公开(公告)号：US20120161880A1

公开(公告)日：2012-06-28

申请号：US13336817

申请日：2011-12-23

申请人： Sehat Sutardja ,  Poh Boon Leong ,  Ping Song ,  Nuntha Kumar Krishnasamy Maniam

发明人： Sehat Sutardja ,  Poh Boon Leong ,  Ping Song ,  Nuntha Kumar Krishnasamy Maniam

IPC分类号： H03F1/22

CPC分类号： H03F3/211 ,  H03F1/223 ,  H03F3/193 ,  H03F3/245 ,  H03F3/45179 ,  H03F3/45188 ,  H03F2200/408 ,  H03F2200/534 ,  H03F2200/537 ,  H03F2200/541 ,  H03F2203/45544 ,  H03F2203/45562 ,  H03F2203/45566 ,  H03F2203/45621 ,  H03F2203/45644 ,  H03F2203/45731

摘要： A power amplifier includes a first transistor and a first inductor disposed between the first transistor and a voltage source. A first node between the first transistor and the first inductor is an output node. The power amplifier further includes a second inductor disposed between the first transistor and ground The power amplifier further includes a third inductor coupled to a gate of the first transistor and configured as a first AC input. The power amplifier further includes a first phase conditioner inductively coupled to the second inductor and the third inductor and configured to set phases of AC signals across the first inductor and the second inductor in phase. The second inductor is configured to release energy into the first inductor to raise a voltage of the AC signal and raise a power output at the output node.

摘要翻译： 功率放大器包括设置在第一晶体管和电压源之间的第一晶体管和第一电感器。 第一晶体管和第一电感器之间的第一节点是输出节点。 功率放大器还包括设置在第一晶体管和地之间的第二电感器。功率放大器还包括耦合到第一晶体管的栅极并被配置为第一AC输入的第三电感器。 所述功率放大器还包括电感耦合到所述第二电感器和所述第三电感器的第一相位调节器，并且被配置为设置跨越所述第一电感器和所述第二电感器的AC信号的相位。 第二电感器被配置为将能量释放到第一电感器中以提高AC信号的电压并且提高输出节点处的功率输出。

公开(公告)号：US20120161871A1

公开(公告)日：2012-06-28

申请号：US13336785

申请日：2011-12-23

申请人： Sehat Sutardja ,  Poh Boon Leong ,  Ping Song ,  Nuntha Kumar Krishnasamy Maniam

发明人： Sehat Sutardja ,  Poh Boon Leong ,  Ping Song ,  Nuntha Kumar Krishnasamy Maniam

IPC分类号： H03F3/45

CPC分类号： H03F3/45076 ,  H03F1/223 ,  H03F3/21 ,  H03F3/211 ,  H03F3/26 ,  H03F3/265 ,  H03F3/45475 ,  H03F2200/537 ,  H03F2200/541 ,  H03F2203/45731

摘要： A power amplifier includes a push-pull pair of transistors including a first transistor inductively coupled to a voltage source and coupled to a ground, and a second transistor inductively coupled to the ground and coupled to the voltage source. Gates of the first and the second transistors are AC inputs configured to receive an AC signal having a fundamental frequency. Drain regions of the first and the second transistors are, respectively, first and second output nodes. The power amplifier further includes a capacitor coupled between the first output node and the second output node and where the capacitor is configured as a pathway for cancellation of even harmonic signals of the fundamental frequency of the AC signal.

摘要翻译： 功率放大器包括推挽对晶体管，其包括感应耦合到电压源并耦合到地的第一晶体管，以及感应耦合到地并耦合到电压源的第二晶体管。 第一和第二晶体管的栅极是被配置为接收具有基频的AC信号的AC输入。 第一和第二晶体管的漏极区分别是第一和第二输出节点。 功率放大器还包括耦合在第一输出节点和第二输出节点之间的电容器，并且其中电容器被配置为用于消除AC信号的基频的均匀谐波信号的路径。

公开(公告)号：US08629727B2

公开(公告)日：2014-01-14

申请号：US13336817

申请日：2011-12-23

申请人： Sehat Sutardja ,  Poh Boon Leong ,  Ping Song ,  Nuntha Kumar Krishnasamy Maniam

发明人： Sehat Sutardja ,  Poh Boon Leong ,  Ping Song ,  Nuntha Kumar Krishnasamy Maniam

