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23 条记录 (耗时 0.028 秒)

    ARYLAMINE COMPOUND
    3.
    发明申请
    ARYLAMINE COMPOUND 有权
    芳香胺化合物

    公开(公告)号：US20130225858A1

    公开(公告)日：2013-08-29

    申请号：US13779880

    申请日：2013-02-28

    申请人： Daisuke GOTO ,  Takuji Katoh ,  Satoshi Yamamoto ,  Masataka Mohri ,  Satoshi Miyagawa ,  Hajime Nakanotani

    发明人： Daisuke GOTO ,  Takuji Katoh ,  Satoshi Yamamoto ,  Masataka Mohri ,  Satoshi Miyagawa ,  Hajime Nakanotani

    IPC分类号： H01L51/00

    CPC分类号： H01L51/006 ,  C07C219/32 ,  C07C2601/16 ,  C07C2602/10 ,  C07C2603/18 ,  C09B57/008 ,  H01L51/0059 ,  H01L51/5056

    摘要： An arylamine compound including: a partial structure shown in formula (1-1) or (1-2), wherein either X or Y is one of leaving substituents and the other is a hydrogen atom; either (X1, X2) or (Y1, Y2) is one of the leaving substituents respectively and the other is the hydrogen atom respectively; each of Q1, Q2, Q3, Q4, Q5, and Q6 is selected from the hydrogen atom, a halogen atom, organic substituents other than the leaving substituents, and an atomic bonding to link with an adjacent arylamine group respectively; and adjacent two substituents selected from Q1, Q2, Q3, Q4, Q5, and Q6 may be linked together to form the ring which may be a part of an arylamine group.

    摘要翻译： 一种芳胺化合物，包括：式（1-1）或（1-2）所示的部分结构，其中X或Y是离去取代基之一，另一个是氢原子; （X1，X2）或（Y1，Y2）分别为离去取代基之一，另一个为氢原子; Q1，Q2，Q3，Q4，Q5和Q6各自选自氢原子，卤素原子，除离去取代基以外的有机取代基，以及分别与相邻芳基胺基连接的原子键; 并且相邻的选自Q1，Q2，Q3，Q4，Q5和Q6的取代基可以连接在一起形成可以是芳基胺基的一部分的环。

    Arylamine compound
    4.
    发明授权
    Arylamine compound 有权
    芳胺化合物

    公开(公告)号：US09293713B2

    公开(公告)日：2016-03-22

    申请号：US13779880

    申请日：2013-02-28

    申请人： Daisuke Goto ,  Takuji Katoh ,  Satoshi Yamamoto ,  Masataka Mohri ,  Satoshi Miyagawa ,  Hajime Nakanotani

    发明人： Daisuke Goto ,  Takuji Katoh ,  Satoshi Yamamoto ,  Masataka Mohri ,  Satoshi Miyagawa ,  Hajime Nakanotani

    IPC分类号： C07C69/76 ,  H01L51/00 ,  C07C219/32 ,  C09B57/00 ,  H01L51/50

    CPC分类号： H01L51/006 ,  C07C219/32 ,  C07C2601/16 ,  C07C2602/10 ,  C07C2603/18 ,  C09B57/008 ,  H01L51/0059 ,  H01L51/5056

    摘要： An arylamine compound including: a partial structure shown in formula (1-1) or (1-2), wherein either X or Y is one of leaving substituents and the other is a hydrogen atom; either (X1, X2) or (Y1, Y2) is one of the leaving substituents respectively and the other is the hydrogen atom respectively; each of Q1, Q2, Q3, Q4, Q5, and Q6 is selected from the hydrogen atom, a halogen atom, organic substituents other than the leaving substituents, and an atomic bonding to link with an adjacent arylamine group respectively; and adjacent two substituents selected from Q1, Q2, Q3, Q4, Q5, and Q6 may be linked together to form the ring which may be a part of an arylamine group.

