公开(公告)号：US08852754B2

公开(公告)日：2014-10-07

申请号：US13574478

申请日：2011-01-21

申请人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

发明人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

IPC分类号： B32B15/20 ,  C25D3/56 ,  C22C19/00 ,  B32B15/01 ,  C25D5/48 ,  B32B15/08 ,  C22C19/03 ,  C25D5/34 ,  H05K3/38

CPC分类号： C25D5/34 ,  B32B15/01 ,  B32B15/08 ,  B32B2457/00 ,  C22C19/002 ,  C22C19/03 ,  C25D3/562 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12792 ,  Y10T428/12882 ,  Y10T428/1291

摘要： Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni—Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dm2 or more.

摘要翻译： 提供了一种工业上优异的表面处理铜箔，其满足对聚酰亚胺等绝缘树脂的粘合性，耐热粘合性，耐化学性和软蚀刻性能。 还提供了一种在绝缘树脂和铜箔之间实现高粘合强度的表面处理铜箔的制造方法，在电路形成中表现出高的耐化学性，并且在通过激光加工形成通孔之后保持良好的软蚀刻性能。 对基底铜箔进行粗糙化处理，得到表面粗糙度（Rz）为1.1μm以下。 在粗糙化表面上形成Ni-Zn合金层。 上述粗糙化处理是这样进行的：粗糙表面包括宽度为0.3-0.8μm，高度为0.6-1.8μm，纵横比为1.2-3.5的尖锐凸面，表面粗糙度 所述基底铜箔的（Rz）增加0.05-0.3μm。 上述Ni-Zn合金层的Zn含量为6-30重量％，Zn沉积量为0.08mg / dm 2以上。

公开(公告)号：US08557392B2

公开(公告)日：2013-10-15

申请号：US13055375

申请日：2009-07-22

申请人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

发明人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

IPC分类号： B32B15/08 ,  H05K1/09

CPC分类号： H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  C25D1/04 ,  C25D3/562 ,  C25D3/565 ,  C25D5/48 ,  C25D7/0614 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/31663 ,  Y10T428/31681

摘要： In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.

摘要翻译： 为了在由铜箔形成的柔性层压电路板中提供一种柔性层叠电路板，该柔性层压电路板使用表面处理铜箔来满足所有铜箔的相对于聚酰亚胺的接合强度，耐酸性和蚀刻性能 铜箔是通过在未处理的铜箔的至少一个表面上沉积Ni-Zn合金形成的表面处理铜箔，并且沉积的Ni-Zn合金中的Zn沉积量为6％ （Ni沉积量+ Zn沉积量）以上且15％以下，并且Zn沉积量为0.08mg / dm 2以上，以提供柔性覆铜层压板。

公开(公告)号：US20110189501A1

公开(公告)日：2011-08-04

申请号：US13055375

申请日：2009-07-22

申请人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

发明人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

IPC分类号： B32B15/08 ,  B32B15/088

CPC分类号： H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  C25D1/04 ,  C25D3/562 ,  C25D3/565 ,  C25D5/48 ,  C25D7/0614 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/31663 ,  Y10T428/31681

摘要： In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible cupper clad laminate.

摘要翻译： 为了在由铜箔形成的柔性层压电路板中提供一种柔性层叠电路板，该柔性层压电路板使用表面处理铜箔来满足所有铜箔的相对于聚酰亚胺的接合强度，耐酸性和蚀刻性能 铜箔是通过在未处理的铜箔的至少一个表面上沉积Ni-Zn合金形成的表面处理铜箔，并且沉积的Ni-Zn合金中的Zn沉积量为6％ （Ni沉积量+ Zn沉积量）以上且15％以下，并且Zn沉积量为0.08mg / dm 2以上，以提供柔性的覆铜层压板。

公开(公告)号：US20130040162A1

公开(公告)日：2013-02-14

申请号：US13574478

申请日：2011-01-21

申请人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

发明人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

IPC分类号： B32B15/08 ,  B32B37/14 ,  B05D7/14 ,  B05D5/00 ,  B32B15/04 ,  B32B33/00

CPC分类号： C25D5/34 ,  B32B15/01 ,  B32B15/08 ,  B32B2457/00 ,  C22C19/002 ,  C22C19/03 ,  C25D3/562 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12792 ,  Y10T428/12882 ,  Y10T428/1291

摘要： Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni—Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dm2 or more.

