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公开(公告)号:US10191805B2
公开(公告)日:2019-01-29
申请号:US15204536
申请日:2016-07-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Uhn Cha , Hoi-Ju Chung
Abstract: A semiconductor memory device includes a memory cell array, an error correction circuit and a control logic circuit. The error correction circuit performs an error correction code (ECC) encoding on write data to be stored in the memory cell array, and performs an ECC decoding on read data from the memory cell array. The control logic circuit controls access to the memory cell array and generates an engine configuration selection signal based on a command. The error correction circuit reconfigures a number of units for which ECC including the ECC encoding and the ECC decoding is performed, in response to the engine configuration selection signal.
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公开(公告)号:US10090066B2
公开(公告)日:2018-10-02
申请号:US15696794
申请日:2017-09-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Uhn Cha , Hoi-Ju Chung , Jong-Pil Son , Kwang-Il Park , Seong-Jin Jang
Abstract: A semiconductor memory device includes a memory cell array in which a plurality of memory cells are arranged. The semiconductor memory device includes an error correcting code (ECC) circuit configured to generate parity data based on main data, write a codeword including the main data and the parity data in the memory cell array, read the codeword from a selected memory cell row to generate syndromes, and correct errors in the read codeword on a per symbol basis based on the syndromes. The main data includes first data of a first memory cell of the selected memory cell row and second data of a second memory cell of the selected memory cell row. The first data and the second data are assigned to one symbol of a plurality of symbols, and the first memory cell and the second memory cell are adjacent to each other in the memory cell array.
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公开(公告)号:US11994948B2
公开(公告)日:2024-05-28
申请号:US18164349
申请日:2023-02-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hoi-Ju Chung , Sang-Uhn Cha , Ho-Young Song , Hyun-Joong Kim
CPC classification number: G06F11/1068 , G06F3/0619 , G06F3/064 , G06F3/0679 , G11C29/52 , G11C2029/0409 , G11C2029/0411 , G11C29/70
Abstract: A semiconductor memory device includes a memory cell array, an error correction circuit, an error log register and a control logic circuit. The memory cell array includes a plurality of memory bank arrays and each of the memory bank arrays includes a plurality of pages. The control logic circuit is configured to control the error correction circuit to perform an ECC decoding sequentially on some of the pages designated at least one access address for detecting at least one bit error, in response to a first command received from a memory controller. The control logic circuit performs an error logging operation to write page error information into the error log register and the page error information includes a number of error occurrence on each of the some pages determined from the detecting.
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4.
公开(公告)号:US10811078B2
公开(公告)日:2020-10-20
申请号:US16779194
申请日:2020-01-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Uhn Cha , Hyun-Gi Kim , Hoon Sin , Ye-Sin Ryu , In-Woo Jun
IPC: G01C7/00 , G11C11/406 , G06F11/10
Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, a refresh control circuit, a scrubbing control circuit and a control logic circuit. The refresh control circuit generates refresh row addresses for refreshing a memory region on memory cell rows in response to a first command received from a memory controller. The scrubbing control circuit counts the refresh row addresses and generates a scrubbing address for performing a scrubbing operation on a first memory cell row of the memory cell rows whenever the scrubbing control circuit counts N refresh row addresses of the refresh row addresses. The ECC engine reads first data corresponding to a first codeword, from at least one sub-page in the first memory cell row, corrects at least one error bit in the first codeword and writes back the corrected first codeword in a corresponding memory location.
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公开(公告)号:US10705908B2
公开(公告)日:2020-07-07
申请号:US16015534
申请日:2018-06-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hoi-Ju Chung , Sang-Uhn Cha , Ho-Young Song , Hyun-Joong Kim
Abstract: A semiconductor memory device includes a memory cell array, an error correction circuit, an error log register and a control logic circuit. The memory cell array includes a plurality of memory bank arrays and each of the memory bank arrays includes a plurality of pages. The control logic circuit is configured to control the error correction circuit to perform an ECC decoding sequentially on some of the pages designated at least one access address for detecting at least one bit error, in response to a first command received from a memory controller. The control logic circuit performs an error logging operation to write page error information into the error log register and the page error information includes a number of error occurrence on each of the some pages determined from the detecting.
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6.
