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公开(公告)号:US20150163921A1
公开(公告)日:2015-06-11
申请号:US14102676
申请日:2013-12-11
申请人: Sasha Oster , Robert L. Sankman , Charles Gealer , Omkar Karhade , John S. Guzek , Ravi V. Mahajan , James C. Matayabas, JR. , Johanna Swan , Feras Eid , Shawna Liff , Timothy McIntosh , Telesphor Teles Kamgaing , Adel Elsherbini , Kemal Aygun
发明人: Sasha Oster , Robert L. Sankman , Charles Gealer , Omkar Karhade , John S. Guzek , Ravi V. Mahajan , James C. Matayabas, JR. , Johanna Swan , Feras Eid , Shawna Liff , Timothy McIntosh , Telesphor Teles Kamgaing , Adel Elsherbini , Kemal Aygun
CPC分类号: H05K1/189 , G06F1/163 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2924/12042 , H01L2924/181 , H01L2924/18162 , H05K1/0393 , H05K1/181 , H05K1/185 , H05K13/0469 , H05K2201/0137 , H05K2203/1469 , Y10T29/49146 , H01L2924/00
摘要: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.
摘要翻译: 本公开一般涉及用于制造柔性微电子组件的装置,系统和方法。 在一个实例中,聚合物模制在微电子部件上,聚合物模具在模制之后呈现基本刚性的状态。 相对于微电子部件和聚合物模具形成布线层,布线层包括电耦合到微电子部件的迹线。 输入被施加到聚合物模具,聚合物模具在施加输入时从基本刚性状态转变到基本上柔性的状态。
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公开(公告)号:US20170086510A1
公开(公告)日:2017-03-30
申请号:US14865440
申请日:2015-09-25
申请人: Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Braxton Lathrop , Nadine L. Dabby , Feras Eid
发明人: Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Braxton Lathrop , Nadine L. Dabby , Feras Eid
CPC分类号: A41D1/002 , G06F1/163 , H05K1/0283 , H05K1/0296 , H05K1/038 , H05K2201/0133 , H05K2201/09263 , H05K2201/10098 , H05K2201/10151
摘要: Some forms relate to an electronic system that includes a textile. The electronic system includes a stretchable body that includes an integrated circuit that is configured to compute and communicate with an external device, wherein the stretchable body further includes at least one of (i) a power source that provides power to at least one of the electronic components; (ii) at least one sensor; (iii) a sensing node that receives signals from each sensor and sends signals to the integrated circuit; and (iv) an antenna that is configured to send and receive signals to and from the integrated circuit and the external device; and a textile attached to the stretchable body.
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公开(公告)号:US20170094749A1
公开(公告)日:2017-03-30
申请号:US14866625
申请日:2015-09-25
申请人: Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
发明人: Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
CPC分类号: H05B33/28 , A41B1/08 , A41D1/002 , A42B1/004 , A42B1/242 , F21V33/0008 , H05B33/04 , H05B33/06
摘要: Some forms relate to a stretchable computing display device. The stretchable computing display device includes a stretchable base; a patterned conductive section mounted on the stretchable base, wherein the patterned conductive section includes a first portion and a second portion that is electrically isolated from the first portion; an electroluminescent material mounted on the stretchable base such that the electroluminescent material is between the first portion and the second portion of the patterned conductive section; an encapsulant that covers at least a portion of the patterned conductive section; and a textile such that the stretchable base is mounted on the textile, wherein the textile is part of a garment.
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公开(公告)号:US20180097268A1
公开(公告)日:2018-04-05
申请号:US15282050
申请日:2016-09-30
申请人: Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
发明人: Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
CPC分类号: H01P3/122 , H01P3/14 , H01P3/16 , H01P11/006
摘要: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.
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公开(公告)号:US20190003854A1
公开(公告)日:2019-01-03
申请号:US15636599
申请日:2017-06-28
IPC分类号: G01C25/00 , G01C19/5656
CPC分类号: G01C25/005 , G01C19/5656 , G01P1/00 , G01P1/023 , G01P15/0802 , G01P15/097 , G01P15/18 , G01P21/00 , G01P2015/084
摘要: An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.
