公开(公告)号：US09728516B2

公开(公告)日：2017-08-08

申请号：US15164502

申请日：2016-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongbin Shi ,  Kang Joon Lee

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L23/3157 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/02135 ,  H01L2224/02145 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05555 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/06131 ,  H01L2224/0615 ,  H01L2224/1131 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/13027 ,  H01L2224/14131 ,  H01L2224/16227 ,  H01L2924/3511 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electric apparatus may include a plurality of electric patterns arranged on a substrate. Each of the electric patterns may include a pad for connection with a solder ball, an electrical trace laterally extending from a portion of the pad to allow an electrical signal to be transmitted from or to the pad, a first dummy trace laterally extending from other portion of the pad, and a first connection line connecting the first dummy trace to the electrical trace. The first dummy trace may be provided at a position deviated from a straight line connecting the pad to the electrical trace.

公开(公告)号：US09698088B2

公开(公告)日：2017-07-04

申请号：US15135364

申请日：2016-04-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heungkyu Kwon ,  Kang Joon Lee ,  JaeWook Yoo ,  Su-Chang Lee

IPC: H01L23/498 ,  H01L23/488 ,  H01L23/16 ,  H01L23/18 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/13

CPC classification number: H01L23/49811 ,  H01L23/13 ,  H01L23/16 ,  H01L23/18 ,  H01L23/3157 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/13541 ,  H01L2224/13561 ,  H01L2224/13583 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/13624 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13649 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13669 ,  H01L2224/1367 ,  H01L2224/13671 ,  H01L2224/13672 ,  H01L2224/13679 ,  H01L2224/1368 ,  H01L2224/13681 ,  H01L2224/13684 ,  H01L2224/1401 ,  H01L2224/1403 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14181 ,  H01L2224/14505 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/1712 ,  H01L2224/17181 ,  H01L2224/175 ,  H01L2224/1751 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/206 ,  H01L2924/014 ,  H01L2224/05552

Abstract: Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.