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    Solid state drive apparatus
    2.
    发明授权
    Solid state drive apparatus 有权

    公开(公告)号：US09958914B2

    公开(公告)日：2018-05-01

    申请号：US15188424

    申请日：2016-06-21

    申请人： Samsung Electronics Co., Ltd.

    发明人： Jung-hoon Kim

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20

    摘要： A solid state drive apparatus includes a housing having a first accommodation space and a second accommodation space; a substrate mounted in the first accommodation space, wherein at least one non-volatile memory chip is mounted on the substrate; and a heat dissipation member mounted in the second accommodation space and including an isolation barrier that defines a boundary between the second accommodation space and the first accommodation space and a plurality of fin portions that extend from the isolation barrier away from the first accommodation space, wherein a plurality of through air holes are provided in a side of the housing adjacent the second accommodation space.

    Secondary Memory Device
    3.
    发明申请
    Secondary Memory Device 有权
    辅助存储设备

    公开(公告)号：US20140146461A1

    公开(公告)日：2014-05-29

    申请号：US14087095

    申请日：2013-11-22

    申请人： Samsung Electronics Co., Ltd.

    发明人： Jin-young Choi ,  Joon-young Oh ,  Hee-youb Kang ,  Jung-hoon Kim ,  Won-hwa Lee ,  Jae-beom Byun ,  Jong-yun Yun

    IPC分类号： H05K7/20

    CPC分类号： G06F1/187 ,  G06F1/203 ,  G11B2220/60 ,  G11C5/00 ,  G11C5/02 ,  G11C5/025 ,  H05K7/20445

    摘要： A secondary memory device includes: a substrate and a housing configured to accommodate at least a part of the substrate. The substrate has upper and lower opposed surfaces and includes a first region in which a first semiconductor device is mounted on the upper surface and a second region in which a second semiconductor device is mounted on the upper surface. The housing includes a first sub-housing covering the upper surface of the substrate at the first region and the first semiconductor device. The first sub-housing does not extend to cover the upper surface of the substrate at the second region.

    摘要翻译： 辅助存储器件包括：衬底和被配置为容纳衬底的至少一部分的壳体。 基板具有上下相对的表面，并且包括其第一半导体器件安装在上表面上的第一区域和第二半导体器件安装在上表面上的第二区域。 壳体包括覆盖第一区域的基板的上表面的第一子壳体和第一半导体器件。 第一子壳体不延伸以在第二区域覆盖基板的上表面。

    METHOD AND APPARATUS FOR DISPLAYING FUNCTION OF BUTTON OF ULTRASOUND APPARATUS ON THE BUTTON
    4.
    发明申请
    METHOD AND APPARATUS FOR DISPLAYING FUNCTION OF BUTTON OF ULTRASOUND APPARATUS ON THE BUTTON 审中-公开
    用于显示按钮上超声波装置的按钮的功能的方法和装置

    公开(公告)号：US20130290890A1

    公开(公告)日：2013-10-31

    申请号：US13665017

    申请日：2012-10-31

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Chi-young Ahn ,  Jong-chan Kwon ,  Ki-soo Kim ,  Jung-hoon Kim ,  Sang-min Hyun

    IPC分类号： G06F3/048

    CPC分类号： G06F3/04886 ,  A61B8/461 ,  A61B8/467 ,  G01S7/52084

    摘要： A method of displaying a function of a button of an ultrasound apparatus on the button includes displaying information about one or more functions provided by the ultrasound apparatus, selecting one from among the one or more functions which have been displayed, determining a button in which the selected function is to be set based on an external input signal for matching the selected function to the button in which the selected function is to be set; and displaying information about the selected function on the determined button.

    摘要翻译： 在按钮上显示超声波装置的按钮的功能的方法包括显示关于由超声波装置提供的一个或多个功能的信息，从已经显示的一个或多个功能中选择一个，确定其中 所选择的功能将根据外部输入信号进行设置，以将所选择的功能与要设置所选功能的按钮相匹配; 并在确定的按钮上显示关于所选功能的信息。

    Solid state drive apparatus
    6.
    发明授权
    Solid state drive apparatus 有权

    公开(公告)号：US09798361B2

    公开(公告)日：2017-10-24

    申请号：US15130026

    申请日：2016-04-15

    申请人： Samsung Electronics Co., Ltd.

    发明人： Jung-hoon Kim

    IPC分类号： G06F1/18

    CPC分类号： G06F1/182 ,  G06F1/187 ,  H05K5/0256

    摘要： Provided is a solid state drive apparatus having improved reliability. The solid state drive apparatus includes: a substrate on which at least one non-volatile memory device is mounted; a main body case in which the substrate is mounted, wherein an accommodating portion is formed at a corner of the main body case; a bumper case mounted in the accommodating portion of the main body case; and an shock-absorbing member connecting the main body case and the bumper case to each other such that a separation distance is provided between the main body case and the bumper case, wherein the main body case and the bumper case form an exterior of the solid state drive apparatus as adjacent portions of the main body case and the bumper case are located on a same plane with the separation distance therebetween.

    Solid State Drive Apparatus
    7.
    发明申请
    Solid State Drive Apparatus 有权
    固态驱动装置

    公开(公告)号：US20170060199A1

    公开(公告)日：2017-03-02

    申请号：US15188424

    申请日：2016-06-21

    申请人： Samsung Electronics Co., Ltd.

    发明人： Jung-hoon Kim

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20

    摘要： A solid state drive apparatus includes a housing having a first accommodation space and a second accommodation space; a substrate mounted in the first accommodation space, wherein at least one non-volatile memory chip is mounted on the substrate; and a heat dissipation member mounted in the second accommodation space and including an isolation barrier that defines a boundary between the second accommodation space and the first accommodation space and a plurality of fin portions that extend from the isolation barrier away from the first accommodation space, wherein a plurality of through air holes are provided in a side of the housing adjacent the second accommodation space.

    摘要翻译： 固体驱动装置包括具有第一容纳空间和第二容纳空间的壳体; 安装在所述第一容纳空间中的衬底，其中至少一个非易失性存储器芯片安装在所述衬底上; 以及散热构件，其安装在所述第二容纳空间中并且包括限定所述第二容纳空间和所述第一容纳空间之间的边界的隔离屏障和从所述隔离屏障远离所述第一容纳空间延伸的多个鳍部，其中 在壳体的与第二容纳空间相邻的一侧设置有多个通气孔。

    Solid state drive apparatus
    8.
    发明授权
    Solid state drive apparatus 有权

    公开(公告)号：US10289174B2

    公开(公告)日：2019-05-14

    申请号：US15922287

    申请日：2018-03-15

    申请人： Samsung Electronics Co., Ltd.

    发明人： Jung-hoon Kim

    IPC分类号： G06F1/20

    摘要： A solid state drive apparatus includes a housing having a first accommodation space and a second accommodation space; a substrate mounted in the first accommodation space, wherein at least one non-volatile memory chip is mounted on the substrate; and a heat dissipation member mounted in the second accommodation space and including an isolation barrier that defines a boundary between the second accommodation space and the first accommodation space and a plurality of fin portions that extend from the isolation barrier away from the first accommodation space, wherein a plurality of through air holes are provided in a side of the housing adjacent the second accommodation space.