公开(公告)号：US20110165734A1

公开(公告)日：2011-07-07

申请号：US12985900

申请日：2011-01-06

申请人： Seung-Woo Han ,  Jea-Hyuck Lee ,  Kyu-Sub Kwak ,  Kang-Ho Byun ,  Joon-II Kim ,  Duck-Hwan Kim ,  Kyung-Ho Park ,  Se-Mi Park

发明人： Seung-Woo Han ,  Jea-Hyuck Lee ,  Kyu-Sub Kwak ,  Kang-Ho Byun ,  Joon-II Kim ,  Duck-Hwan Kim ,  Kyung-Ho Park ,  Se-Mi Park

IPC分类号： H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor chip package includes molding a semiconductor chip and a number of passive devices after arranging on a film the semiconductor chip and the passive devices located in a vacant space around the periphery of the semiconductor chip; removing the film, forming an adhesive layer in a film-removed area, and attaching a conductive layer to the adhesive layer; etching a conductive layer to thereby form a conductive circuit pattern; and providing one or more conductive pads, which electrically connect the conductive circuit pattern to the semiconductor chip and to the passive devices.

摘要翻译： 半导体芯片封装的制造方法包括在半导体芯片和位于半导体芯片周围的空白空间中的无源器件的膜上配置半导体芯片和多个无源器件之后， 去除膜，在除膜区域中形成粘合剂层，并将导电层附着到粘合剂层上; 蚀刻导电层从而形成导电电路图案; 以及提供将导电电路图案电连接到半导体芯片和无源器件的一个或多个导电焊盘。

公开(公告)号：US20110228490A1

公开(公告)日：2011-09-22

申请号：US13050378

申请日：2011-03-17

申请人： Yu-Su KIM ,  Kyu-Sub Kwak ,  Young-Min LEE ,  Shi-Yun Cho ,  Jea-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

发明人： Yu-Su KIM ,  Kyu-Sub Kwak ,  Young-Min LEE ,  Shi-Yun Cho ,  Jea-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

IPC分类号： H05K1/18

CPC分类号： H05K3/323 ,  H05K1/189 ,  H05K2201/10159

摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.

摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。

公开(公告)号：US08630096B2

公开(公告)日：2014-01-14

申请号：US13050378

申请日：2011-03-17

申请人： Yu-Su Kim ,  Kyu-Sub Kwak ,  Young-Min Lee ,  Shi-Yun Cho ,  Jae-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

发明人： Yu-Su Kim ,  Kyu-Sub Kwak ,  Young-Min Lee ,  Shi-Yun Cho ,  Jae-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

IPC分类号： H05K1/00 ,  H05K3/32

CPC分类号： H05K3/323 ,  H05K1/189 ,  H05K2201/10159

摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.

摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。

公开(公告)号：US20080192449A1

公开(公告)日：2008-08-14

申请号：US12028864

申请日：2008-02-11

申请人： Dong-Churl Kim ,  Shi-Yun Cho ,  Hong-Kweun Kim ,  Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

发明人： Dong-Churl Kim ,  Shi-Yun Cho ,  Hong-Kweun Kim ,  Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

IPC分类号： H05K7/00

CPC分类号： H05K9/0022 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/10318 ,  H05K2203/1316 ,  H01L2224/0401

摘要： An electric circuit package includes: a printed circuit substrate having an insulating layer and conductive pattern layers formed on an upper surface of the insulating layer; at least one of electronic parts disposed on an upper surface of the printed circuit substrate; at least one of conductive pins electrically connected to an conductive pattern layer providing grounding among the conductive pattern layers; and a molding member formed on the insulating layer in such a manner that the conductive pins and the electric parts are buried in the molding member, wherein each conductive pin has an upper surface exposed to an upper part of the molding member.

摘要翻译： 电路封装包括：印刷电路基板，其具有绝缘层和形成在所述绝缘层的上表面上的导电图案层; 设置在印刷电路基板的上表面上的电子部件中的至少一个; 至少一个导电引脚与导电图案层电连接，在导电图案层之间提供接地; 以及模制构件，其形成在所述绝缘层上，使得所述导电销和所述电气部件被埋在所述模制构件中，其中每个导电销具有暴露于所述模制构件的上部的上表面。

公开(公告)号：US20070152315A1

公开(公告)日：2007-07-05

申请号：US11521038

申请日：2006-09-14

申请人： Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

发明人： Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-die package and a method of fabrication is discloses. The multi-die package includes a package substrate, a first semiconductor die bonded directly on the package substrate and connected electrically with the package substrate, and a second semiconductor die having a groove providing a receiving space, bonded directly on the package substrate so that the first semiconductor die is covered by the groove, and connected electrically with the package substrate.