    摘要翻译： 一种芳胺化合物，包括：式（1-1）或（1-2）所示的部分结构，其中X或Y是离去取代基之一，另一个是氢原子; （X1，X2）或（Y1，Y2）分别为离去取代基之一，另一个为氢原子; Q1，Q2，Q3，Q4，Q5和Q6各自选自氢原子，卤素原子，除离去取代基以外的有机取代基，以及分别与相邻芳基胺基连接的原子键; 并且相邻的选自Q1，Q2，Q3，Q4，Q5和Q6的取代基可以连接在一起形成可以是芳基胺基的一部分的环。

    Laser control device
    6.
    发明授权
    Laser control device 失效
    激光控制装置

    公开(公告)号：US06683836B2

    公开(公告)日：2004-01-27

    申请号：US09958342

    申请日：2001-12-05

    申请人： Satoshi Miyagawa ,  Kazuo Manabe ,  Norio Imai

    发明人： Satoshi Miyagawa ,  Kazuo Manabe ,  Norio Imai

    IPC分类号： G11B700

    CPC分类号： G11B7/1263 ,  G11B7/0062

    摘要： When the modulation speed of the laser is increased, it is difficult to correctly detect a peak power and a bias power for controlling a laser power. The bias power current Ib is controlled by the operated value of the operation circuit 3 in accordance with the reproduction power current Ir control value of the servo amplifier 5 at the reproduction just before recording, and as for the erase power Pe, since its period is relatively long, the power is detected by the sample-hold circuit 4 and the erase power current Ie is controlled by the operation circuit 3, and the peak power PP is controlled by the operated value of the operation circuit 3 in accordance with the erase power current Ie, and therefore, a bottom hold circuit and a peak hold circuit are not required and the laser control apparatus which does not require the high-speed performance in a photodiode and a monitor circuit is realized to solve the above mentioned problem.

    摘要翻译： 当激光器的调制速度增加时，难以正确地检测用于控制激光功率的峰值功率和偏置功率。 偏置功率电流Ib由操作电路3的操作值根据伺服放大器5在再现刚刚再现之前的再现功率电流Ir控制值进行控制，而对于擦除功率Pe，由于其周期为 相对长的时间，由采样保持电路4检测到电力，并且由操作电路3控制擦除功率电流Ie，并且峰值功率PP由操作电路3的操作值根据擦除功率 电流Ie，因此不需要底部保持电路和峰值保持电路，并且实现了在光电二极管和监视电路中不需要高速性能的激光控制装置来解决上述问题。

    Mold temperature adjusting apparatus/method and mold temperature control unit
    7.
    发明授权
    Mold temperature adjusting apparatus/method and mold temperature control unit 失效
    模具温度调节装置/方法和模具温度控制单元

    公开(公告)号：US07527756B2

    公开(公告)日：2009-05-05

    申请号：US11708561

    申请日：2007-02-21

    申请人： Satoshi Miyagawa ,  Koji Kubota

    发明人： Satoshi Miyagawa ,  Koji Kubota

    IPC分类号： B29C45/73

    CPC分类号： B29C35/007 ,  B29C45/7306 ,  B29C2045/7393 ,  Y02P70/26

    摘要： A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration. The mold temperature adjusting apparatus comprises a high temperature fluid tank and a low temperature fluid tank, a high temperature fluid supply system and a high temperature fluid return system between the mold and the high temperature fluid tank, a low temperature fluid supply system and a low temperature fluid return system between the mold and the low temperature fluid tank, a high temperature fluid by-pass system and a low temperature fluid by-pass system, a heat recovery tank connected to the high temperature fluid tank and a pressure adjusting device.