IPC分类号： H03F1/22

CPC分类号： H03F3/211 ,  H03F1/223 ,  H03F3/193 ,  H03F3/245 ,  H03F3/45179 ,  H03F3/45188 ,  H03F2200/408 ,  H03F2200/534 ,  H03F2200/537 ,  H03F2200/541 ,  H03F2203/45544 ,  H03F2203/45562 ,  H03F2203/45566 ,  H03F2203/45621 ,  H03F2203/45644 ,  H03F2203/45731

摘要： A power amplifier includes a first transistor and a first inductor disposed between the first transistor and a voltage source. A first node between the first transistor and the first inductor is an output node. The power amplifier further includes a second inductor disposed between the first transistor and ground The power amplifier further includes a third inductor coupled to a gate of the first transistor and configured as a first AC input. The power amplifier further includes a first phase conditioner inductively coupled to the second inductor and the third inductor and configured to set phases of AC signals across the first inductor and the second inductor in phase. The second inductor is configured to release energy into the first inductor to raise a voltage of the AC signal and raise a power output at the output node.

摘要翻译： 功率放大器包括设置在第一晶体管和电压源之间的第一晶体管和第一电感器。 第一晶体管和第一电感器之间的第一节点是输出节点。 功率放大器还包括设置在第一晶体管和地之间的第二电感器。功率放大器还包括耦合到第一晶体管的栅极并被配置为第一AC输入的第三电感器。 所述功率放大器还包括电感耦合到所述第二电感器和所述第三电感器的第一相位调节器，并且被配置为在同相中跨越所述第一电感器和所述第二电感器设置AC信号的相位。 第二电感器被配置为将能量释放到第一电感器中以提高AC信号的电压并且提高输出节点处的功率输出。

公开(公告)号：US08680924B2

公开(公告)日：2014-03-25

申请号：US13336785

申请日：2011-12-23

申请人： Sehat Sutardja ,  Poh Boon Leong ,  Ping Song ,  Nuntha Kumar Krishnasamy Maniam

发明人： Sehat Sutardja ,  Poh Boon Leong ,  Ping Song ,  Nuntha Kumar Krishnasamy Maniam

IPC分类号： H03F3/26

CPC分类号： H03F3/45076 ,  H03F1/223 ,  H03F3/21 ,  H03F3/211 ,  H03F3/26 ,  H03F3/265 ,  H03F3/45475 ,  H03F2200/537 ,  H03F2200/541 ,  H03F2203/45731

摘要： A differential power amplifier is provided and includes a first pair of transistors. A first transistor is inductively coupled to a voltage source and is connected to a node at a ground reference potential. A second transistor is inductively coupled to the node and is connected to the voltage source. Gates of the transistors are configured to receive an AC signal with a fundamental frequency. Drain of the first and second transistors are respectively first and second output nodes. The output nodes provide a first differential output. A capacitor is connected between the output nodes and provides a pathway for cancellation of even harmonic signals of the fundamental frequency. A second pair of transistors provides a second differential output. A first inductor is connected between the output nodes. A second inductor is connected between output nodes of the second pair of transistors. A combiner is inductively coupled to the inductors.

摘要翻译： 提供差分功率放大器并且包括第一对晶体管。 第一晶体管感应耦合到电压源并且连接到处于接地参考电位的节点。 第二晶体管感应耦合到节点并连接到电压源。 晶体管的栅极被配置为接收具有基频的AC信号。 第一和第二晶体管的漏极分别是第一和第二输出节点。 输出节点提供第一差分输出。 电容器连接在输出节点之间，并提供消除基频的均匀谐波信号的路径。 第二对晶体管提供第二差分输出。 第一个电感连接在输出节点之间。 第二电感器连接在第二对晶体管的输出节点之间。 组合器感应耦合到电感器。

公开(公告)号：US08717103B2

公开(公告)日：2014-05-06

申请号：US13336857

申请日：2011-12-23

申请人： Poh Boon Leong ,  Ping Song ,  Sehat Sutardja

发明人： Poh Boon Leong ,  Ping Song ,  Sehat Sutardja

IPC分类号： H03F3/04

CPC分类号： H03F3/265 ,  H03F1/223 ,  H03F3/193 ,  H03F3/245 ,  H03F2200/306 ,  H03F2200/408 ,  H03F2200/534 ,  H03F2200/537 ,  H03F2200/541

摘要： An amplifier includes a first transistor, and a first inductor disposed between the first transistor and a voltage source. A first output node is between the first transistor and the first inductor. The amplifier further includes a second inductor disposed between the first transistor and ground. The amplifier further includes a second transistor, and a third inductor disposed between the second transistor and a ground. A second output node is between the second transistor and the third inductor. The amplifier further includes a fourth inductor disposed between the second transistor and the voltage source. The amplifier further includes a first capacitor disposed between the first output node and the second output node, and a second capacitor disposed between a first mid-node, which is between the first transistor and the first inductor, and a second mid-node, which is between the second transistor and fourth inductor.

