公开(公告)号：US09730323B2

公开(公告)日：2017-08-08

申请号：US14480661

申请日：2014-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Gyu Kim ,  Jung Woo Kim ,  Tae Hun Kim ,  Kyoung Sei Choi

IPC: H05K7/00 ,  H05K1/14 ,  H01L25/065 ,  H05K1/18 ,  H01L23/498 ,  H01L23/538

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/5385 ,  H01L23/5386 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/181 ,  H05K1/186 ,  H05K2201/042 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package may include a plurality of first semiconductor package mounted on a first region of a first surface of a first circuit board, a plurality of terminals disposed between the plurality of first semiconductor chips on a second region of the first surface of the first circuit board, and at least one second semiconductor chip mounted on a second circuit board connected to the first circuit board through the plurality of terminals.