Parasitic particle suppression in growth of III-V nitride films using MOCVD and HVPE
    4.
    发明申请
    Parasitic particle suppression in growth of III-V nitride films using MOCVD and HVPE 失效
    使用MOCVD和HVPE在III-V族氮化物薄膜生长中的寄生颗粒抑制

    公开(公告)号:US20070259502A1

    公开(公告)日:2007-11-08

    申请号:US11429022

    申请日:2006-05-05

    摘要: A method of suppressing parasitic particle formation in a metal organic chemical vapor deposition process is described. The method may include providing a substrate to a reaction chamber, and introducing an organometallic precursor, a particle suppression compound and at least a second precursor to the reaction chamber. The second precursor reacts with the organometallic precursor to form a nucleation layer on the substrate. Also, a method of suppressing parasitic particle formation during formation of a III-V nitride layer is described. The method includes introducing a group III metal containing precursor to a reaction chamber. The group III metal precursor may include a halogen. A hydrogen halide gas and a nitrogen containing gas are also introduced to the reaction chamber. The nitrogen containing gas reacts with the group III metal precursor to form the Ill-V nitride layer on the substrate.

    摘要翻译: 描述了抑制金属有机化学气相沉积工艺中的寄生颗粒形成的方法。 该方法可以包括向反应室提供底物,并将有机金属前体,颗粒抑制化合物和至少第二前体引入反应室。 第二前驱体与有机金属前驱体反应以在基底上形成成核层。 另外,描述了在形成III-V族氮化物层期间抑制寄生粒子形成的方法。 该方法包括将含III族金属的前体引入反应室。 III族金属前体可以包括卤素。 卤化氢气体和含氮气体也被引入反应室。 含氮气体与III族金属前体反应,在衬底上形成III-V族氮化物层。

    MOCVD reactor with concentration-monitor feedback
    6.
    发明申请
    MOCVD reactor with concentration-monitor feedback 审中-公开
    具有浓度监测反馈的MOCVD反应器

    公开(公告)号:US20070254093A1

    公开(公告)日:2007-11-01

    申请号:US11411667

    申请日:2006-04-26

    IPC分类号: C23C16/52 C23C16/00 B05C11/00

    CPC分类号: C23C16/52 C23C16/4482

    摘要: Methods and systems permit fabricating structures using liquid sources without active temperature control. A liquid or solid source of the precursor is provided in a bubbler. A carrier gas source is flowed into the source to generate a flow of precursor vapor carried by the carrier gas. A relative concentration of the precursor vapor to the carrier gas of the flow is measured. A mass flow rate of the precursor in the flow is determined from the measured relative concentration. A flow rate of the carrier gas into the source is changed to maintain the mass flow rate at a defined value or within a defined range.

    摘要翻译: 方法和系统允许使用没有主动温度控制的液体源制造结构。 将前体的液体或固体源提供在起泡器中。 载气源流入源中以产生由载气承载的前体蒸气流。 测量前体蒸汽相对于流动载气的相对浓度。 根据测量的相对浓度确定流体中前体的质量流率。 将进入源的载气的流量改变为将质量流量保持在规定值或者在规定范围内。

    Stacked-substrate processes for production of nitride semiconductor structures
    7.
    发明授权
    Stacked-substrate processes for production of nitride semiconductor structures 失效
    用于生产氮化物半导体结构的堆叠衬底工艺

    公开(公告)号:US07575982B2

    公开(公告)日:2009-08-18

    申请号:US11404525

    申请日:2006-04-14

    IPC分类号: H01L21/30

    摘要: Methods are provided of fabricating compound nitride semiconductor structures. A group-III precursor and a nitrogen precursor are flowed into a processing chamber to deposit a first layer over a surface of a first substrate with a thermal chemical-vapor-deposition process. A second layer is deposited over a surface of a second substrate with the thermal chemical-vapor-deposition process using the first group-III precursor and the first nitrogen precursor. The first and second substrates are different outer substrates of a plurality of stacked substrates disposed within the processing chamber as a stack so that the first and second layers are deposited on opposite sides of the stack. Deposition of the first layer and deposition of the second layer are performed simultaneously.