摘要翻译： 放大器包括第一晶体管和设置在第一晶体管和电压源之间的第一电感器。 第一输出节点位于第一晶体管和第一电感器之间。 放大器还包括设置在第一晶体管和地之间的第二电感器。 放大器还包括第二晶体管，以及设置在第二晶体管和地之间的第三电感器。 第二输出节点在第二晶体管和第三电感之间。 放大器还包括设置在第二晶体管和电压源之间的第四电感器。 所述放大器还包括设置在所述第一输出节点和所述第二输出节点之间的第一电容器，以及设置在所述第一晶体管和所述第一电感器之间的第一中间节点和第二中间节点之间的第二电容器， 在第二晶体管和第四电感之间。

公开(公告)号：US20120161879A1

公开(公告)日：2012-06-28

申请号：US13336857

申请日：2011-12-23

申请人： Poh Boon Leong ,  Ping Song ,  Sehat Sutardja

发明人： Poh Boon Leong ,  Ping Song ,  Sehat Sutardja

IPC分类号： H03F3/04

CPC分类号： H03F3/265 ,  H03F1/223 ,  H03F3/193 ,  H03F3/245 ,  H03F2200/306 ,  H03F2200/408 ,  H03F2200/534 ,  H03F2200/537 ,  H03F2200/541

摘要： An amplifier includes a first transistor, and a first inductor disposed between the first transistor and a voltage source. A first output node is between the first transistor and the first inductor. The amplifier further includes a second inductor disposed between the first transistor and ground. The amplifier further includes a second transistor, and a third inductor disposed between the second transistor and a ground. A second output node is between the second transistor and the third inductor. The amplifier further includes a fourth inductor disposed between the second transistor and the voltage source. The amplifier further includes a first capacitor disposed between the first output node and the second output node, and a second capacitor disposed between a first mid-node, which is between the first transistor and the first inductor, and a second mid-node, which is between the second transistor and fourth inductor.

摘要翻译： 放大器包括第一晶体管和设置在第一晶体管和电压源之间的第一电感器。 第一输出节点位于第一晶体管和第一电感器之间。 放大器还包括设置在第一晶体管和地之间的第二电感器。 放大器还包括第二晶体管，以及设置在第二晶体管和地之间的第三电感器。 第二输出节点在第二晶体管和第三电感之间。 放大器还包括设置在第二晶体管和电压源之间的第四电感器。 所述放大器还包括设置在所述第一输出节点和所述第二输出节点之间的第一电容器，以及设置在所述第一晶体管和所述第一电感器之间的第一中间节点和第二中间节点之间的第二电容器， 在第二晶体管和第四电感之间。

公开(公告)号：US08508294B2

公开(公告)日：2013-08-13

申请号：US12983731

申请日：2011-01-03

申请人： Kan Li ,  Poh Boon Leong ,  Sehat Sutardja

发明人： Kan Li ,  Poh Boon Leong ,  Sehat Sutardja

IPC分类号： H03F1/36

CPC分类号： H03F1/34 ,  H03F1/083 ,  H03F1/56 ,  H03F3/191

摘要： In one embodiment, an apparatus includes an amplifier circuit having a phase shift. The amplifier circuit amplifies a signal for wireless transmission. A feedback circuit is coupled to the amplifier circuit and includes a capacitor. An input impedance to the amplifier circuit has a same impedance characteristic as a feedback circuit impedance of the feedback circuit. A total phase shift of the signal for the amplifier circuit and the feedback circuit is less than a threshold.