    摘要翻译： 提供了一种模具温度调节装置，其中通过考虑到模具的加热和冷却中的热传递延迟来调节高温介质和低温介质的转换时间。 模具温度调节装置包括高温流体箱和低温流体箱，高温流体供应系统和模具与高温流体箱之间的高温流体回流系统，低温流体供应系统和低温流体供应系统 模具与低温流体箱之间的高温流体回流系统，高温流体旁通系统和低温流体旁通系统，连接到高温流体箱的热回收罐和压力调节装置。

    Injection molding machine for two-material molding
    9.
    发明授权
    Injection molding machine for two-material molding 有权
    注塑机用于双材料成型

    公开(公告)号：US08550800B2

    公开(公告)日：2013-10-08

    申请号：US13377748

    申请日：2009-12-07

    申请人： Satoshi Miyagawa ,  Naoki Kato ,  Yasuaki Ozeki ,  Hiroto Matsushita ,  Masamitsu Saji ,  Yasuo Okochi ,  Toshihiko Kariya ,  Koji Kubota

    发明人： Satoshi Miyagawa ,  Naoki Kato ,  Yasuaki Ozeki ,  Hiroto Matsushita ,  Masamitsu Saji ,  Yasuo Okochi ,  Toshihiko Kariya ,  Koji Kubota

    IPC分类号： B29C45/73

    CPC分类号： B29C45/1628 ,  B29C45/73

    摘要： It is an object to prevent dies from interfering with each other when the dies are closed and effectively prevent overshoot of cavity temperature while efficiently performing heating of the dies. In an injection molding machine for two-material molding including two sets of a first injecting unit and a second injecting unit that respectively plasticize different resin materials and inject and fill the resin materials, prior to performing injection molding on the first injecting unit side on a secondary side, after injection molding on the second injecting unit side on a primary side, heating of the dies is started before 180-degree rotation of a rotary die plate is completed. After the start of heating, until the 180-degree rotation of the rotary die plate is completed, i.e., die closing is performed, die temperatures are maintained within a temperature range set higher than die temperatures during the heating start and lower than die temperatures during injection.

    摘要翻译： 本发明的目的是在模具闭合时防止模具相互干扰，并且有效地防止腔体温度的过冲，同时有效地执行模具的加热。 在用于双材料成型的注射成型机中，包括两组分别塑化不同树脂材料并注入和填充树脂材料的第一注射单元和第二注射单元，在第一注射单元侧进行注射成型之前， 次级侧，在一次侧的第二注射单元侧注射成型后，在旋转模板的180度旋转完成之前开始模具的加热。 开始加热后，直到旋转模板的180度旋转完成，即执行模具闭合，模具温度保持在设定为高于加热开始时的模具温度的温度范围内，并且低于模具温度 注射。

    INJECTION MOLDING MACHINE AND INJECTION MOLDING METHOD
    10.
    发明申请
    INJECTION MOLDING MACHINE AND INJECTION MOLDING METHOD 有权
    注射成型机和注塑成型方法

    公开(公告)号：US20110049762A1

    公开(公告)日：2011-03-03

    申请号：US12991264

    申请日：2009-08-05

    申请人： Toshihiko Kariya ,  Satoshi Miyagawa ,  Naoki Toda ,  Gen Hamada ,  Michitaka Hattori

    发明人： Toshihiko Kariya ,  Satoshi Miyagawa ,  Naoki Toda ,  Gen Hamada ,  Michitaka Hattori

    IPC分类号： B29C45/78 ,  B29C45/73 ,  B29C45/03

    CPC分类号： B29C45/73 ,  B29C45/78 ,  B29C2045/7368

    摘要： An injection molding machine is provided with a mold forming a cavity into which a resin is injected, a liquid supplying device which supplies a liquid continuously to an internal flow channel of the mold during a preparation period prior to injection of the resin and an injection period in which the resin after the preparation period is injected, an electricity supplying device which supplies electricity to an electric heater arranged on the mold at least during a part of the preparation period, thereby heating the mold, and a controller which carries out a predetermined procedure for making different a temperature of a liquid in the internal flow channel between the preparation period and the injection period.

    摘要翻译： 注射成型机设置有形成注入树脂的空腔的模具，在注射树脂之前的制备期间将液体连续地供给到模具的内部流路的液体供给装置以及注射期间 其中注射了制备期间的树脂后，至少在制备期间的一部分期间向配置在模具上的电加热器供电，从而加热模具的电力供给装置以及执行预定程序的控制器 用于在制备周期和喷射周期之间使内部流动通道中的液体的温度不同。