公开(公告)号：US20110244515A1

公开(公告)日：2011-10-06

申请号：US13120404

申请日：2009-09-22

申请人： Sang Yup Lee ,  Xiaoxia Xia ,  Zhi Gang Qian ,  Jong Hwan Baek

发明人： Sang Yup Lee ,  Xiaoxia Xia ,  Zhi Gang Qian ,  Jong Hwan Baek

IPC分类号： C12P21/00 ,  C12N1/21 ,  C12N15/63

CPC分类号： C12N15/67 ,  C07K14/43518 ,  C07K14/43586

摘要： The present invention relates to a method of increasing the expression of a target protein by co-expression of a gene encoding a target protein having a high content of a specific amino acid with a nucleotide sequence encoding the tRNA of the specific amino acid. According to the present invention, the expression of a protein having a high content of a specific amino acid can be remarkably increased by co-expression with the tRNA of the specific amino acid. Thus, the present invention is useful for increasing the productivity of a protein having a high content of a specific amino acid, such as a repetitive protein.

摘要翻译： 本发明涉及通过将编码具有高特异性氨基酸含量的靶蛋白的基因与编码特定氨基酸的tRNA的核苷酸序列共表达来增加靶蛋白的表达的方法。 根据本发明，通过与特定氨基酸的tRNA共表达，可以显着提高具有高特异性氨基酸含量的蛋白质的表达。 因此，本发明对于提高具有高含量的特定氨基酸的蛋白质如重复蛋白质的生产率是有用的。

公开(公告)号：US07846754B2

公开(公告)日：2010-12-07

申请号：US12548565

申请日：2009-08-27

申请人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

发明人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

摘要翻译： 一种高功率发光二极管（LED）封装及其制造方法。 根据本发明的大功率LED封装包括多个发光二极管芯片，其上安装有发光二极管芯片的第一引线框架和从第一引线框架以预定间隔设置的第二引线框架。 LED封装还包括固定第一和第二引线框的封装体和用于将多个LED芯片与其向上倾斜的内侧壁电连接的接合线，以及围绕整个多个LED芯片的第二反射部分， 倾斜的内侧壁。

公开(公告)号：US20080042151A1

公开(公告)日：2008-02-21

申请号：US11808810

申请日：2007-06-13

申请人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

发明人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

摘要翻译： 一种高功率发光二极管（LED）封装及其制造方法。 根据本发明的大功率LED封装包括多个发光二极管芯片，其上安装有发光二极管芯片的第一引线框架和从第一引线框架以预定间隔设置的第二引线框架。 LED封装还包括固定第一和第二引线框架以及用于电连接多个LED芯片的接合线的封装体。 封装体包括至少一个第一反射部分，其分别围绕多个LED芯片中的每一个具有向上倾斜的内侧壁，以及围绕整个多个LED芯片的第二反射部分，其具有向上倾斜的内侧壁。

公开(公告)号：US07663250B2

公开(公告)日：2010-02-16

申请号：US12230793

申请日：2008-09-04

申请人： Hyung Jin Jeon ,  Sung Yi ,  Jong Yun Lee ,  Young Do Kweon ,  Jong Hwan Baek

发明人： Hyung Jin Jeon ,  Sung Yi ,  Jong Yun Lee ,  Young Do Kweon ,  Jong Hwan Baek

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A wafer level package and a manufacturing method thereof capable of reducing stress between an under bump metal and a bump. The wafer level package includes a substrate provided with a plurality of chip pads on a top surface; a first passivation layer to expose the chip pads; vias connected to the chip pads by passing through the first passivation layer; a metal wiring layer formed on the first passivation layer and connected to the vias; an under bump metal formed on the first passivation layer to be connected to the metal wiring layer and having a buffer pattern separated through a trench on a center; a second passivation layer formed on the first passivation layer to expose the under bump metal; a first bump formed on the buffer pattern; and a second bump filling the trench and formed on the first bump and the under bump metal.

