公开(公告)号：US06529619B2

公开(公告)日：2003-03-04

申请号：US09893889

申请日：2001-06-29

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

摘要翻译： 本发明分别提供用于探测器和自动粒子检测机的数据分析台。 并且在数据分析站中，以产品为基础描述芯片的配置的坐标与描述缺陷的位置的坐标相同。 此外，该站提供确定每个缺陷属于哪个芯片的功能。 这些数据分析站通过通信线连接。 本发明能够基于芯片分析数据，从而能够掌握每个芯片上的缺陷引起的芯片与芯片的产品特性之间的关系。

公开(公告)号：US06339653B1

公开(公告)日：2002-01-15

申请号：US09523380

申请日：2000-03-10

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

摘要翻译： 本发明分别提供用于探测器和自动粒子检测机的数据分析台。 并且，在数据分析站中，以产品为基础描述芯片的配置的坐标与描述缺陷的位置的坐标相同。 此外，该站提供确定每个缺陷属于哪个芯片的功能。 这些数据分析站通过通信线连接。 本发明能够基于芯片分析数据，从而能够掌握每个芯片上的缺陷引起的芯片与芯片的产品特性之间的关系。

公开(公告)号：US5841893A

公开(公告)日：1998-11-24

申请号：US908550

申请日：1992-06-30

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： H01L21/66 ,  G01N21/88 ,  G01N21/956 ,  G06K9/00

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

公开(公告)号：US06628817B2

公开(公告)日：2003-09-30

申请号：US09752674

申请日：2001-01-03

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

公开(公告)号：US06330352B1

公开(公告)日：2001-12-11

申请号：US09525527

申请日：2000-03-15

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

公开(公告)号：US06185322B2

公开(公告)日：2001-02-06

申请号：US08958095

申请日：1997-10-27

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

摘要翻译： 本发明分别提供用于探测器和自动粒子检测机的数据分析台。 并且，在数据分析站中，以产品为基础描述芯片的配置的坐标与描述缺陷的位置的坐标相同。 此外，该站提供确定每个缺陷属于哪个芯片的功能。 这些数据分析站通过通信线连接。 本发明能够基于芯片分析数据，从而能够掌握每个芯片上的缺陷引起的芯片与芯片的产品特性之间的关系。

公开(公告)号：US5536128A

公开(公告)日：1996-07-16

申请号：US76190

申请日：1993-06-14

申请人： Sadao Shimoyashiro ,  Takemasa Iwasaki ,  Hiroyuki Kawaji ,  Toyohide Hamada ,  Minoru Ikeda ,  Hiroshi Kikuchi ,  Hiroto Nagatomo

发明人： Sadao Shimoyashiro ,  Takemasa Iwasaki ,  Hiroyuki Kawaji ,  Toyohide Hamada ,  Minoru Ikeda ,  Hiroshi Kikuchi ,  Hiroto Nagatomo

IPC分类号： H01L21/00 ,  H01L21/677 ,  H01L21/683 ,  B65G1/04

CPC分类号： H01L21/67161 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67736 ,  H01L21/67781 ,  H01L21/6838 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S414/14 ,  Y10T29/49904

摘要： An apparatus for carrying a variety of products for effectively processing and carrying plural kinds of works such as semiconductor wafers includes a plurality of processing stations for processing plural kinds of works, a carriage system for carrying plural kinds of works, and a transfer system for delivering works between the carriage system and a processing station. A method for carrying a variety of products is realized in which the carriage system simultaneously carries plural kinds of works between the plurality of processing stations and stops at a predetermined position of the transfer system, whereas the transfer system identifies and delivers the desired kind of work to and from the carriage system.

摘要翻译： 用于承载用于有效处理和携带多种工程如半导体晶片的各种产品的装置包括用于处理多种工程的多个处理站，用于承载多种工程的托架系统和用于传送的传送系统 在运输系统和加工站之间工作。 实现了用于承载各种产品的方法，其中托架系统在多个处理站之间同时承载多种工作，并在传送系统的预定位置停止，而传送系统识别并传送所需类型的工作 往返于运输系统。

公开(公告)号：US4731855A

公开(公告)日：1988-03-15

申请号：US720730

申请日：1985-04-08

申请人： Kyo Suda ,  Shigeharu Kimura ,  Shinobu Hase ,  Chusuke Munakata ,  Kanji Kinameri ,  Yoshitoshi Ito ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Mikihito Saito

发明人： Kyo Suda ,  Shigeharu Kimura ,  Shinobu Hase ,  Chusuke Munakata ,  Kanji Kinameri ,  Yoshitoshi Ito ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Mikihito Saito