公开(公告)号:US10573356B2
公开(公告)日:2020-02-25
申请号:US15851197
申请日:2017-12-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sang-Uhn Cha , Young-Hun Seo , Kwang-Il Park , Seung-Jun Bae
IPC: G06F11/00 , G11C7/10 , G11C11/4093 , G11C11/4096 , H03M13/00 , G06F11/10
Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, an input/output (I/O) gating circuit and a control logic circuit. The memory cell array includes bank arrays, each of the bank arrays includes a first sub array and a second sub array, and each of the first sub array and the second sub array includes a normal cell region to store data bits and a parity cell region to store parity bits. The ECC engine generates the parity bits and corrects error bit. The I/O gating circuit is connected between the ECC engine and the memory cell array. The control logic circuit controls the I/O gating circuit to perform column access to the normal cell region according to a multiple of a burst length and to perform column access to the parity cell region according to a non-multiple of the burst length partially.
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公开(公告)号:US10204700B1
公开(公告)日:2019-02-12
申请号:US15271600
申请日:2016-09-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoon-Na Oh , Deok-Gu Yoon , Sang-Uhn Cha
Abstract: A memory system includes a semiconductor memory device and a test device. The semiconductor memory device includes a memory cell array, an error correction circuit and a test circuit. The test device controls a test of the semiconductor memory device, and the test device includes a first fail address memory and a second fail address memory. The test circuit performs a first test on the memory cell array to selectively record a first test result associated with the first test in the first fail address memory and performs a second test on the memory cell array to record a second test result associated with the second test in the second fail address memory. The test circuit is configured to perform the first test and the second test based on a test pattern data from the test device in a test mode.
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公开(公告)号:US10002045B2
公开(公告)日:2018-06-19
申请号:US15209043
申请日:2016-07-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hoi-Ju Chung , Sang-Uhn Cha
CPC classification number: G06F11/1068 , G06F3/0619 , G06F3/064 , G06F3/0679 , G06F11/1048 , G11C7/20 , G11C11/1675 , G11C11/4072 , G11C2029/0407
Abstract: A semiconductor memory device is provided. The semiconductor memory device includes a memory cell array, an input/output (I/O) gating circuit and an error correction circuit. The memory cell array includes a plurality of memory cells. The I/O gating circuit, before performing a normal memory operation on the memory cell array by a first unit, performs a cell data initializing operation by writing initializing bits in the memory cell array by a second unit different from the first unit. The error correction circuit performs an error correction code (ECC) encoding and an ECC decoding on a target page of the memory cell array by the second unit, based on the initializing bits. Therefore, power consumption in performing write operation may be reduced.
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公开(公告)号:US09953725B2
公开(公告)日:2018-04-24
申请号:US15395213
申请日:2016-12-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ye-Sin Ryu , Sang-Uhn Cha , Hoi-Ju Chung , Seong-Jin Cho
IPC: G11C29/44 , G11C29/56 , G11B20/18 , G01R31/3187 , G06F11/27 , G06F11/10 , G11C29/52 , G11C5/04 , G11C11/40 , G11C17/16 , G11C17/18 , G11C29/02 , G11C29/00
CPC classification number: G11C29/44 , G01R31/3187 , G06F11/1068 , G06F11/27 , G11B20/1816 , G11C5/04 , G11C11/40 , G11C17/16 , G11C17/18 , G11C29/027 , G11C29/4401 , G11C29/52 , G11C29/56004 , G11C29/56008 , G11C29/785 , G11C29/787 , G11C2029/4402 , G11C2029/5606
Abstract: A method of operating a semiconductor memory device is provided. In a method of operating a semiconductor memory device including a memory cell array which includes a plurality of bank arrays, memory cells in a first region of the memory cell array are tested to detect one or more failed cells in the first region, a fail address corresponding to the detected one or more failed cells is determined and the determined fail address is stored in a second region different from the first region, in the memory cell array.
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公开(公告)号:US20170110206A1
公开(公告)日:2017-04-20
申请号:US15395213
申请日:2016-12-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ye-Sin Ryu , Sang-Uhn Cha , Hoi-Ju Chung , Seong-Jin Cho
CPC classification number: G11C29/44 , G01R31/3187 , G06F11/1068 , G06F11/27 , G11B20/1816 , G11C5/04 , G11C11/40 , G11C17/16 , G11C17/18 , G11C29/027 , G11C29/4401 , G11C29/52 , G11C29/56004 , G11C29/56008 , G11C29/785 , G11C29/787 , G11C2029/4402 , G11C2029/5606
Abstract: A method of operating a semiconductor memory device is provided. In a method of operating a semiconductor memory device including a memory cell array which includes a plurality of bank arrays, memory cells in a first region of the memory cell array are tested to detect one or more failed cells in the first region, a fail address corresponding to the detected one or more failed cells is determined and the determined fail address is stored in a second region different from the first region, in the memory cell array.
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