摘要翻译： 一种晶片级封装及其制造方法，能够减少凸块之间的应力。 晶片级封装包括在顶表面上设置有多个芯片焊盘的衬底; 第一钝化层以暴露所述芯片焊盘; 通过穿过第一钝化层连接到芯片焊盘的通孔; 形成在所述第一钝化层上并连接到所述通孔的金属布线层; 形成在所述第一钝化层上以连接到所述金属布线层并且具有通过中心的沟槽分离的缓冲图案的下凸块金属; 形成在所述第一钝化层上以暴露所述下凸块金属的第二钝化层; 形成在缓冲图案上的第一凸起; 以及填充所述沟槽并形成在所述第一凸块和所述下凸块金属上的第二凸块。

公开(公告)号：US07598528B2

公开(公告)日：2009-10-06

申请号：US11808810

申请日：2007-06-13

申请人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

发明人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

IPC分类号： H01L33/00 ,  H01L29/22 ,  H01L29/24

CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

摘要翻译： 一种高功率发光二极管（LED）封装及其制造方法。 根据本发明的大功率LED封装包括多个发光二极管芯片，其上安装有发光二极管芯片的第一引线框架和从第一引线框架以预定间隔设置的第二引线框架。 LED封装还包括固定第一和第二引线框架以及用于电连接多个LED芯片的接合线的封装体。 封装体包括至少一个第一反射部分，其分别围绕多个LED芯片中的每一个具有向上倾斜的内侧壁，以及围绕整个多个LED芯片的第二反射部分，其具有向上倾斜的内侧壁。

公开(公告)号：US20100149770A1

公开(公告)日：2010-06-17

申请号：US12453272

申请日：2009-05-05

申请人： Seung Wook Park ,  Jin Gu Kim ,  Jong Hwan Baek ,  Jong Yun Lee ,  Hyung Jin Jeon ,  Young Do Kweon

发明人： Seung Wook Park ,  Jin Gu Kim ,  Jong Hwan Baek ,  Jong Yun Lee ,  Hyung Jin Jeon ,  Young Do Kweon

IPC分类号： H01L23/538

CPC分类号： H01L25/0652 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention relates to a semiconductor stack package including: a printed circuit board; a first semiconductor chip mounted on the printed circuit board; a second semiconductor chip mounted on the printed circuit board in parallel with the first semiconductor chip; a first rearrangement wiring layer positioned on the first semiconductor chip; a second rearrangement wiring layer which constitutes one circuit together with the first rearrangement wiring layer and is positioned on the second semiconductor chip; and a third semiconductor chip which is electrically connected to the first and second rearrangement wiring layers and of which both ends are separately positioned on the first and second semiconductor chips.

摘要翻译： 本发明涉及一种半导体堆叠封装，包括：印刷电路板; 安装在印刷电路板上的第一半导体芯片; 与所述第一半导体芯片并联安装在所述印刷电路板上的第二半导体芯片; 位于第一半导体芯片上的第一重排布线层; 第二重排布线层，与第一重排布线层一起构成一个电路，并且位于第二半导体芯片上; 以及第三半导体芯片，其电连接到第一和第二重排布线层，并且其两端分别位于第一和第二半导体芯片上。

公开(公告)号：US20090311811A1

公开(公告)日：2009-12-17

申请号：US12548565

申请日：2009-08-27

申请人： Kyung Seob OH ,  Kae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

发明人： Kyung Seob OH ,  Kae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

IPC分类号： H01L21/56

CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

摘要翻译： 一种高功率发光二极管（LED）封装及其制造方法。 根据本发明的大功率LED封装包括多个发光二极管芯片，其上安装有发光二极管芯片的第一引线框架和从第一引线框架以预定间隔设置的第二引线框架。 LED封装还包括固定第一和第二引线框架以及用于电连接多个LED芯片的接合线的封装体。 封装体包括至少一个第一反射部分，其分别围绕多个LED芯片中的每一个具有向上倾斜的内侧壁，以及围绕整个多个LED芯片的第二反射部分，其具有向上倾斜的内侧壁。

公开(公告)号：US20090166862A1

公开(公告)日：2009-07-02

申请号：US12213367

申请日：2008-06-18

申请人： Young Do Kweon ,  Jae Kwang Lee ,  Jong Hwan Baek ,  Hyung Jin Jeon ,  Jingli Yuan