IPC分类号： G01N21/956 ,  H01L21/26 ,  G06K9/00

CPC分类号： G01N21/956 ,  H01L21/26

摘要： A pattern defect inspection apparatus detects presence or absence of a defect in a pattern formed on a semiconductor wafer by scanning the pattern normally to the surface thereof by a coherent light beam of a predetermined spot size, detecting reflected diffraction lights generated thereby and processing the detected lights. It comprises an abnormal direction signal detector including photo-detectors having wide light receiving areas arranged in a plurality of spatial areas which the reflected diffraction lights from a normal pattern do not normally reach, a normal pattern detector including photo-detectors having large light receiving areas arranged in a plurality of spatial areas which the reflected diffraction lights from the normal pattern reach, and a defect discriminator for determining if the abnormal direction signals are due to a true defect or not in accordance with the signals from the abnormal direction signal detector and the normal pattern detector.

摘要翻译： 图案缺陷检查装置通过用预定光斑尺寸的相干光束将图案通常扫描到其表面来检测在半导体晶片上形成的图案中的缺陷的存在或不存在，检测由此产生的反射衍射光并且处理检测到的 灯光 它包括异常方向信号检测器，其包括具有布置在多个空间区域中的宽光接收区域的光检测器，正常图案的反射衍射光通常不能正常到达，包括光检测器的正常图案检测器具有大的光接收面积 布置在从正常图案到达的反射衍射光的多个空间区域中，以及用于根据来自异常方向信号检测器的信号和用于确定异常方向信号是否由于真实缺陷而导致的缺陷鉴别器 正常模式检测器

公开(公告)号：US4342515A

公开(公告)日：1982-08-03

申请号：US5924

申请日：1979-01-23

申请人： Masakuni Akiba ,  Hiroto Nagatomo ,  Jun Suzuki

发明人： Masakuni Akiba ,  Hiroto Nagatomo ,  Jun Suzuki

IPC分类号： G01B11/30 ,  G01N21/21 ,  G01N21/95

CPC分类号： G01N21/9501 ,  G01B11/303 ,  G01N21/21 ,  G01N21/94 ,  G01N21/9503

摘要： This invention discloses inspection apparatus for detecting unfavorable foreign matters existent on the surface of an object such as semiconductor wafer. The apparatus includes a collimated beam generator portion which projects a collimated beam towards the object to-be-inspected from a side thereof, and a mechanism which senses light reflected from the surface of the object, through a polarizer plate. In accordance with this invention, the signal-to-noise ratio between a detection signal generated by a pattern of the foreign matter to-be-detected and a signal generated by a normal pattern of the object surface and sensed as a noise component can be enhanced.

摘要翻译： 本发明公开了一种用于检测存在于半导体晶片等物体表面的不利异物的检查装置。 该装置包括：准直光束发生器部分，其将准直光束从其侧面朝向被检查对象投射;以及机构，其通过偏振板感测从物体的表面反射的光。 根据本发明，由待检测的异物的图案产生的检测信号与由物体表面的法线图形产生的并被感测为噪声分量的信号之间的信噪比可以是 增强。

公开(公告)号：US4282825A

公开(公告)日：1981-08-11

申请号：US61049

申请日：1979-07-26

申请人： Hiroto Nagatomo ,  Tetsuya Takagaki ,  Hisao Seki ,  Shirou Terasaki ,  Hitoshi Horimuki

发明人： Hiroto Nagatomo ,  Tetsuya Takagaki ,  Hisao Seki ,  Shirou Terasaki ,  Hitoshi Horimuki

IPC分类号： G03F7/30 ,  B05C3/04 ,  B05C3/10

CPC分类号： G03F7/3021 ,  Y10S134/902

摘要： A surface treatment device capable of carrying out the surface treatment such as washing or etching of plate-like articles such as semiconductor wafers maintaining high degree of reliability, wherein a surface treating liquid is introduced into a ring-like or a conduit-like treating vessel. The plate-like articles to be treated are moved by a conveyor on a conveyor path having a surface in parallel with the surfaces of the plate-like articles against the stream of the treating liquid in a piece-by-piece manner, so that the surfaces of the plate-like articles are treated, whereby the surfaces of the semiconductor wafers can be desirably treated prior to manufacturing the semiconductor products.

摘要翻译： 一种表面处理装置，其能够进行表面处理，例如洗涤或蚀刻保持高可靠性的诸如半导体晶片的板状制品，其中表面处理液体被引入环状或管状的处理容器 。 待处理的板状物品通过输送机在输送路径上移动，该传送路径的表面与板状物体的表面平行地抵靠处理液体的流逐个方式移动，因此， 对板状制品的表面进行处理，由此可以在制造半导体产品之前理想地处理半导体晶片的表面。