VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME

    公开(公告)号:US20170179025A1

    公开(公告)日:2017-06-22

    申请号:US15256226

    申请日:2016-09-02

    摘要: Vertical memory devices and methods of forming the same are provided. The devices may include a gate line structure including gate lines that are stacked in a first direction and extend in a second direction. The device may also include a first step pattern structure including extended gate lines extending from the gate lines and including first step layers and a second step pattern structure contacting the first step pattern structure, including the extended gate lines and including second step layers. An n-th extended gate line (n is an even number) may be disposed at an upper portion of each of the first step layers, and an (n−1)-th extended gate line may be disposed at an upper portion of each of the second step layers. Each of exposed portions of the (n−1)-th extended gate lines serves as a pad region, and the pad regions have different areas.