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    CLEANING MODULE AND PROCESS FOR PARTICLE REDUCTION
    2.
    发明申请
    CLEANING MODULE AND PROCESS FOR PARTICLE REDUCTION 审中-公开
    清洁模块和减少颗粒过程

    公开(公告)号：US20130185884A1

    公开(公告)日：2013-07-25

    申请号：US13749116

    申请日：2013-01-24

    申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    IPC分类号： B08B1/00

    CPC分类号： B08B1/006 ,  B08B1/04 ,  H01L21/67046 ,  H01L21/67051

    摘要： A method and apparatus for cleaning a substrate are provided. In one embodiment, a particle cleaning module is provided that includes a substrate holder and a pad holder disposed in a housing, and an actuator operable to move the pad holder relative to the substrate holder. The substrate holder is configured to retain and rotate a substrate in a substantially vertical orientation. The pad holder has a pad retaining surface that faces the substrate holder in a parallel and spaced apart relation. The pad holder is rotatable on an axis parallel to an axis on which the substrate holder rotates. The actuator is operable to move the pad holder relative to the substrate holder as to change a distance defined between the first axis and the second axis.

    摘要翻译： 提供了一种用于清洁基板的方法和装置。 在一个实施例中，提供了一种颗粒清洁模块，其包括衬底保持器和设置在壳体中的衬垫保持器，以及可操作以相对于衬底保持器移动衬垫保持器的致动器。 衬底保持器被构造成以基本垂直的方向保持和旋转衬底。 焊盘保持器具有以平行和间隔的关系面对衬底保持器的焊盘保持表面。 衬垫支架可以在平行于衬底支架旋转的轴线的轴线上旋转。 致动器可操作以相对于基板保持器移动焊盘保持器，以改变限定在第一轴线和第二轴线之间的距离。

    APPARATUS AND METHODS FOR BRUSH AND PAD CONDITIONING
    4.
    发明申请
    APPARATUS AND METHODS FOR BRUSH AND PAD CONDITIONING 有权
    布和调节装置及方法

    公开(公告)号：US20110094537A1

    公开(公告)日：2011-04-28

    申请号：US12603771

    申请日：2009-10-22

    申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    IPC分类号： A46B13/00 ,  B08B7/00

    CPC分类号： B24B1/00 ,  A46B13/001 ,  A46B2200/3093 ,  B08B1/002 ,  B08B1/007 ,  B08B1/04 ,  B08B3/041 ,  B08B15/04 ,  B24B37/08 ,  B24B37/20 ,  B24B53/017 ,  B24D13/12 ,  H01L21/67028 ,  H01L21/67046

    摘要： A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

    摘要翻译： 描述了一种用于调节设置在刷盒中的圆柱形辊的处理表面的方法和装置。 在一个实施例中，描述了刷盒。 所述刷盒包括具有至少部分地设置在所述内部容积中的内部容积的容器和一对圆柱形的滚子，每个所述圆柱滚子可围绕相应的轴线旋转，所述致动器组件联接到每个所述圆柱滚子以使 在圆柱滚子接近的第一位置和圆柱滚子彼此分开的第二位置之间的相应的圆柱滚子，以及用于每个圆柱滚子的调节装置，每个调节装置包括设置在内部的调节器 当辊处于第二位置时，调节器接触每个圆柱滚子的外表面。

    Apparatus and methods for brush and pad conditioning
    5.
    发明授权
    Apparatus and methods for brush and pad conditioning 有权
    刷和垫调节的装置和方法

    公开(公告)号：US08813293B2

    公开(公告)日：2014-08-26

    申请号：US13897008

    申请日：2013-05-17

    申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    IPC分类号： A46B13/00 ,  B08B11/00

    CPC分类号： B24B1/00 ,  A46B13/001 ,  A46B2200/3093 ,  B08B1/002 ,  B08B1/007 ,  B08B1/04 ,  B08B3/041 ,  B08B15/04 ,  B24B37/08 ,  B24B37/20 ,  B24B53/017 ,  B24D13/12 ,  H01L21/67028 ,  H01L21/67046

    摘要： A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

    摘要翻译： 描述了一种用于调节设置在刷盒中的圆柱形辊的处理表面的方法和装置。 在一个实施例中，描述了刷盒。 所述刷盒包括具有至少部分地设置在所述内部容积中的内部容积的容器和一对圆柱形的滚子，每个所述圆柱滚子可围绕相应的轴线旋转，所述致动器组件联接到每个所述圆柱滚子以使 在圆柱滚子接近的第一位置和圆柱滚子彼此分开的第二位置之间的相应的圆柱滚子，以及用于每个圆柱滚子的调节装置，每个调节装置包括设置在内部的调节器 当辊处于第二位置时，调节器接触每个圆柱滚子的外表面。