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公开(公告)号:US20180084643A1
公开(公告)日:2018-03-22
申请号:US15267872
申请日:2016-09-16
申请人: Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
发明人: Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
CPC分类号: H05K1/147 , A61B5/00 , A61B5/6833 , A61B2562/164 , A61B2562/166 , H05K1/0283 , H05K1/112 , H05K1/181 , H05K3/365 , H05K2201/10151 , H05K2201/10265 , H05K2201/10303 , H05K2201/10318
摘要: A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.
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公开(公告)号:US20170172421A1
公开(公告)日:2017-06-22
申请号:US14971800
申请日:2015-12-16
申请人: Nadine L. Dabby , Adel A. Elsherbini , Sasha Oster , Braxton Lathrop , Aleksandar Aleksov , Feras Eid
发明人: Nadine L. Dabby , Adel A. Elsherbini , Sasha Oster , Braxton Lathrop , Aleksandar Aleksov , Feras Eid
IPC分类号: A61B5/0205 , G06F3/01 , A61B5/00
CPC分类号: A61B5/0205 , A61B5/024 , A61B5/08 , A61B5/11 , A61B5/113 , A61B5/6804 , A61B2562/0219 , A61B2562/12 , G06F3/011 , G06F3/014 , G06F3/017
摘要: A sensor assembly configured to monitor one or more physiological characteristics includes a deformable substrate. The deformable substrate includes a body side interface. Substrate conductive traces are coupled with the deformable substrate. Two or more physiological sensor elements are coupled with the deformable substrate. The two or more physiological sensor elements include at least first and second sensor elements. The first sensor element includes a first piezo element in a first orientation along the deformable substrate, the first sensor element is electrically coupled with the substrate conductive traces. The second sensor element includes a second piezo element in a second orientation along the deformable substrate different than the first orientation, the second sensor element is electrically coupled with the substrate conductive traces.
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公开(公告)号:US20170083051A1
公开(公告)日:2017-03-23
申请号:US14859894
申请日:2015-09-21
申请人: Nadine L. Dabby , Lakshman Krishnamurthy , Braxton Lathrop , Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Tom L. Simmons
发明人: Nadine L. Dabby , Lakshman Krishnamurthy , Braxton Lathrop , Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Tom L. Simmons
IPC分类号: G06F1/16
CPC分类号: G06F1/1633 , H01L23/5385 , H01L23/5387 , H01L25/105 , H01L2225/1017 , H01L2225/1047 , H01L2924/00
摘要: Some forms relate to a method of making a stretchable computing system. The method includes attaching a first set of conductive traces to a stretchable member; attaching a first electronic component to the first set of conductive traces; adding a first set of flexible conductors to the stretchable member such that the first set of flexible conductors is electrically connected to the first set of conductive traces; adding stretchable material to the stretchable member such that the first set of conductive traces is surrounded by the stretchable member; forming an opening in the stretchable member that exposes the first set of conductive traces; and attaching a second set of conductive traces to the stretchable member such that the second set of conductive traces fills the opening to form a via in the stretchable member that electrically connects the first set of conductive traces with the second set of conductive traces.
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公开(公告)号:US20170287736A1
公开(公告)日:2017-10-05
申请号:US15085538
申请日:2016-03-30
CPC分类号: H01L23/315 , H01L21/56 , H01L23/3128 , H01L23/42 , H01L23/4334 , H01L23/467 , H01L2224/16227 , H01L2224/97 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/19105 , H01L2924/3511 , H01L2224/81
摘要: Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial material. The electronics package that includes this sacrificial material is then overmolded, with little or no change needed in the overmolding process. Following overmolding, the sacrificial material is removed such as using a thermal, chemical, optical, or other decomposing process. This proposed use of sacrificial material allows for formation of complex 3-D cavities, and reduces or eliminates the need for precise material removal tolerances. Multiple instances of the sacrificial material may be removed simultaneously, replacing a serial drilling process with a parallel material removal manufacturing process.
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