摘要翻译： 提供了一种工业上优异的表面处理铜箔，其满足对聚酰亚胺等绝缘树脂的粘合性，耐热粘合性，耐化学性和软蚀刻性能。 还提供了一种在绝缘树脂和铜箔之间实现高粘合强度的表面处理铜箔的制造方法，在电路形成中表现出高的耐化学性，并且在通过激光加工形成通孔之后保持良好的软蚀刻性能。 对基底铜箔进行粗糙化处理，得到表面粗糙度（Rz）为1.1μm以下。 在粗糙化表面上形成Ni-Zn合金层。 上述粗糙化处理是这样进行的：粗糙表面包括宽度为0.3-0.8μm，高度为0.6-1.8μm，纵横比为1.2-3.5的尖锐凸面，表面粗糙度 所述基底铜箔的（Rz）增加0.05-0.3μm。 上述Ni-Zn合金层的Zn含量为6-30重量％，Zn沉积量为0.08mg / dm 2以上。

公开(公告)号：US08512873B2

公开(公告)日：2013-08-20

申请号：US13055353

申请日：2009-07-22

申请人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

发明人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

IPC分类号： B32B15/20

CPC分类号： H05K3/384 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/20 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/538 ,  B32B2307/714 ,  B32B2457/08 ,  C22C19/03 ,  C25D3/562 ,  C25D7/0614 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/12993

摘要： To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.

摘要翻译： 为了提供满足与聚酰亚胺膜的全部接合强度的表面处理铜箔，耐化学性和蚀刻性能，并且使用表面处理铜箔提供CCL，形成表面处理铜箔，其包括未处理的铜箔 其中Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积物的至少一个表面为Ni-Zn合金，Zn沉积量 量为0.08mg / dm 2以上，或者由表面处理铜箔和层叠在表面处理铜箔上的聚酰亚胺膜形成CCL，其中表面处理铜箔在至少一个表面上包含未处理的铜箔 其中沉积Ni-Zn合金，Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积量为0.08mg / dm2以上。

公开(公告)号：US20110189499A1

公开(公告)日：2011-08-04

申请号：US13055353

申请日：2009-07-22

申请人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

发明人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

IPC分类号： C25D7/06 ,  B32B15/088 ,  B32B15/01

CPC分类号： H05K3/384 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/20 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/538 ,  B32B2307/714 ,  B32B2457/08 ,  C22C19/03 ,  C25D3/562 ,  C25D7/0614 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/12993

摘要： To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.

摘要翻译： 为了提供满足与聚酰亚胺膜的全部接合强度的表面处理铜箔，耐化学性和蚀刻性能，并且使用表面处理铜箔提供CCL，形成表面处理铜箔，其包括未处理的铜箔 其中Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积物的至少一个表面为Ni-Zn合金，Zn沉积量 量为0.08mg / dm 2以上，或者由表面处理铜箔和层叠在表面处理铜箔上的聚酰亚胺膜形成CCL，其中表面处理铜箔在至少一个表面上包含未处理的铜箔 其中沉积Ni-Zn合金，Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积量为0.08mg / dm2以上。

公开(公告)号：US20120285734A1

公开(公告)日：2012-11-15

申请号：US13574377

申请日：2011-01-21

申请人： Takeo Uno ,  Satoshi Fujisawa

发明人： Takeo Uno ,  Satoshi Fujisawa

IPC分类号： B32B3/00 ,  B32B15/08 ,  B05D5/02 ,  C25D5/16 ,  B05D5/12 ,  H05K1/09 ,  B21D31/00

CPC分类号： C22C19/03 ,  B32B15/01 ,  C22C19/002 ,  H05K1/09 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  Y10T428/12993 ,  Y10T428/31678

