摘要:
A memory system includes a memory controller and a memory device. The memory device exchanges data through a first channel with the memory controller, exchanges a first cyclic redundancy check (CRC) code associated with the data through a second channel with the memory controller, and receives a command/address packet including a second CRC code associated with a command/address from the memory controller through a third channel.
摘要:
A memory system includes a memory controller and a memory device. The memory device exchanges data through a first channel with the memory controller, exchanges a first cyclic redundancy check (CRC) code associated with the data through a second channel with the memory controller, and receives a command/address packet including a second CRC code associated with a command/address from the memory controller through a third channel.
摘要:
An on-die termination circuit includes a termination resistor unit connected to an external pin, and a termination control unit connected to the termination resistor unit. The termination resistor unit provides termination impedance to a transmission line connected to the external pin. The termination control unit varies the termination impedance in response to a plurality of bits of strength code associated with a data rate.
摘要:
A stacked semiconductor memory device according to the inventive concepts may include a plurality of memory chips stacked above a processor chip, a plurality of TSVs, and I/O buffers. The TSVs may pass through the memory chips and are connected to the processor chip. I/O buffers may be coupled between all or part of the memory chips and the TSVs and may be selectively activated on the basis of defective states of the TSVs.
摘要翻译:根据本发明构思的叠层半导体存储器件可以包括堆叠在处理器芯片上方的多个存储器芯片,多个TSV和I / O缓冲器。 TSV可以通过存储器芯片并且连接到处理器芯片。 I / O缓冲器可以耦合在所有或部分存储器芯片和TSV之间,并且可以基于TSV的故障状态来选择性地激活。
摘要:
Embodiments may be directed to a method of operating a semiconductor device, the method including receiving a first write training command, receiving a first write data responsive to the first write training command through a first data line, and transmitting the first write data through a second data line. Transmitting the first write data is performed without an additional training command.
摘要:
A stacked semiconductor memory device according to the inventive concepts may include a plurality of memory chips stacked above a processor chip, a plurality of TSVs, and I/O buffers. The TSVs may pass through the memory chips and are connected to the processor chip. I/O buffers may be coupled between all or part of the memory chips and the TSVs and may be selectively activated on the basis of defective states of the TSVs.
摘要翻译:根据本发明构思的叠层半导体存储器件可以包括堆叠在处理器芯片上方的多个存储器芯片,多个TSV和I / O缓冲器。 TSV可以通过存储器芯片并且连接到处理器芯片。 I / O缓冲器可以耦合在所有或部分存储器芯片和TSV之间,并且可以基于TSV的故障状态来选择性地激活。
摘要:
Embodiments may be directed to a method of operating a semiconductor device, the method including receiving a first write training command, receiving a first write data responsive to the first write training command through a first data line, and transmitting the first write data through a second data line. Transmitting the first write data is performed without an additional training command.
摘要:
A method of tuning a phase of a clock signal includes performing data training on a plurality of data pins through which data are input and output, in synchronization with a data clock signal; determining one of the data pins to be a representative pin; performing clock and data recovery (CDR) on read data of the representative pin; and adjusting a phase of the data clock signal based on the CDR.
摘要:
A method of tuning a phase of a clock signal includes performing data training on a plurality of data pins through which data are input and output, in synchronization with a data clock signal; determining one of the data pins to be a representative pin; performing clock and data recovery (CDR) on read data of the representative pin; and adjusting a phase of the data clock signal based on the CDR.
摘要:
A receiving apparatus and method thereof. In an example, the receiving apparatus may include a clock generating unit generating a plurality of internal clock signals based on a received external clock signal and an equalization receiving unit receiving the plurality of internal clock signals and an input signal. The equalization receiving unit may determine an offset value and an equalization coefficient based on the plurality of internal clock signals and the input signal. The equalization receiving unit may adjust a received data signal based on the determined offset value and equalization coefficient.