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22 条记录 (耗时 0.019 秒)

    Integrated Circuit Socket
    2.
    发明申请
    Integrated Circuit Socket 有权
    集成电路插座

    公开(公告)号：US20080227310A1

    公开(公告)日：2008-09-18

    申请号：US11687529

    申请日：2007-03-16

    申请人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

    发明人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

    IPC分类号： H01R12/00

    CPC分类号： H01L23/433 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01R12/7076 ,  H05K7/1061 ,  H01L2224/0401

    摘要： Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.

    摘要翻译： 提供了用于封装集成电路的各种插座及其制造方法。 一方面，提供了一种安装半导体芯片的方法，其包括提供具有第一侧和与第一侧相对的第二侧的基底的封装。 第二边有一个中部地区。 该封装包括半导体芯片和连接到第一侧的盖子。 提供了用于接收基底的插座。 插座包括当基底座位于插座中时朝向基底基板的第二侧突出的墩，以为基底基板的中心区域提供支撑。 包装安装在插座中。 土丘为基底的中心区域提供支撑。

    Integrated circuit socket
    3.
    发明授权
    Integrated circuit socket 有权
    集成电路插座

    公开(公告)号：US08297986B2

    公开(公告)日：2012-10-30

    申请号：US11687529

    申请日：2007-03-16

    申请人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

    发明人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

    IPC分类号： H01R12/00

    CPC分类号： H01L23/433 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01R12/7076 ,  H05K7/1061 ,  H01L2224/0401

    摘要： Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.

    摘要翻译： 提供了用于封装集成电路的各种插座及其制造方法。 一方面，提供了一种安装半导体芯片的方法，其包括提供具有第一侧和与第一侧相对的第二侧的基底的封装。 第二边有一个中部地区。 该封装包括半导体芯片和连接到第一侧的盖子。 提供了用于接收基底的插座。 插座包括当基底座位于插座中时朝向基底基板的第二侧突出的墩，以为基底基板的中心区域提供支撑。 包装安装在插座中。 土丘为基底的中心区域提供支撑。

    Method of integrated circuit packaging
    5.
    发明授权
    Method of integrated circuit packaging 有权
    集成电路封装方法

    公开(公告)号：US07513035B2

    公开(公告)日：2009-04-07

    申请号：US11422807

    申请日：2006-06-07

    申请人： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

    发明人： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

    IPC分类号： H05K3/30 ,  H05K3/34

    CPC分类号： H01L23/3675 ,  H01L23/10 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144

    摘要： Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.

    摘要翻译： 提供各种集成电路封装元件。 一方面，提供一种集成电路封装装置，其包括用于覆盖集成电路的盖。 当盖被置于选定位置时，该盖具有用于在集成电路上施加压力的凸面。 在另一方面，提供一种集成电路封装装置，其包括盖，该盖具有当盖处于选定位置时向集成电路施加压力的表面。 金膜耦合到表面。 金膜具有从周边延伸的周边和多个圆。

    Integrated Circuit Packaging
    6.
    发明申请
    Integrated Circuit Packaging 有权
    集成电路封装

    公开(公告)号：US20070284144A1

    公开(公告)日：2007-12-13

    申请号：US11422807

    申请日：2006-06-07

    申请人： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

    发明人： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

    IPC分类号： H01R13/46

    CPC分类号： H01L23/3675 ,  H01L23/10 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144

    摘要： Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.

    摘要翻译： 提供各种集成电路封装元件。 一方面，提供一种集成电路封装装置，其包括用于覆盖集成电路的盖。 当盖被置于选定位置时，该盖具有用于在集成电路上施加压力的凸面。 在另一方面，提供一种集成电路封装装置，其包括盖，该盖具有当盖处于选定位置时向集成电路施加压力的表面。 金膜耦合到表面。 金膜具有从周边延伸的周边和多个圆。