摘要翻译： 在一个实施例中，一种装置包括具有相移的放大器电路。 放大器电路放大用于无线传输的信号。 反馈电路耦合到放大器电路并且包括电容器。 放大器电路的输入阻抗具有与反馈电路的反馈电路阻抗相同的阻抗特性。 放大器电路和反馈电路的信号的总相移小于阈值。

公开(公告)号：US09466596B2

公开(公告)日：2016-10-11

申请号：US11964696

申请日：2007-12-26

申请人： Sehat Sutardja ,  Ravishanker Krishnamoorthy

发明人： Sehat Sutardja ,  Ravishanker Krishnamoorthy

IPC分类号： H01L29/66 ,  H01L27/02 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/06 ,  H01L29/423 ,  H01L29/78 ,  H01L29/417

CPC分类号： H01L27/0207 ,  H01L21/823437 ,  H01L27/088 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/41725 ,  H01L29/41758 ,  H01L29/4238 ,  H01L29/78 ,  H01L29/7835

摘要： A Metal Oxide Semiconductor (MOS) device formed on a substrate and a method for forming the MOS device. The MOS device includes a drain region, a gate region surrounding the drain region, source regions arranged around the gate region and across from the drain region, and bulk regions arranged around the gate region and separating the source regions. The gate region is formed in a loop around the drain region. In this manner, the on-resistance (Ron) of a MOS device is decreased without also increasing the area of the MOS device.

摘要翻译： 在基板上形成的金属氧化物半导体（MOS）器件和形成MOS器件的方法。 MOS器件包括漏极区域，围绕漏极区域的栅极区域，围绕栅极区域和漏极区域布置的源极区域以及围绕栅极区域布置并分离源极区域的体区域。 栅极区域围绕漏极区域形成环路。 以这种方式，MOS器件的导通电阻（Ron）减小而不增加MOS器件的面积。

公开(公告)号：US09047765B2

公开(公告)日：2015-06-02

申请号：US11171563

申请日：2005-06-30

申请人： Sehat Sutardja

发明人： Sehat Sutardja

IPC分类号： G06F19/00 ,  G08G1/01 ,  G08G1/0967 ,  G08G1/14 ,  G08G1/00

CPC分类号： G08G1/0104 ,  G08G1/096716 ,  G08G1/096741 ,  G08G1/096758 ,  G08G1/096775 ,  G08G1/096791 ,  G08G1/14 ,  G08G1/20

摘要： A traffic information system for a vehicle comprises a transmitter and a global positioning system (GPS) associated with the vehicle that selectively generates location and vector data. A control module receives the location and vector data and wirelessly transmits the location and vector data using the transmitter when the vehicle is traveling on a first set of predetermined roads and does not transmit the location and vector data when the vehicle is traveling on a second set of predetermined roads.

摘要翻译： 用于车辆的交通信息系统包括与车辆相关联的发射机和全球定位系统（GPS），其选择性地生成位置和矢量数据。 当车辆在第一组预定道路上行驶时，控制模块接收位置和矢量数据并使用发射器无线地发送位置和矢量数据，并且当车辆在第二组上行驶时不传送位置和矢量数据 的预定道路。

公开(公告)号：US08860193B2

公开(公告)日：2014-10-14

申请号：US13153181

申请日：2011-06-03

申请人： Sehat Sutardja ,  Shiann-Ming Liou ,  Huahung Kao

发明人： Sehat Sutardja ,  Shiann-Ming Liou ,  Huahung Kao

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/683 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/49503 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/03 ,  H01L24/09 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/023 ,  H01L2224/0231 ,  H01L2224/02371 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Embodiments of the present disclosure provide an electronic package assembly comprising a solder mask layer, the solder mask layer having at least one opening, and a plurality of pads coupled to the solder mask layer, wherein at least one pad of the plurality of pads includes (i) a first side, (ii) a second side, the first side being disposed opposite to the second side, (iii) a terminal portion and (iv) an extended portion, wherein the first side at the terminal portion is configured to receive a package interconnect structure through the at least one opening in the solder mask layer, the package interconnect structure to route electrical signals between a die and another electronic device that is external to the electronic package assembly, and wherein the second side at the extended portion is configured to receive one or more electrical connections from the die. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例提供了一种电子封装组件，其包括焊料掩模层，焊料掩模层具有至少一个开口，以及耦合到焊料掩模层的多个焊盘，其中多个焊盘中的至少一个焊盘包括 i）第一侧，（ii）第二侧，第一侧与第二侧相对设置，（iii）端子部分和（iv）延伸部分，其中端子部分处的第一侧被配置为接收 通过所述焊料掩模层中的所述至少一个开口的封装互连结构，所述封装互连结构以在管芯与所述电子封装组件外部的另一个电子器件之间布置电信号，并且其中在所述延伸部分处的所述第二侧是 被配置为从所述管芯接收一个或多个电连接。 可以描述和/或要求保护其他实施例。