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公开(公告)号：US20140099870A1
公开(公告)日：2014-04-10
申请号：US13779841
申请日：2013-02-28
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： In Ho LEE , Ee Hyun An , Jun-Hee Lee , Sang-Hoon Back , Jung Kun Shin
IPC: B24B53/095 , B24B53/007
CPC classification number: B24B53/095 , B24B53/007 , B24B55/02
Abstract: A substrate grinding apparatus according to an exemplary embodiment of the present invention includes a grinding wheel grinding an object substrate, a nozzle unit spraying cooling water to the object substrate and the grinding wheel in a plurality of directions, and a cooling water controller connected to the nozzle unit and controlling spray speed and pressure of the cooling water, in which the nozzle unit includes a cleansing nozzle cleansing the grinding wheel, a cooling nozzle cooling the grinding wheel, and a surface protecting nozzle cooling the object substrate.
Abstract translation: 根据本发明的示例性实施例的基板研磨装置包括研磨对象基板的砂轮，将多个方向喷射到对象基板和砂轮的冷却水的喷嘴单元，以及连接到对象基板的冷却水控制器 喷嘴单元，并且控制冷却水的喷雾速度和压力，其中喷嘴单元包括清洁砂轮的清洁喷嘴，冷却砂轮的冷却喷嘴和冷却对象基板的表面保护喷嘴。
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公开(公告)号：US11798912B2
公开(公告)日：2023-10-24
申请号：US17123836
申请日：2020-12-16
Applicant: Samsung Display Co., LTD.
Inventor： Taeyoung Park , Jungseon Park , Jun-Hee Lee , Hyunwoo Lee
IPC: B32B41/00 , H01L23/00 , H05K3/32 , H10K59/131
CPC classification number: H01L24/80 , H01L24/74 , H01L24/75 , H01L24/83 , H05K3/323 , H05K3/328 , H01L2224/75701 , H01L2224/75753 , H01L2224/75754 , H01L2224/75804 , H01L2224/8013 , H01L2224/80132 , H01L2224/80205 , H01L2224/8313 , H01L2224/83132 , H05K2203/0285 , H05K2203/1509 , H05K2203/166 , H05K2203/167 , H10K59/131
Abstract: A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.
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公开(公告)号：US20210289632A1
公开(公告)日：2021-09-16
申请号：US17147446
申请日：2021-01-12
Applicant: Samsung Display Co., Ltd
Inventor： JUNGSEON PARK , Taeyoung Park , Jun-Hee Lee , Hyunwoo Lee
Abstract: A bonding device includes: a bonding head configured to move in a vertical direction; a stage disposed under the bonding head and including a first portion, the first portion having a first plane surface facing the bonding head and a first support surface opposite to the first plane surface; and a supporter disposed under the stage and including a second support surface facing the first support surface, wherein the second support surface of the supporter has a recess portion having a first radius of curvature.
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Patent Agency Ranking
公开(公告)号：US09728742B2
公开(公告)日：2017-08-08
申请号：US15050523
申请日：2016-02-23
Applicant: Samsung Display Co., Ltd.
Inventor： Hyun Wook Lee , Ju Yong Park , Jung Chul Woo , Jun-Hee Lee
IPC: H01L23/48 , H01L21/00 , H01L51/52 , G02F1/1339
CPC classification number: H01L51/5246 , G02F1/133351 , G02F1/1339
Abstract: A display panel assembly according to an exemplary embodiment of the present disclosure includes: an upper mother substrate; a lower mother substrate disposed opposing the upper mother substrate and including a plurality of thin film transistor (TFT) arrays; a sealing member formed between the upper mother substrate and the lower mother substrate and formed with a closed loop shape to surround the thin film transistor array; and a seal pattern formed on an edge region of the upper mother substrate and the lower mother substrate to bond the upper mother substrate and the lower mother substrate and in which an open region is formed to connect the inside and outside of the bonded upper mother substrate and lower mother substrate.
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公开(公告)号：US12199055B2
公开(公告)日：2025-01-14
申请号：US17116902
申请日：2020-12-09
Applicant: Samsung Display Co., Ltd.
Inventor： Hyunwoo Lee , Jungseon Park , Taeyoung Park , Jun-Hee Lee
Abstract: A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.
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公开(公告)号：US20210305183A1
公开(公告)日：2021-09-30
申请号：US17116902
申请日：2020-12-09
Applicant: Samsung Display Co., Ltd.
Inventor： HYUNWOO LEE , Jungseon Park , Taeyoung Park , Jun-Hee Lee
Abstract: A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.
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公开(公告)号：US10910588B2
公开(公告)日：2021-02-02
申请号：US16401056
申请日：2019-05-01
Applicant: Samsung Display Co., Ltd.
Inventor： Hyoung-Joo Kim , Yunsoo Kim , Jun-Hee Lee , Cheollae Roh , Gyoowan Han
IPC: H01L51/52 , G06F3/041 , G02B5/30 , H05K5/00 , G06F3/0488
Abstract: A display device includes a substrate including an upper surface, a lower surface, and side surfaces; a display element layer on the upper surface overlapping the display area; an encapsulation layer on the upper surface, the encapsulation layer including a main part that overlaps the display element layer and a protruding part that protrudes along a first direction from the main part and overlaps the bezel area; an input sensor on the main part; a first circuit board facing the main part, overlapping the bezel area, and on the upper surface; and a second circuit board on the protruding part, wherein each of the first circuit board and the second circuit board is adjacent to a first side surface among the side surfaces, and in the first direction, the protruding part is more adjacent to the first side surface than the main part.
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公开(公告)号：US11528807B2
公开(公告)日：2022-12-13
申请号：US17147446
申请日：2021-01-12
Applicant: Samsung Display Co., Ltd.
Inventor： Jungseon Park , Taeyoung Park , Jun-Hee Lee , Hyunwoo Lee
Abstract: A bonding device includes: a bonding head configured to move in a vertical direction; a stage disposed under the bonding head and including a first portion, the first portion having a first plane surface facing the bonding head and a first support surface opposite to the first plane surface; and a supporter disposed under the stage and including a second support surface facing the first support surface, wherein the second support surface of the supporter has a recess portion having a first radius of curvature.
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