发明人： Young Do Kweon ,  Jae Kwang Lee ,  Jong Hwan Baek ,  Hyung Jin Jeon ,  Jingli Yuan

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/05599 ,  H01L2224/05099

摘要： Provided is a semiconductor device including a wafer having an electrode pad; an insulation layer that is formed on the wafer and has an exposure hole exposing the electrode pad; a redistribution layer that is formed on the insulation layer and the exposure hole of the insulation layer and has one end connected to the electrode pad; a conductive post that is formed at the other end of the redistribution layer; an encapsulation layer that is formed on the redistribution layer and the insulation layer such that the upper end portion of the conductive post is exposed; and a solder bump that is formed on the exposed upper portion of the conducive post.

摘要翻译： 提供一种半导体器件，其包括具有电极焊盘的晶片; 绝缘层，其形成在所述晶片上并且具有暴露所述电极焊盘的曝光孔; 形成在所述绝缘层和所述绝缘层的曝光孔上并且一端连接到所述电极焊盘的再分配层; 形成在再分布层的另一端的导电柱; 形成在再分布层和绝缘层上的封装层，使得导电柱的上端部露出; 以及形成在所述有利柱的暴露的上部上的焊料凸块。

公开(公告)号：US20090166859A1

公开(公告)日：2009-07-02

申请号：US12078049

申请日：2008-03-26

申请人： Jingli Yuan ,  Young Do Kweon ,  Jong Hwan Baek ,  Joon Seok Kang ,  Seung Wook Park ,  Jong Yun Lee

发明人： Jingli Yuan ,  Young Do Kweon ,  Jong Hwan Baek ,  Joon Seok Kang ,  Seung Wook Park ,  Jong Yun Lee

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02313 ,  H01L2224/02351 ,  H01L2224/0236 ,  H01L2224/02377 ,  H01L2224/0332 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/0579 ,  H01L2224/058 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： Provided is a semiconductor device including a wafer having an electrode pad; an insulating layer that is formed on the wafer and has an exposure hole formed in one side thereof, the exposure layer exposing the electrode pad, and a support post formed in the other side, the support post having a buffer groove; a redistribution layer that is formed on the top surface of the insulating layer and has one end connected to the electrode pad and the other end extending to the support post; an encapsulation layer that is formed on the redistribution layer and the insulating layer and exposes the redistribution layer formed on the support post; and a solder bump that is provided on the exposed portion of the redistribution layer.

摘要翻译： 提供一种半导体器件，其包括具有电极焊盘的晶片; 绝缘层，其形成在所述晶片上并且具有形成在其一侧的曝光孔，所述曝光层暴露所述电极焊盘;以及支撑柱，形成在所述另一侧，所述支撑柱具有缓冲槽; 形成在所述绝缘层的顶表面上并且一端连接到所述电极焊盘并且另一端延伸到所述支撑柱的再分布层; 形成在再分配层和绝缘层上并且暴露形成在支撑柱上的再分布层的封装层; 以及设置在再分配层的暴露部分上的焊料凸块。

公开(公告)号：US07511312B2

公开(公告)日：2009-03-31

申请号：US11697638

申请日：2007-04-06

申请人： Joon Seok Chae ,  Jong Hwan Baek

发明人： Joon Seok Chae ,  Jong Hwan Baek

IPC分类号： H01L29/74

CPC分类号： H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A surface mounting device-type light emitting diode (SMD-type LED) comprises a package housing one or more pairs of electrodes therein, the package having a predetermined space in the center thereof and a light-emission window which is opened so that light is emitted through the light-emission window; a lens formed on the package so as to cover the light-emission window; an LED chip formed on an electrode inside the package; a wire for electrically connecting the LED chip and the electrode; and a phosphor-mixed layer formed on the surface of the lens adjacent to the light-emission window.

摘要翻译： 表面安装装置型发光二极管（SMD型LED）包括容纳一对或多对电极的封装，封装在其中心具有预定的空间，打开的发光窗口使得光 通过发光窗发射; 形成在所述封装上以覆盖所述发光窗的透镜; 形成在封装内的电极上的LED芯片; 用于电连接LED芯片和电极的导线; 以及形成在与发光窗相邻的透镜的表面上的磷光体混合层。