    摘要翻译: 提供了制造复合氮化物半导体结构的方法。 将III族前体和氮前体流入处理室中,以通过热化学气相沉积工艺在第一基板的表面上沉积第一层。 使用第一组III前体和第一氮前体,通过热化学气相沉积工艺将第二层沉积在第二衬底的表面上。 第一和第二基板是作为堆叠设置在处理室内的多个堆叠基板的不同的外部基板,使得第一和第二层沉积在堆叠的相对侧上。 同时进行第一层的沉积和第二层的沉积。

    MOCVD reactor without metalorganic-source temperature control
    9.
    发明申请
    MOCVD reactor without metalorganic-source temperature control 审中-公开
    MOCVD反应器无金属有机源温度控制

    公开(公告)号:US20070254100A1

    公开(公告)日:2007-11-01

    申请号:US11411672

    申请日:2006-04-26

    IPC分类号: C23C16/00 B05C11/00

    摘要: Methods and systems permit fabricating structures using liquid sources without active temperature control. A substrate is disposed within a substrate processing chamber. A liquid source of a group-III precursor is provided in a bubbler. A push gas is applied to the liquid source to drive the group-III precursor into a vaporizer. A carrier gas is flowed into the vaporizer. A flow of vaporized group-III precursor carried by the carrier gas is injected from the vaporizer into the processing chamber. A nitrogen precursor is flowed into the processing chamber. A group-III nitride layer is deposited over the substrate with a thermal chemical vapor deposition within the processing chamber using the vaporized group-III precursor and the nitrogen precursor.

    摘要翻译: 方法和系统允许使用没有主动温度控制的液体源制造结构。 基板设置在基板处理室内。 在起泡器中提供III族前体的液体源。 推动气体被施加到液体源以驱动III族前体进入蒸发器。 载气流入蒸发器。 由载气携带的汽化的III族前体的流动从蒸发器注入到处理室中。 氮气前体流入处理室。 使用蒸发的III族前体和氮前体,在处理室内通过热化学气相沉积在衬底上沉积III族氮化物层。

    Stacked-substrate processes for production of nitride semiconductor structures
    10.
    发明申请
    Stacked-substrate processes for production of nitride semiconductor structures 失效
    用于生产氮化物半导体结构的堆叠衬底工艺

    公开(公告)号:US20070243652A1

    公开(公告)日:2007-10-18

    申请号:US11404525

    申请日:2006-04-14

    IPC分类号: H01L21/205 H01L21/365

    摘要: Methods are provided of fabricating compound nitride semiconductor structures. A group-III precursor and a nitrogen precursor are flowed into a processing chamber to deposit a first layer over a surface of a first substrate with a thermal chemical-vapor-deposition process. A second layer is deposited over a surface of a second substrate with the thermal chemical-vapor-deposition process using the first group-III precursor and the first nitrogen precursor. The first and second substrates are different outer substrates of a plurality of stacked substrates disposed within the processing chamber as a stack so that the first and second layers are deposited on opposite sides of the stack. Deposition of the first layer and deposition of the second layer are performed simultaneously.

    摘要翻译: 提供了制造复合氮化物半导体结构的方法。 将III族前体和氮前体流入处理室中,以通过热化学气相沉积工艺在第一基板的表面上沉积第一层。 使用第一组III前体和第一氮前体,通过热化学气相沉积工艺将第二层沉积在第二衬底的表面上。 第一和第二基板是作为堆叠设置在处理室内的多个堆叠基板的不同的外部基板,使得第一和第二层沉积在堆叠的相对侧上。 同时进行第一层的沉积和第二层的沉积。