摘要翻译： 公开了一种多管芯封装及其制造方法。 多管芯封装包括封装基板，直接结合在封装基板上并与封装基板电连接的第一半导体管芯，以及具有提供容纳空间的沟槽的第二半导体管芯，其直接粘合在封装基板上， 第一半导体管芯被沟槽覆盖，并与封装基板电连接。

公开(公告)号：US20070123320A1

公开(公告)日：2007-05-31

申请号：US11432066

申请日：2006-05-11

申请人： Seung-Woo Han ,  Kyu-Sub Kwak ,  Kyung Park

发明人： Seung-Woo Han ,  Kyu-Sub Kwak ,  Kyung Park

IPC分类号： H04M1/00

CPC分类号： H04M1/23 ,  G06F3/0213 ,  G06F3/0362 ,  H04M1/0218 ,  H04M1/233

摘要： A key input device for a portable terminal includes wheel keys capable of rotating in multiple directions and performing a switch function. The key input device including a plurality of keys having at least one wheel keys provided in a main body and rotating in multiple directions, at least one rotating units allowing the wheel keys to rotate in respective directions, and at least one switching units provided under the wheel keys to sense the rotation directions of the wheel keys and to sense a pressure generated by the activation of the rotated wheel keys.

摘要翻译： 用于便携式终端的键输入装置包括能够在多个方向上旋转并执行开关功能的轮键。 所述键输入装置包括多个按键，所述多个按键具有设置在主体中并沿多个方向旋转的至少一个轮键，至少一个允许所述轮键在各个方向上旋转的旋转单元，以及设置在所述主键下方的至少一个切换单元 轮键来感测轮键的旋转方向，并且感测由旋转的轮键的启动而产生的压力。

公开(公告)号：US08237255B2

公开(公告)日：2012-08-07

申请号：US12633433

申请日：2009-12-08

申请人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-Sub Kwak ,  Youn-Ho Choi

发明人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-Sub Kwak ,  Youn-Ho Choi

IPC分类号： H01L23/48

CPC分类号： H05K1/188 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0554

摘要： A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.

摘要翻译： 提供了印刷电路板（PCB），其中至少一个内置集成电路（IC）封装在IC上具有多个导电凸块。 多个导电凸块用于外部电连接。 IC封装通过IC上的连接构件容纳在多层PCB的芯层内。 连接构件形成在导电凸块和芯层之间，其中接触孔与导电凸块接触。 导电凸块通过形成在接触孔中的导体层电连接。

公开(公告)号：US08043892B2

公开(公告)日：2011-10-25

申请号：US12099354

申请日：2008-04-08

申请人： Kyu-Sub Kwak ,  Jae-Hyuck Lee

发明人： Kyu-Sub Kwak ,  Jae-Hyuck Lee

IPC分类号： H01L23/552

CPC分类号： H01L21/561 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor die package includes a substrate, a semiconductor die mounted on the substrates a molding covering the semiconductor die and which is formed on the substrate and a conductive layer laminated on the molding.

摘要翻译： 半导体管芯封装包括：基板，在基板上安装覆盖半导体管芯的模制件，并且形成在基板上的半导体管芯和层压在模制件上的导电层。

公开(公告)号：US20080272469A1

公开(公告)日：2008-11-06

申请号：US12099354

申请日：2008-04-08

申请人： Kyu-Sub Kwak ,  Jae-Hyuck Lee

发明人： Kyu-Sub Kwak ,  Jae-Hyuck Lee

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L21/561 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor die package includes a substrate, a semiconductor die mounted on the substrates a molding covering the semiconductor die and which is formed on the substrate and a conductive layer laminated on the molding.

摘要翻译： 半导体管芯封装包括：基板，在基板上安装覆盖半导体管芯的模制件，并且形成在基板上的半导体管芯和层压在模制件上的导电层。

公开(公告)号：US20130042904A1

公开(公告)日：2013-02-21

申请号：US13569852

申请日：2012-08-08

申请人： June-Hyeon AHN ,  Kyu-Sub Kwak ,  Ji-Hoon Jung ,  Shin-Hee Cho

发明人： June-Hyeon AHN ,  Kyu-Sub Kwak ,  Ji-Hoon Jung ,  Shin-Hee Cho

IPC分类号： H01L31/048

CPC分类号： H01L31/0516 ,  H01L31/048 ,  Y02E10/50

摘要： A solar cell module includes a window unit integrally formed with a transparent substrate unit, a plurality of solar cells, and an electrode unit electrically connected to the solar cells. The solar cells and the electrode unit are provided in the transparent substrate unit.

摘要翻译： 太阳能电池模块包括与透明基板单元整体形成的窗单元，多个太阳能电池和电连接到太阳能电池的电极单元。 太阳能电池和电极单元设置在透明基板单元中。