摘要:
A key input device for a portable terminal includes wheel keys capable of rotating in multiple directions and performing a switch function. The key input device including a plurality of keys having at least one wheel keys provided in a main body and rotating in multiple directions, at least one rotating units allowing the wheel keys to rotate in respective directions, and at least one switching units provided under the wheel keys to sense the rotation directions of the wheel keys and to sense a pressure generated by the activation of the rotated wheel keys.
摘要:
A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.
摘要:
A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.
摘要:
An electric circuit package includes: a printed circuit substrate having an insulating layer and conductive pattern layers formed on an upper surface of the insulating layer; at least one of electronic parts disposed on an upper surface of the printed circuit substrate; at least one of conductive pins electrically connected to an conductive pattern layer providing grounding among the conductive pattern layers; and a molding member formed on the insulating layer in such a manner that the conductive pins and the electric parts are buried in the molding member, wherein each conductive pin has an upper surface exposed to an upper part of the molding member.
摘要:
A manufacturing method of a semiconductor chip package includes molding a semiconductor chip and a number of passive devices after arranging on a film the semiconductor chip and the passive devices located in a vacant space around the periphery of the semiconductor chip; removing the film, forming an adhesive layer in a film-removed area, and attaching a conductive layer to the adhesive layer; etching a conductive layer to thereby form a conductive circuit pattern; and providing one or more conductive pads, which electrically connect the conductive circuit pattern to the semiconductor chip and to the passive devices.
摘要:
A multi-die package and a method of fabrication is discloses. The multi-die package includes a package substrate, a first semiconductor die bonded directly on the package substrate and connected electrically with the package substrate, and a second semiconductor die having a groove providing a receiving space, bonded directly on the package substrate so that the first semiconductor die is covered by the groove, and connected electrically with the package substrate.
摘要:
A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.
摘要:
A semiconductor die package includes a substrate, a semiconductor die mounted on the substrates a molding covering the semiconductor die and which is formed on the substrate and a conductive layer laminated on the molding.
摘要:
A semiconductor die package includes a substrate, a semiconductor die mounted on the substrates a molding covering the semiconductor die and which is formed on the substrate and a conductive layer laminated on the molding.
摘要:
A solar cell module includes a window unit integrally formed with a transparent substrate unit, a plurality of solar cells, and an electrode unit electrically connected to the solar cells. The solar cells and the electrode unit are provided in the transparent substrate unit.