摘要： Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A surface-roughened copper foil, which is obtained by roughening at least one face of a base copper foil (untreated copper foil) so as to increase the surface roughness (Rz) thereof, relative to the surface roughness (Rz) of said base copper foil, by 0.05-0.3 μm and has a roughened surface with a surface roughness (Rz) after roughening of 1.1 μm or less, wherein said roughened surface comprises roughed grains in a sharp-pointed convex shape which have a width of 0.3-0.8 μm, a height of 0.4-1.8 μm and an aspect ratio [height/width] of 1.2-3.5.

摘要翻译： 本发明提供一种在高频范围内形成精细图案化电路和良好的透射性的优异的铜箔，并且对树脂基材具有高粘合性和良好的耐化学性。 通过使基底铜箔（未处理铜箔）的至少一个表面粗糙化以使其表面粗糙度（Rz）相对于所述基底铜箔（未处理铜箔）的表面粗糙度（Rz）增加而获得的表面粗糙化的铜箔 箔，0.05-0.3μm，粗糙化后的表面粗糙度（Rz）为1.1μm以下的粗糙面，其中，粗糙面由粗糙度为0.3〜0.8μm的尖锐的凸状构成， ，高度为0.4-1.8μm，纵横比[高/宽]为1.2-3.5。

公开(公告)号：US20130084463A1

公开(公告)日：2013-04-04

申请号：US13704467

申请日：2011-06-14

申请人： Satoshi Fujisawa

发明人： Satoshi Fujisawa

IPC分类号： B32B15/08 ,  B32B3/26 ,  B32B15/01

CPC分类号： B32B15/08 ,  B32B3/263 ,  B32B15/01 ,  H05K3/022 ,  H05K3/323 ,  H05K3/383 ,  H05K3/384 ,  H05K3/389 ,  H05K2203/0307 ,  Y10T428/12431 ,  Y10T428/12472 ,  Y10T428/31663 ,  Y10T428/31681

摘要： Disclosed is a surface-roughened copper foil that can show excellent adhesion to an anisotropic conductive resin (ACF) and a copper-clad laminate using same. Specifically disclosed is a surface-roughened copper foil which is surface-roughened by surface roughening on at least one surface of a base copper foil (untreated copper foil), wherein the roughening treated surface is finished so that a surface roughness (Ra) of 0.28 μm or more of the adhesion surface of a polyimide film to be adhered to the roughening treated surface.

摘要翻译： 公开了一种表面粗糙化的铜箔，其可以显示出对各向异性导电树脂（ACF）的优异粘附性和使用它的覆铜层压板。 具体公开的是通过在基底铜箔（未处理铜箔）的至少一个表面上进行表面粗化而表面粗糙化的表面粗糙化的铜箔，其中粗糙化处理表面被精加工，使得表面粗糙度（Ra）为0.28 μm以上的要粘附到粗糙化处理表面的聚酰亚胺膜的粘附表面。

公开(公告)号：US07985488B2

公开(公告)日：2011-07-26

申请号：US12827018

申请日：2010-06-30

申请人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

发明人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

IPC分类号： B32B15/00

CPC分类号： H05K3/025 ,  C25D1/04 ,  C25D1/20 ,  Y10T428/12438 ,  Y10T428/12458 ,  Y10T428/12514 ,  Y10T428/12771 ,  Y10T428/12812 ,  Y10T428/1284 ,  Y10T428/12854 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12931

摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性质的金属A形成，金属B由金属A的含量“a”和含量“b 形成释放层的金属B满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。

公开(公告)号：US07892655B2

公开(公告)日：2011-02-22

申请号：US11610799

申请日：2006-12-14

申请人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

发明人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

IPC分类号： B32B15/00

CPC分类号： C25D5/10 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2457/08 ,  H05K3/022 ,  Y10T428/12812 ,  Y10T428/1284 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/24917

摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.

摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄 铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。