    Apparatus and methods for brush and pad conditioning
    6.
    发明授权
    Apparatus and methods for brush and pad conditioning 有权
    刷和垫调节的装置和方法

    公开(公告)号：US08458843B2

    公开(公告)日：2013-06-11

    申请号：US12603771

    申请日：2009-10-22

    申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    IPC分类号： A46B13/00 ,  B08B11/00

    CPC分类号： B24B1/00 ,  A46B13/001 ,  A46B2200/3093 ,  B08B1/002 ,  B08B1/007 ,  B08B1/04 ,  B08B3/041 ,  B08B15/04 ,  B24B37/08 ,  B24B37/20 ,  B24B53/017 ,  B24D13/12 ,  H01L21/67028 ,  H01L21/67046

    摘要： A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

    摘要翻译： 描述了一种用于调节设置在刷盒中的圆柱形辊的处理表面的方法和装置。 在一个实施例中，描述了刷盒。 所述刷盒包括具有至少部分地设置在所述内部容积中的内部容积的容器和一对圆柱形的滚子，每个所述圆柱滚子可围绕相应的轴线旋转，所述致动器组件联接到每个所述圆柱滚子以使 在圆柱滚子接近的第一位置和圆柱滚子彼此分开的第二位置之间的相应的圆柱滚子，以及用于每个圆柱滚子的调节装置，每个调节装置包括设置在内部的调节器 当辊处于第二位置时，调节器接触每个圆柱滚子的外表面。

    Apparatus for conditioning processing pads
    7.
    发明授权
    Apparatus for conditioning processing pads 有权
    用于调理加工垫的装置

    公开(公告)号：US07828626B2

    公开(公告)日：2010-11-09

    申请号：US12248302

    申请日：2008-10-09

    申请人： Paul D. Butterfield ,  Sen-Hou Ko

    发明人： Paul D. Butterfield ,  Sen-Hou Ko

    IPC分类号： B24B53/00

    CPC分类号： B24B53/017 ,  B24B53/12

    摘要： Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface.

    摘要翻译： 提供了一种用于调理处理垫的装置的实施例。 在一个实施例中，用于调理处理垫的装置包括具有选择性地保持在非平面取向的底表面和设置在构件的底表面上的研磨件的构件。 研磨剂配置用于调理加工垫。 构件和磨料具有产生非平面加工垫表面的轮廓。

    Methods and apparatus for processing a substrate
    9.
    发明申请
    Methods and apparatus for processing a substrate 有权
    用于处理衬底的方法和设备

    公开(公告)号：US20070131654A1

    公开(公告)日：2007-06-14

    申请号：US11299295

    申请日：2005-12-09

    申请人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    发明人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    IPC分类号： C03C15/00 ,  H01L21/306

    CPC分类号： C03C19/00 ,  B24B1/04 ,  B24B9/065 ,  B24B21/004 ,  H01L21/02021

    摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

    摘要翻译： 适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转 衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和 第一斜面作为基底旋转。 提供了许多其他方面。

    LOW COST AND LOW DISHING SLURRY FOR POLYSILICON CMP
    10.
    发明申请
    LOW COST AND LOW DISHING SLURRY FOR POLYSILICON CMP 审中-公开
    低成本和低抛光浆料用于多晶硅CMP

    公开(公告)号：US20070082833A1

    公开(公告)日：2007-04-12

    申请号：US11611027

    申请日：2006-12-14

    申请人： Sen-Hou Ko ,  Kevin Song

    发明人： Sen-Hou Ko ,  Kevin Song

    IPC分类号： C11D3/00 ,  C11D9/20

    CPC分类号： H01L21/3212 ,  C09G1/02 ,  H01L21/7684

    摘要： Methods and compositions are provided for planarizing substrate surfaces with low dishing. Aspects of the invention provide methods of using compositions comprising an abrasive selected from the group consisting of alumina and ceria and a surfactant for chemical mechanical planarization of substrates to remove polysilicon.

    摘要翻译： 提供了用于将低凹陷平坦化基板表面的方法和组合物。 本发明的方面提供使用包含选自氧化铝和二氧化铈的研磨剂的组合物和用于底物的化学机械平面化以除去多晶硅的表面活性剂的方法。