摘要:
A method of programming a nonvolatile memory device may include applying a program voltage to a memory cell. A supplementary pulse may be applied to the memory cell to facilitate thermalization of charges after the application of the program voltage. A recovery voltage may be applied to the memory cell after the application of the supplementary pulse. A program state of the memory cell may be verified using a verification voltage after the application of the recovery voltage.
摘要:
A method of programming a nonvolatile memory device may include applying a program voltage to a memory cell. A supplementary pulse may be applied to the memory cell to facilitate thermalization of charges after the application of the program voltage. A recovery voltage may be applied to the memory cell after the application of the supplementary pulse. A program state of the memory cell may be verified using a verification voltage after the application of the recovery voltage.
摘要:
Provided is a method of operating a nonvolatile memory device to perform an erase operation. The method includes applying a composite pulse including a direct current (DC) pulse and a DC perturbation pulse to the nonvolatile memory device to perform the erase operation.
摘要:
Provided is a method of operating a nonvolatile memory device to perform an erase operation. The method includes applying a composite pulse including a direct current (DC) pulse and a DC perturbation pulse to the nonvolatile memory device to perform the erase operation.
摘要:
Semiconductor devices are specially made to be amenable to group testing, with special testing apparatus. The devices include at least one additional pad, and a special circuit that includes at least one fuse. After DC testing, the fuse may be cut if the device is flawed. The power supply is then redirected through the additional pad for subsequent AC testing. The circuit is such that, if the fuse were cut, the device is removed from the group, so as not to affect the other devices of the group. But if the fuse were not cut, the device is included for the AC testing.
摘要:
A method for erasing data stored in a memory having a plurality of memory sectors is disclosed, including the steps of loading at least a dummy address bit and a plurality of address bits, checking whether an address corresponding to a first sector has been latched, and recycling the checking operation against a second sector when the address of the first sector is not latched, and performing an erase operation for a sector assigned to an address latched therein until the erase operation is done for a last sector. The address includes the dummy address bit and the address bits, so that a coding logic can be simplified without identifying with the logic configuration of a programming mode.
摘要:
A flash memory device includes a word line decoder configured to receive a row address, and decode a selected word line and a neighboring non-selected word line corresponding to the row address during a read operation, and a word line driver configured to receive data identifying the selected word line and the neighboring non-selected word line from the word line decoder, and applying a read voltage to the selected word line, a first voltage to non-selected word lines other than the neighboring non-selected word line, and a second voltage to the neighboring non-selected word line.
摘要:
Methods are provided for testing many semiconductor devices simultaneously. The devices are connected in a group, and checked for DC-type defects. Those identified to have such a defect are electrically disconnected from the group, and thus also from further group testing. Then testing in the AC mode is performed. The disconnected devices do not sense the AC testing, and the defect does not affect the testing of the others. Semiconductor devices are also provided that are amenable to such testing. These include additional pads, and a special circuit that includes at least one fuse. Disconnection is by cutting the fuse of a device identified to be defective. While afterwards testing for AC-type defects, the power supply and the ground is applied through the additional pads. This grounds the power line of defective chips.