公开(公告)号：US06830989B1

公开(公告)日：2004-12-14

申请号：US10069401

申请日：2002-02-26

申请人： Satoshi Shida ,  Shinji Kanayama ,  Takashi Shimizu ,  Kenji Takahashi ,  Ryoji Inutsuka ,  Hiroyuki Yoshida

发明人： Satoshi Shida ,  Shinji Kanayama ,  Takashi Shimizu ,  Kenji Takahashi ,  Ryoji Inutsuka ,  Hiroyuki Yoshida

IPC分类号： H01L21301

CPC分类号： H01L21/67271 ,  H01L21/67144

摘要： Handling of each arrayed component is implemented in pickup operation within a movement range of a supporting body against the size of a supporting region of the arrayed component smaller than that in the prior art. Each component supported on a supporting body in array is moved to a pickup position with a movement of the supporting body in X and Y two component array directions, and is fed to pickup operation by a tool with push-up operation by a push-up pin involved, in which after each unit region (D1 to D4) dividedly set around the pickup position of the supporting body is positioned at a pickup standby position by rotation of the supporting body in a switching manner, the component in the positioned unit region is moved in each component array direction of the supporting body and fed to pickup operation in sequence.

摘要翻译： 在支撑体的移动范围内，在阵列部件的支撑区域的尺寸小于现有技术的尺寸的情况下，每个排列的部件的处理被实现在支撑体的运动范围内的拾取操作。 支撑在阵列中的支撑体上的每个部件通过支撑体在X和Y两个分量阵列方向上的移动而被移动到拾取位置，并且通过具有由上推的上推操作的工具进给到拾取操作 引脚，其中通过以切换方式旋转支撑体而将支撑体的拾取位置分开设置的每个单位区域（D1至D4）定位在拾取备用位置，定位单元区域中的部件为 在支撑体的每个分量阵列方向上移动并依次馈送到拾取操作。

公开(公告)号：US06692214B1

公开(公告)日：2004-02-17

申请号：US10089184

申请日：2002-07-17

申请人： Satoshi Shida ,  Takashi Shimizu ,  Ryoji Inutsuka ,  Hiroaki Hayashi ,  Shinji Kanayama ,  Yuichi Takakura

发明人： Satoshi Shida ,  Takashi Shimizu ,  Ryoji Inutsuka ,  Hiroaki Hayashi ,  Shinji Kanayama ,  Yuichi Takakura

IPC分类号： B65G4700

CPC分类号： B65G47/82 ,  B65G47/06 ,  H05K13/0061 ,  H05K13/02

摘要： A pusher 13 has a leaf spring 12, a driving section 22, a direction changing section 23, and guides 24. The driving section 22 nips the leaf spring to longitudinally advance and retract it. Advancement of a fore end of the leaf spring 12 in a pushing direction causes the object facing the leaf spring to be pushed from a first position to a second position. A direction changing section 23 bends the tail end of the leaf spring relative to the fore end so as to change the direction of advancement and retraction. Guides 24 guide the fore and tail ends with respect to the direction changing section.

摘要翻译： 推动器13具有板簧12，驱动部22，方向改变部23和引导件24.驱动部22夹持板簧以纵向前进和后退。 在推动方向上推进板簧12的前端使得面对板簧的物体从第一位置推到第二位置。 方向改变部23相对于前端弯曲板簧的尾端，以改变前进和后退的方向。 引导件24相对于方向改变部分引导前端和尾端。

公开(公告)号：US06264704B1

公开(公告)日：2001-07-24

申请号：US09266928

申请日：1999-03-12

申请人： Shozo Minamitani ,  Takashi Shimizu ,  Shinji Kanayama ,  Kenji Takahashi ,  Kazushi Higashi ,  Satoshi Shida ,  Naoto Hosotani

发明人： Shozo Minamitani ,  Takashi Shimizu ,  Shinji Kanayama ,  Kenji Takahashi ,  Kazushi Higashi ,  Satoshi Shida ,  Naoto Hosotani

IPC分类号： H01L2100

CPC分类号： H05K13/0417 ,  H01L21/67144 ,  H01L21/6838 ,  H01L24/75 ,  H01L2924/12041 ,  Y10T29/41 ,  H01L2924/00

摘要： A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body.

摘要翻译： 在预先分离的分割部件以存储在存储体中的状态下被供给，由取出和存储单元取出外部，并且通过安装单元将部件安装在分割部件上，从而将分割部件与 组件生产。 多个产生的具有安装在其上的部件的分割部件被收集到存储体中。

公开(公告)号：US06506222B2

公开(公告)日：2003-01-14

申请号：US09873347

申请日：2001-06-05

申请人： Shozo Minamitani ,  Takashi Shimizu ,  Shinji Kanayama ,  Kenji Takahashi ,  Kazushi Higashi ,  Satoshi Shida ,  Naoto Hosotani

发明人： Shozo Minamitani ,  Takashi Shimizu ,  Shinji Kanayama ,  Kenji Takahashi ,  Kazushi Higashi ,  Satoshi Shida ,  Naoto Hosotani

IPC分类号： H01L2100

CPC分类号： H05K13/0417 ,  H01L21/67144 ,  H01L21/6838 ,  H01L24/75 ,  H01L2924/12041 ,  Y10T29/41 ,  H01L2924/00

摘要： A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.

