公开(公告)号：US07824585B2

公开(公告)日：2010-11-02

申请号：US11882970

申请日：2007-08-08

申请人： Seung-Jin Cheon

发明人： Seung-Jin Cheon

IPC分类号： H01L21/56

CPC分类号： B29C45/7653 ,  B29C45/14655 ,  B29C2945/761 ,  B29C2945/76294 ,  B29C2945/76357 ,  B29C2945/76461 ,  B29C2945/76478 ,  B29C2945/76498 ,  B29C2945/76702 ,  B29C2945/76869 ,  B29C2945/76933 ,  H01L21/565 ,  H01L2924/0002 ,  Y10T29/41 ,  H01L2924/00

摘要： An apparatus for fabricating semiconductor packages may include a thickness measurer configured to measure the thickness of a printed circuit board (PCB); mold dies, clamped to the top and the bottom of the PCB, through which a molding compound may be injected; and a pressure controller configured to control a clamp pressure of the mold die in response to the thickness of the PCB. The thickness of the PCB may be measured before molding the PCB, and a clamp pressure corresponding to the measured thickness may be decided. Therefore, it is possible to adjust the thickness variation of a PCB in real time, as they are being produced, to decrease the number of bad packages.

摘要翻译： 用于制造半导体封装的装置可以包括被配置为测量印刷电路板（PCB）的厚度的厚度测量器; 模具，夹在PCB的顶部和底部，通过该模具可注入模塑料; 以及压力控制器，被配置为响应于PCB的厚度来控制模具的夹紧压力。 可以在模制PCB之前测量PCB的厚度，并且可以确定与测量的厚度相对应的夹紧压力。 因此，可以在制造时实时地调整PCB的厚度变化，以减少不良包装的数量。

公开(公告)号：US20080038848A1

公开(公告)日：2008-02-14

申请号：US11882970

申请日：2007-08-08

申请人： Seung-Jin Cheon

发明人： Seung-Jin Cheon

IPC分类号： H01L21/66 ,  G01B11/06 ,  H01L21/64

CPC分类号： B29C45/7653 ,  B29C45/14655 ,  B29C2945/761 ,  B29C2945/76294 ,  B29C2945/76357 ,  B29C2945/76461 ,  B29C2945/76478 ,  B29C2945/76498 ,  B29C2945/76702 ,  B29C2945/76869 ,  B29C2945/76933 ,  H01L21/565 ,  H01L2924/0002 ,  Y10T29/41 ,  H01L2924/00

摘要： An apparatus for fabricating semiconductor packages may include a thickness measurer configured to measure the thickness of a printed circuit board (PCB); mold dies, clamped to the top and the bottom of the PCB, through which a molding compound may be injected; and a pressure controller configured to control a clamp pressure of the mold die in response to the thickness of the PCB. The thickness of the PCB may be measured before molding the PCB, and a clamp pressure corresponding to the measured thickness may be decided. Therefore, it is possible to adjust the thickness variation of a PCB in real time, as they are being produced, to decrease the number of bad packages.

摘要翻译： 用于制造半导体封装的装置可以包括被配置为测量印刷电路板（PCB）的厚度的厚度测量器; 模具，夹在PCB的顶部和底部，通过该模具可注入模塑料; 以及压力控制器，被配置为响应于PCB的厚度来控制模具的夹紧压力。 可以在模制PCB之前测量PCB的厚度，并且可以确定与测量的厚度相对应的夹紧压力。 因此，可以在制造时实时地调整PCB的厚度变化，以减少不良包装的数量。