a first processing gas into the reaction chamber; a 4-way valve having a first inlet, a second inlet, a first outlet, and a second outlet and installed at the first processing gas supply pipe such that the first inlet and the first outlet are connected to the first processing gas supply pipe; a second processing gas supply pipe connected to the second inlet of the 4-way valve to supply a second processing gas; a bypass connected to the second outlet of the 4-way valve; and a gate valve installed at the bypass.

公开(公告)号：US20150221497A1

公开(公告)日：2015-08-06

申请号：US14685697

申请日：2015-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  GENITECH, INC.

Inventor： Seok-jun WON ,  Yong-min YOO ,  Dae-youn KIM ,  Young-hoon KIM ,  Dae-jin KWON ,  Weon-hong KIM

IPC: H01L21/02

CPC classification number: C23C16/45544 ,  C23C16/0272 ,  C23C16/403 ,  C23C16/405 ,  C23C16/4402 ,  C23C16/45561 ,  C23C16/45574 ,  H01L21/00 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/28556 ,  H01L21/28562 ,  Y10T137/0318

Abstract: An apparatus and method for fabricating a semiconductor device using a 4-way valve with improved purge efficiency by improving a gas valve system by preventing dead volume from occurring are provided. The apparatus includes a reaction chamber in which a substrate is processed to fabricate a semiconductor device; a first processing gas supply pipe supplying a first processing gas into the reaction chamber; a 4-way valve having a first inlet, a second inlet, a first outlet, and a second outlet and installed at the first processing gas supply pipe such that the first inlet and the first outlet are connected to the first processing gas supply pipe; a second processing gas supply pipe connected to the second inlet of the 4-way valve to supply a second processing gas; a bypass connected to the second outlet of the 4-way valve; and a gate valve installed at the bypass.

Abstract translation: 提供了一种通过改善气阀系统来防止发生死体积而制造使用具有改善吹扫效率的四通阀的半导体器件的装置和方法。 该装置包括反应室，处理基板以制造半导体器件; 第一处理气体供给管，其将第一处理气体供给到所述反应室中; 四通阀，具有第一入口，第二入口，第一出口和第二出口，并安装在第一处理气体供应管上，使得第一入口和第一出口连接到第一处理气体供应管; 连接到所述四通阀的第二入口的第二处理气体供给管，以供应第二处理气体; 连接到四通阀的第二出口的旁路; 和安装在旁路上的闸阀。

公开(公告)号：US20160281234A1

公开(公告)日：2016-09-29

申请号：US15176684

申请日：2016-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  GENITECH, INC.

Inventor： Seok-jun WON ,  Yong-min YOO ,  Dae-youn KIM ,  Young-hoon KIM ,  Dae-jin KWON ,  Weon-hong KIM

IPC: C23C16/455 ,  H01L21/285 ,  C23C16/40 ,  H01L21/02

CPC classification number: C23C16/45544 ,  C23C16/0272 ,  C23C16/403 ,  C23C16/405 ,  C23C16/4402 ,  C23C16/45561 ,  C23C16/45574 ,  H01L21/00 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/28556 ,  H01L21/28562 ,  Y10T137/0318

Abstract: An apparatus and method for fabricating a semiconductor device using a 4-way valve with improved purge efficiency by improving a gas valve system by preventing dead volume from occurring are provided. The apparatus includes a reaction chamber in which a substrate is processed to fabricate a semiconductor device; a first processing gas supply pipe supplying a first processing gas into the reaction chamber; a 4-way valve having a first inlet, a second inlet, a first outlet, and a second outlet and installed at the first processing gas supply pipe such that the first inlet and the first outlet are connected to the first processing gas supply pipe; a second processing gas supply pipe connected to the second inlet of the 4-way valve to supply a second processing gas; a bypass connected to the second outlet of the 4-way valve; and a gate valve installed at the bypass.

公开(公告)号：US20150025930A1

公开(公告)日：2015-01-22

申请号：US14337618

申请日：2014-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-eun YANG ,  Jung-yeon YANG ,  Jeong-soo LEE ,  Young-hoon KIM ,  Young-hee PARK

IPC: G06Q10/10

CPC classification number: G06Q10/1093

Abstract: A method, performed by a device, of receiving a recommendation of a position from a position-recommendation apparatus, a device for receiving a recommendation from a position-recommendation apparatus, and a position-recommendation apparatus for recommending a position to a device are provided. The method includes obtaining a selected time, for which a position is to be recommended, from a user, transmitting a position-recommendation request, which includes schedule event information relating to the selected time, to the position-recommendation apparatus, and receiving a response to the position-recommendation request, which includes one or more positions that are searched for based on the schedule event information, from the position-recommendation apparatus.

Abstract translation: 提供了一种由设备执行的从位置推荐设备接收位置推荐的方法，从位置推荐设备接收推荐的设备以及用于向设备推荐位置的位置推荐设备 。 所述方法包括从用户获取对于其所推荐的位置的选定时间，将包括与所选择的时间有关的调度事件信息的位置推荐请求发送到位置推荐装置，并且接收响应 涉及到位置推荐请求，该请求包括从位置推荐装置基于日程事件信息搜索的一个或多个位置。

公开(公告)号：US20180233458A1

公开(公告)日：2018-08-16

申请号：US15949286

申请日：2018-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan-hee JEONG ,  Soo-jae PARK ,  Young-hoon KIM ,  In-ku KANG ,  Hee-yeol KIM

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16237 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012

Abstract: An integrated circuit package includes at least one first chip mounted in a first region of a mounting surface of a printed circuit board, a molding unit covering the mounting surface and surrounding the at least one first chip, an electromagnetic shielding film covering a surface of the molding unit and surrounding the at least one first chip, and a second chip mounted in a second region of the mounting surface. The second chip is exposed outside the electromagnetic shielding film and is spaced apart from the printed circuit board, with the molding unit being between the second chip and the printed circuit board.

公开(公告)号：US20150293491A1

公开(公告)日：2015-10-15

申请号：US14474577

申请日：2014-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-yong JU ,  Young-hoon KIM

IPC: G03G15/00

CPC classification number: G03G21/1619 ,  G03G15/5087 ,  G03G15/80 ,  G03G21/1652 ,  G03G2215/00126

Abstract: An image forming apparatus including a printing unit for printing images on a recording medium and an option kit adapter are provided. The image forming apparatus includes an installation member having an accommodation space, and an adaptor, on which two or more option kits are loaded, that is detachably attached to the accommodation space of the installation member.

Abstract translation: 提供一种图像形成装置，包括用于在记录介质上打印图像的打印单元和选件套件适配器。 图像形成装置包括具有容纳空间的安装构件和可装卸两个或更多个可选组件的适配器，其可拆卸地附接到安装构件的容纳空间。

公开(公告)号：US20180090449A1

公开(公告)日：2018-03-29

申请号：US15604762

申请日：2017-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan-hee JEONG ,  Soo-jae PARK ,  Young-hoon KIM ,  In-ku KANG ,  Hee-yeol KIM

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16237 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012

Abstract: An integrated circuit package includes at least one first chip mounted in a first region of a mounting surface of a printed circuit board, a molding unit covering the mounting surface and surrounding the at least one first chip, an electromagnetic shielding film covering a surface of the molding unit and surrounding the at least one first chip, and a second chip mounted in a second region of the mounting surface. The second chip is exposed outside the electromagnetic shielding film and is spaced apart from the printed circuit board, with the molding unit being between the second chip and the printed circuit board.