Method for Fabricating a Non-volatile Memory Device
    3.
    发明申请
    Method for Fabricating a Non-volatile Memory Device 失效
    制造非易失性存储器件的方法

    公开(公告)号:US20120094451A1

    公开(公告)日:2012-04-19

    申请号:US13338048

    申请日:2011-12-27

    IPC分类号: H01L21/8239

    摘要: A method for fabricating a non-volatile memory device with asymmetric source/drain junctions, wherein a gate stack is formed on a semiconductor substrate, and impurity ions are implanted at a predetermined angle to form a source/drain junction in the semiconductor substrate. Thermal treatment of the semiconductor substrate forms an asymmetrically disposed source/drain junction between adjacent gate stacks.

    摘要翻译: 一种用于制造具有不对称源极/漏极结的非易失性存储器件的方法,其中在半导体衬底上形成栅极堆叠,并且以预定角度注入杂质离子以在半导体衬底中形成源极/漏极结。 半导体衬底的热处理在相邻栅极叠层之间形成不对称设置的源极/漏极结。

    METAL LINE OF SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    4.
    发明申请
    METAL LINE OF SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 失效
    金属线半导体器件及其制造方法

    公开(公告)号:US20080014734A1

    公开(公告)日:2008-01-17

    申请号:US11771214

    申请日:2007-06-29

    IPC分类号: H01L21/44

    摘要: A metal line of a semiconductor device comprising contact plugs, a plurality of first trenches, first metal lines, a plurality of second trenches, and second metal lines. The contact plugs are formed over a semiconductor substrate and are insulated from each other by a first insulating layer. The plurality of first trenches are formed in the first insulating layer and are connected to first contact plugs of the contact plugs. The first metal lines are formed within the first trenches and are connected to the first contact plugs. The plurality of second trenches are formed over the first metal lines and the first insulating layer and comprise a second insulating layer connected to second contact plugs of the contact plugs. The second metal lines are formed within the second trenches and are connected to the second contact plugs.

    摘要翻译: 包括接触插塞,多个第一沟槽,第一金属线,多个第二沟槽和第二金属线的半导体器件的金属线。 接触插塞形成在半导体衬底之上并且通过第一绝缘层彼此绝缘。 多个第一沟槽形成在第一绝缘层中并连接到接触插塞的第一接触插塞。 第一金属线形成在第一沟槽内,并连接到第一接触插塞。 多个第二沟槽形成在第一金属线和第一绝缘层之上,并且包括连接到接触插塞的第二接触插塞的第二绝缘层。 第二金属线形成在第二沟槽内并连接到第二接触插塞。