摘要翻译： 在预先分离的分割部件以存储在存储体中的状态下被供给，由取出和存储单元取出外部，并且通过安装单元将部件安装在分割部件上，从而将分割部件与 组件生产。 多个产生的具有安装在其上的部件的分割部件被收集到存储体中。 由于与现有技术相比，组件安装在已经分离的部件上，所以在分割部件和部件之间的连接部分没有引起麻烦，从而有助于提高产品质量。

公开(公告)号：US07827677B2

公开(公告)日：2010-11-09

申请号：US11216074

申请日：2005-09-01

申请人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Takashi Shimizu ,  Satoshi Shida ,  Shunji Onobori

发明人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Takashi Shimizu ,  Satoshi Shida ,  Shunji Onobori

IPC分类号： H05K13/04

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187

摘要： A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

摘要翻译： 组件安装系统包括第一到第三（拾取，传输和放置）站。 在部件供应处提供的部件由拾取站处的运送头拾取，然后转移到转运站的放置头。 放置头将组件携带到放置位置，其中组件被放置并安装到诸如电路板的衬底上。 当由放置头保持的部件被成像装置识别在转印站处或其附近。

公开(公告)号：US5894657A

公开(公告)日：1999-04-20

申请号：US569937

申请日：1995-12-08

申请人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Shida ,  Kohei Enchi ,  Kenji Takahashi

发明人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Shida ,  Kohei Enchi ,  Kenji Takahashi

IPC分类号： H01L21/50 ,  H01L21/52 ,  H05K13/00 ,  H05K13/02 ,  H05K13/04 ,  H05K13/08 ,  H05K3/30

CPC分类号： H05K13/0408 ,  H05K13/0069 ,  H05K13/02 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： An electronic component mounting apparatus includes a feeding device for feeding a to-be-placed element including an electronic component, an anisotropic conductive film, or a paste, a holding device for holding the fed element, an element moving device for supporting and moving the holding device in a first direction and placing the element held by the holding device on a circuit board, and a board moving device for holding and moving the circuit board in a second direction generally at right angles to the first direction where the element moving device is moved.

摘要翻译： 一种电子部件安装装置，包括：馈送装置，用于馈送包括电子部件，各向异性导电膜或糊状物的待放置元件，用于保持馈送元件的保持装置;用于支撑和移动的元件移动装置 保持装置在第一方向上并且将由保持装置保持的元件放置在电路板上，以及板移动装置，用于沿着与元件移动装置的第一方向成直角的第二方向保持和移动电路板 移动了

公开(公告)号：US5783915A

公开(公告)日：1998-07-21

申请号：US589005

申请日：1996-01-19

申请人： Satoshi Shida ,  Akira Kabeshita ,  Shinji Kanayama ,  Kenji Takahashi ,  Makoto Imanishi ,  Osamu Nakao

发明人： Satoshi Shida ,  Akira Kabeshita ,  Shinji Kanayama ,  Kenji Takahashi ,  Makoto Imanishi ,  Osamu Nakao

IPC分类号： H02K7/14 ,  H02K41/035 ,  H02P25/02 ,  H02K41/00 ,  H02K41/02

CPC分类号： H02K41/0356 ,  H02P25/034 ,  H02K7/14

摘要： A linear actuating apparatus includes a shaft moved by a linear actuator means to slide along a center axis. A vertical position detector are provide for detecting the current position of the shaft to produce position signals indicative of detected positions. An actuation controller controls the movement of the shaft based on the position signals from the position detector.

摘要翻译： 线性致动装置包括由线性致动器装置移动以沿着中心轴线滑动的轴。 垂直位置检测器用于检测轴的当前位置以产生指示检测位置的位置信号。 致动控制器基于来自位置检测器的位置信号来控制轴的运动。

公开(公告)号：US20050283972A1

公开(公告)日：2005-12-29

申请号：US11216074

申请日：2005-09-01

申请人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Takashi Shimizu ,  Satoshi Shida ,  Shunji Onobori

发明人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Takashi Shimizu ,  Satoshi Shida ,  Shunji Onobori

IPC分类号： H01L21/60 ,  H05K13/04 ,  H05K13/08 ,  B23P19/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187

摘要： A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

摘要翻译： 组件安装系统包括第一到第三（拾取，传输和放置）站。 在部件供应处提供的部件由拾取站处的运送头拾取，然后转移到转运站的放置头。 放置头将组件携带到放置位置，其中组件被放置并安装到诸如电路板的衬底上。 当由放置头保持的部件被成像装置识别在转印站处或其附近。

公开(公告)号：US07353596B2

公开(公告)日：2008-04-08

申请号：US10549175

申请日：2004-03-18

申请人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

发明人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

摘要翻译： 在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得 向其提供粘合辅助剂，以便将粘合助剂供应的部件安装在板上。 所述部件安装工序包括将所述粘接辅助剂供给到所述多个部件中的第一部件，并且在所述粘接助剂的安装完成之前开始向所述多个部件中的第二部件供给所述粘合辅助剂 代理提供的第一个组件到板上。

公开(公告)号：US07020953B2

公开(公告)日：2006-04-04

申请号：US10239060

申请日：2001-03-23

申请人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Satoshi Shida ,  Shunji Onobori

发明人： Yasuharu Ueno ,  Shozo Minamitani ,  Shinji Kanayama ,  Satoshi Shida ,  Shunji Onobori

IPC分类号： B23P19/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187

摘要： A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

摘要翻译： 组件安装系统包括第一到第三（拾取，传输和放置）站。 在部件供应处提供的部件由拾取站处的运送头拾取，然后转移到转运站的放置头。 放置头将组件携带到放置位置，其中组件被放置并安装到诸如电路板的衬底上。 当由放置头保持的部件被成像装置识别在转印站处或其附近。