公开(公告)号：US09096424B2

公开(公告)日：2015-08-04

申请号：US14312307

申请日：2014-06-23

Applicant: STMicroelectronics S.r.l.

Inventor： Sebastiano Conti ,  Benedetto Vigna ,  Mario Francesco Cortese

IPC: H04R25/00 ,  B81C1/00 ,  B81B7/00 ,  H04R1/28 ,  H04R19/00 ,  H04R19/04 ,  B81B3/00 ,  H04R1/04 ,  H04R1/06 ,  H04R1/08

CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R1/086 ,  H04R1/2838 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2924/00012

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，其与背面流体连通 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。

公开(公告)号：US08854830B2

公开(公告)日：2014-10-07

申请号：US13779592

申请日：2013-02-27

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli ,  Giovanni Graziosi ,  Mario Francesco Cortese

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10 ,  H05K1/02 ,  H01L23/498 ,  B81B7/00 ,  H01L23/00 ,  H01L23/31

CPC classification number: H05K1/0271 ,  B81B7/0048 ,  B81B2207/07 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.

Abstract translation: 一种适用于支撑损伤敏感器件的半导体封装衬底，包括具有第一和相对表面的衬底芯; 覆盖封装衬底芯的第一和相对表面的至少一对金属层，其限定第一和相对的金属层组，所述层组中的至少一个包括至少一个金属支撑区; 一对焊接掩模层，覆盖至少一对金属层的最外层金属层; 和多条路线; 其中所述至少一个金属支撑区域被形成为使得其位于所述损伤敏感装置的所述基部的至少一侧的下方，并且占据所述损伤敏感装置下方的所述区域的大部分，所述损伤敏感装置没有所述 路线; 还描述了制造这种基板的方法。

公开(公告)号：US08787600B2

公开(公告)日：2014-07-22

申请号：US13861324

申请日：2013-04-11

Applicant: STMicroelectronics S.r.l.

Inventor： Sebastiano Conti ,  Benedetto Vigna ,  Mario Francesco Cortese

IPC: H04R25/00

CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R1/086 ,  H04R1/2838 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2924/00012

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，与第一表面流体连通， 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。

公开(公告)号：US20130170166A1

公开(公告)日：2013-07-04

申请号：US13779592

申请日：2013-02-27

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli ,  Giovanni Graziosi ,  Mario Francesco Cortese

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  B81B7/0048 ,  B81B2207/07 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.

Abstract translation: 一种适用于支撑损伤敏感器件的半导体封装衬底，包括具有第一和相对表面的衬底芯; 覆盖封装衬底芯的第一和相对表面的至少一对金属层，其限定第一和相对的金属层组，所述层组中的至少一个包括至少一个金属支撑区; 一对焊接掩模层，覆盖至少一对金属层的最外层金属层; 和多条路线; 其中所述至少一个金属支撑区域被形成为使得其位于所述损伤敏感装置的所述基部的至少一侧的下方，并且占据所述损伤敏感装置下方的所述区域的大部分，所述损伤敏感装置没有所述 路线; 还描述了制造这种基板的方法。