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公开(公告)号：US20220352120A1
公开(公告)日：2022-11-03
申请号：US17860531
申请日：2022-07-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Eunseok HONG , Sanghoon PARK , Younoh CHI
IPC: H01L25/065 , H01L23/538 , H05K3/46 , H05K1/02 , H05K1/14
Abstract: An interposer array is provided, which includes an array substrate, a first interposer configured as a closed curve having a first space therein, a second interposer configured as a closed curve having a second space therein, a plurality of first bridges configured to connect the array substrate and the first interposer, and a plurality of second bridges configured to connect the first interposer and the second interposer.
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公开(公告)号：US20210099560A1
公开(公告)日：2021-04-01
申请号：US16985516
申请日：2020-08-05
Applicant: Samsung Electronics Co, Ltd.
Inventor： Taewoo KIM , Dui KANG , Bongkyu MIN , Bongchoon PARK , Sanghoon PARK , Jinyong PARK , Hyelim YUN , Hyeongju LEE , Younoh CHI
Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
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3.发明申请
公开(公告)号：US20230121285A1
公开(公告)日：2023-04-20
申请号：US17968308
申请日：2022-10-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon HA , Hyunmo YANG , Yeonkyung CHUNG , Younoh CHI
Abstract: A printed circuit board and/or an electronic device including the same are provided. The printed circuit board and/or an electronic device includes at least one insulation layer including a first rigid region and a flexible region extending from the first rigid region, at least one first circuit pattern disposed on one surface of the at least one insulation layer to at least partially transverse the flexible region from the first rigid region, and at least one conductive pad formed at least partially on a surface of the first circuit pattern in the first rigid region, wherein the flexible region may be configured to flexibly deform more than the first rigid region.
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公开(公告)号：US20220256705A1
公开(公告)日：2022-08-11
申请号：US17728363
申请日：2022-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon HA , Seyoung JANG , Sungjin KIM , Sanghoon PARK , Kyungho LEE , Younoh CHI
IPC: H05K1/14 , H01L25/065
Abstract: An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.
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公开(公告)号：US20210014970A1
公开(公告)日：2021-01-14
申请号：US16883604
申请日：2020-05-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon HA , Seyoung JANG , Sungjin KIM , Sanghoon PARK , Kyungho LEE , Younoh CHI
IPC: H05K1/14 , H01L25/065
Abstract: An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, wherein the first electronic component on the first circuit board is disposed corresponding to the first region, and the second electronic component on the first circuit board is disposed corresponding to the second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.
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公开(公告)号：US20150264842A1
公开(公告)日：2015-09-17
申请号：US14640520
申请日：2015-03-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghoon SONG , Jungje BANG , Kwangsub LEE , Saebom LEE , Seyoung JANG , Younoh CHI
CPC classification number: H05K7/20445 , H01L23/42 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2924/12044 , H05K9/0032 , Y10T29/4913 , Y10T29/49144 , H01L2924/00
Abstract: A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.
Abstract translation: 提供屏蔽可用于电磁屏蔽。 屏蔽件可以包括具有从其侧向突出的凸块的屏蔽盖，以及具有用于在第一高度或第二高度选择性地固定凸块的连接部分的屏蔽框架，使得屏蔽框架被紧固到屏蔽盖。 电子设备包括基板，安装在基板上的内部装置和屏蔽罐。 屏蔽盖位于内部设备上方，屏蔽框架垂直形成在基板上，以围绕内部设备。
