Double patterning process
    7.
    发明授权
    Double patterning process 有权
    双重图案化工艺

    公开(公告)号:US08129100B2

    公开(公告)日:2012-03-06

    申请号:US12418090

    申请日:2009-04-03

    摘要: Double patterns are formed by coating a chemically amplified positive resist composition comprising an acid labile group-bearing resin and a photoacid generator and prebaking to form a resist film on a processable substrate, exposing the resist film to high-energy radiation, PEB, and developing with an alkaline developer to form a positive resist pattern, treating the positive resist pattern to be alkali soluble and solvent resistant, coating a negative resist composition and prebaking to form a reversal film, and exposing the reversal film to high-energy radiation, PEB, and developing with an alkaline developer to form a negative resist pattern. The last development step includes the reversal transfer step of dissolving away the positive resist pattern which has been converted to be soluble in developer.

    摘要翻译: 通过涂覆化学放大的正性抗蚀剂组合物形成双重图案,所述正性抗蚀剂组合物包含含酸不稳定基团的树脂和光致酸发生剂和预烘烤以在可加工的基材上形成抗蚀剂膜,将抗蚀剂膜暴露于高能量辐射,PEB和显影 用碱性显影剂形成正的抗蚀剂图案,将正性抗蚀剂图案处理为碱溶性和耐溶剂性,涂覆负性抗蚀剂组合物和预烘烤以形成反转膜,并将反转膜暴露于高能辐射PEB, 并用碱性显影剂显影以形成负的抗蚀剂图案。 最后的显影步骤包括将已被转化为可溶于显影剂的正性抗蚀图案溶解的反转移步骤。

    High molecular weight silicone compounds, chemically amplified positive
resist compositions, and patterning method
    9.
    发明授权
    High molecular weight silicone compounds, chemically amplified positive resist compositions, and patterning method 失效
    高分子量硅氧烷化合物,化学放大正性抗蚀剂组合物和图案化方法

    公开(公告)号:US6066433A

    公开(公告)日:2000-05-23

    申请号:US37023

    申请日:1998-03-09

    IPC分类号: C08G77/14 G03F7/004 G03F7/075

    摘要: In a silicone polymer having phenolic hydroxyl groups, the hydrogen atoms of some of the phenolic hydroxyl groups are replaced by acid labile groups of at least one type. The silicone polymer is crosslinked at some of the remaining phenolic hydroxyl groups with crosslinking groups having C--O--C linkages within a molecule and/or between molecules. The silicone polymer has a Mw of 5,000 to 50,000. A chemically amplified positive resist composition comprising the silicone polymer as a base resin has a high sensitivity and resolution so that it is suitable for fine patterning with electron beams or deep UV. Because of improved oxygen plasma etching resistance, the composition is suitable for use in the two-layer resist technique.

    摘要翻译: 在具有酚羟基的硅氧烷聚合物中,一些酚羟基的氢原子被至少一种类型的酸不稳定基团取代。 硅氧烷聚合物在一些剩余的酚羟基上与在分子内和/或分子之间具有C-O-C键的交联基团交联。 有机硅聚合物的Mw为5,000至50,000。 包含作为基础树脂的硅氧烷聚合物的化学放大型正性抗蚀剂组合物具有高灵敏度和分辨率,使其适用于用电子束或深紫外线精细构图。 由于氧等离子体抗蚀刻性能的改善,组合物适用于双层抗蚀剂技术。

    Positive resist composition
    10.
    发明授权
    Positive resist composition 失效
    正抗蚀剂组成

    公开(公告)号:US5612170A

    公开(公告)日:1997-03-18

    申请号:US569659

    申请日:1995-12-08

    IPC分类号: G03F7/004 G03F7/075 G03C1/73

    摘要: A positive resist composition based on a silicone polymer contains a photo acid generator which will decompose to generate an acid upon exposure to radiation. The silicone polymer includes hydroxybenzyl units wherein some OH groups are replaced by t-butoxycarbonyl, t-butoxycarbonylmethyl, trimethylsilyl or tetrahydropyranyl groups. In a first form, the photo acid generator is a specific onium salt having at least one phenyl group with a t-alkoxy, t-butoxycarbonyloxy or t-butoxycarbonylmethoxy substituent. In a second form, the composition further contains a nitrogenous compound. In a third form, the composition further contains a dissolution inhibitor in the form of a specific silicone compound. The composition is sensitive to high energy radiation and has high sensitivity and resolution.

    摘要翻译: 基于有机硅聚合物的正型抗蚀剂组合物含有光致酸产生剂,其将在暴露于辐射时分解产生酸。 有机硅聚合物包括其中一些OH基被叔丁氧基羰基,叔丁氧基羰基甲基,三甲基甲硅烷基或四氢吡喃基代替的羟基苄基单元。 在第一种形式中,光酸产生剂是具有至少一个具有叔烷氧基,叔丁氧基羰基氧基或叔丁氧基羰基甲氧基取代基的苯基的特定鎓盐。 在第二种形式中,组合物还含有含氮化合物。 在第三种形式中,组合物还含有特定硅氧烷化合物形式的溶解抑制剂。 该成分对高能辐射敏感,灵敏度高,分辨率高。