摘要:
A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front surface of a semiconductor wafer, back grinding a rear surface of the semiconductor wafer while the protection tape faces downward, loading the semiconductor wafer to dicing equipment when the front surface having the protection tape faces downward, detecting a dicing position formed on the front surface of the semiconductor wafer, and dicing the semiconductor wafer with the protection tape adhering thereon into individual semiconductor chips in accordance with the detected dicing position. The dicing equipment may have a transparent aligning part for aligning the semiconductor wafer and a chuck part for supporting the semiconductor wafer.
摘要:
A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front surface of a semiconductor wafer, back grinding a rear surface of the semiconductor wafer while the protection tape faces downward, loading the semiconductor wafer to dicing equipment when the front surface having the protection tape faces downward, detecting a dicing position formed on the front surface of the semiconductor wafer, and dicing the semiconductor wafer with the protection tape adhering thereon into individual semiconductor chips in accordance with the detected dicing position. The dicing equipment may have a transparent aligning part for aligning the semiconductor wafer and a chuck part for supporting the semiconductor wafer.
摘要:
A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front surface of a semiconductor wafer, back grinding a rear surface of the semiconductor wafer while the protection tape faces downward, loading the semiconductor wafer to dicing equipment when the front surface having the protection tape faces downward, detecting a dicing position formed on the front surface of the semiconductor wafer, and dicing the semiconductor wafer with the protection tape adhering thereon into individual semiconductor chips in accordance with the detected dicing position. The dicing equipment may have a transparent aligning part for aligning the semiconductor wafer and a chuck part for supporting the semiconductor wafer.
摘要:
A semiconductor chip package may have through holes extending from a chip contact surface of a film type die attaching material to a second surface of a die pad. A resin encapsulant may extend into the through holes to directly contact portions of a semiconductor chip that are superposed over the through holes. The through holes may be formed using a stamping method.
摘要:
A semiconductor chip package may include functional and packaging parts, which may be separated into first and second areas respectively, and designated only for a specific type of semiconductor material. The first area may be designated only for functional material, while the second area may be designated only for packaging material. The first area may include a semiconductor chip and/or passive elements, while the second area may include packaging material for example, solder and/or contact pads.
摘要:
A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front surface of a semiconductor wafer, back grinding a rear surface of the semiconductor wafer while the protection tape faces downward, loading the semiconductor wafer to dicing equipment when the front surface having the protection tape faces downward, detecting a dicing position formed on the front surface of the semiconductor wafer, and dicing the semiconductor wafer with the protection tape adhering thereon into individual semiconductor chips in accordance with the detected dicing position. The dicing equipment may have a transparent aligning part for aligning the semiconductor wafer and a chuck part for supporting the semiconductor wafer.
摘要:
A semiconductor chip package may have through holes extending from a chip contact surface of a film type die attaching material to a second surface of a die pad. A resin encapsulant may extend into the through holes to directly contact portions of a semiconductor chip that are superposed over the through holes. The through holes may be formed using a stamping method.
摘要:
A partially sulfonated polybenzimidazole based polymer for fuel cell membrane is prepared by copolymerizing monomers of 3,3′-diaminobenzidine, isophthalic acid and 5-sulfoisophthalic acid to obtain a partially sulfonated polybenzimidazole, and doping the partially sulfonated polybenzimidazole with inorganic acid.
摘要:
A method of wire bonding, a semiconductor chip, and a semiconductor package provides stitch-stitch bonds of a wire on a bond pad of a chip as well as on a bond position of a substrate. A ball-stitch bump is formed on an end of the wire extending from a capillary or provided on the bond pad of the chip. A ball-stitch bump is formed on the bond pad of the chip by pressing down the ball of the wire on the bond pad. A ball-stitch stitch bond of the wire is formed on the ball-stitch bump by pressing down the wire on the ball-stitch bump. The capillary is moved from the bond pad to the bond position, while loosening the wire. A stitch bond of the wire is formed on the bond position by pressing down the wire on the bond position, and then separated from the wire within the capillary. The method of wire bonding, a semiconductor chip, and a semiconductor package can reduce or minimize a moving path of the capillary and provide more effective wire bonding.
摘要:
Provided herein are multi-chip modules (MCMs) having bonding wires and fabrication methods thereof. The multi-chip module includes a substrate and a plurality of chips sequentially stacked. At least one top chip, stacked above a lowest chip, has an insulating film that covers the backside thereof. Also, each of the stacked chips has bonding pads formed on the periphery or edges of its upper surface. At least one insulator is interposed between the stacked chips. The insulator exposes the pads on the underlying chip. The pads of the respective chips are connected to a set of interconnections, which are disposed on the substrate. This configuration of stacked chips enables the overall height of the memory module to be reduced because the insulating film prevents the bonding wires from contacting the substrate of the top chips.