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    Heat dissipation device with multiple heat sinks
    1.
    发明授权
    Heat dissipation device with multiple heat sinks 有权
    具有多个散热片的散热装置

    公开(公告)号：US08579017B2

    公开(公告)日：2013-11-12

    申请号：US12620500

    申请日：2009-11-17

    申请人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： F28F7/00 ,  H05K7/20

    CPC分类号： H01L23/427 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.

    摘要翻译： 示例性散热装置包括连接板，第一散热器，第二散热器和第二平坦化热管。 第一散热器包括安装在连接板的底部上的基板和插入连接板中并接触基板的多个圆柱形销。 第二散热器包括散热器和从散热器一体延伸的多个矩形固体翅片。 散热器接合连接板。 热管将第一散热器的基板和第二散热器的第二散热器热连接。

    Heat dissipation device with heat pipe
    2.
    发明授权
    Heat dissipation device with heat pipe 失效
    散热装置带热管

    公开(公告)号：US08579016B2

    公开(公告)日：2013-11-12

    申请号：US12688794

    申请日：2010-01-15

    申请人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： F28D15/02

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.

    摘要翻译： 散发由安装在印刷电路板上的电子元件产生的热的示例性散热装置包括支撑件，导热基座，第一翅片组件和热管。 导热基座牢固地附接到支撑件的底侧并与电子元件热接触。 第一翅片组件牢固地附接到支撑件的顶侧。 热管包括夹在支撑件和导热基座之间的蒸发器，以及延伸穿过支撑件并在第一翅片组件中延伸的冷凝器。

    Heat sink assembly and method for manufacturing the same
    3.
    发明授权
    Heat sink assembly and method for manufacturing the same 有权
    散热器组件及其制造方法

    公开(公告)号：US08251132B2

    公开(公告)日：2012-08-28

    申请号：US12056298

    申请日：2008-03-27

    申请人： Jun Cao ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Jun Cao ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： F28F1/32 ,  F28D15/02

    CPC分类号： F28F1/32 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.

    摘要翻译： 散热器组件包括基座，翅片组和与基座和翅片组连接的热管。 翅片组包括多个翅片。 每个翅片在其下部限定凹部。 热管包括延伸穿过基座的蒸发部分和延伸穿过翅片组的冷凝部分。 基座沿圆周方向嵌合在翅片的凹槽中。 基座，翅片组和热管直接相互紧密连接。 凹槽和底座具有相应的T形轮廓。 每个翅片形成限定凹部的弯曲凸缘。 弯曲的法兰与基座和热管的蒸发部分紧密接触。

    Heat dissipation device
    4.
    发明授权
    Heat dissipation device 有权
    散热装置

    公开(公告)号：US08004843B2

    公开(公告)日：2011-08-23

    申请号：US12565712

    申请日：2009-09-23

    申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen

    发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.

    摘要翻译： 散热装置用于散发由安装在印刷电路板上并具有不同高度的多个电子部件产生的热量。 散热装置包括连接构件和安装在连接构件上并位于上述一个电子部件上的第一基座。 多个连接构件延伸穿过印刷电路板并与第一基座接合以在印刷电路板上的电子部件之一上组装第一基座。 第一基座和电子部件之间的距离可通过调节连接部件来调节，以使第一基座与电子部件之一紧密接触。

    Heat sink and method of manufacturing the same
    5.
    发明授权
    Heat sink and method of manufacturing the same 有权
    散热器及其制造方法

    公开(公告)号：US07898809B2

    公开(公告)日：2011-03-01

    申请号：US12252373

    申请日：2008-10-16

    申请人： Yi-Jiun Li ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Yi-Jiun Li ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3677 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.

    摘要翻译： 散热器包括基板和从基板向上延伸的多个圆柱形销。 圆柱销每个包括上消散部分，下安装部分和消散部分和安装部分之间的接合部分。 安装部分周向地装配在基板的相应孔的下部中。 接合部的直径小于安装部的直径。 接合部分被基板的内壁夹住，通过在对应的孔的边缘处向下冲压基板的上表面来限定基板的相应孔的上部。

    Heat sink assembly
    6.
    发明授权
    Heat sink assembly 失效
    散热器组件

    公开(公告)号：US07609522B2

    公开(公告)日：2009-10-27

    申请号：US11566020

    申请日：2006-12-01

    申请人： Zhao Jin ,  Jun Cao ,  Shi-wen Zhou ,  Chun-Chi Chen

    发明人： Zhao Jin ,  Jun Cao ,  Shi-wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/4006 ,  F28F3/02 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.

    摘要翻译： 与ATX母板（20）和BTX母板（30）兼容的散热器组件（10）包括散热器和延伸穿过散热器的多个紧固件（15）。 散热器包括在其中限定狭槽（1220）的基部（12）。 紧固件能够在第一位置与第二位置之间沿狭槽滑动，以使得根据本发明的优选实施例的散热器组件适于与ATX主板或BTX主板一起使用。

    Clip for heat sink
    7.
    发明授权
    Clip for heat sink 失效
    夹子为散热片

    公开(公告)号：US07391615B2

    公开(公告)日：2008-06-24

    申请号：US11309839

    申请日：2006-10-10

    申请人： Meng Fu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Meng Fu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2224/16 ,  Y10T24/44427 ,  Y10T24/4447

    摘要： A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.

    摘要翻译： 夹具包括具有相对的第一和第二腿部的主体，可移动紧固件，致动构件和滑动轴。 可移动紧固件具有限定在其中的保持孔，用于与保持模块和保持孔上方的细长狭槽接合。 致动构件包括弯曲槽，并且经由枢轴枢转地联接到可动紧固件。 滑动轴延伸穿过主体的第二腿部和可移动紧固件的细长槽以将它们联接在一起，并且滑动轴具有插入致动构件的弯曲槽中的一个部分。 当致动构件围绕枢轴旋转时，可移动紧固件被驱动以在松弛位置和锁定位置之间相对于滑动轴线移动。

    Heat dissipation device with heat pipe
    8.
    发明授权
    Heat dissipation device with heat pipe 失效
    散热装置带热管

    公开(公告)号：US07331379B2

    公开(公告)日：2008-02-19

    申请号：US11164458

    申请日：2005-11-23

    申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

    发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

    IPC分类号： F28D15/02

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.

    摘要翻译： 散热装置包括翅片组，将热量传递到翅片组的不同部分的弯曲热管和与热管接触的基部。 热管在U形部分的两侧分别具有中间的U形部分和两个L形部分。 基座用于与发热电子装置接触并将热量从电子装置传递到热管和散热片组。 翅片组定义在其中间的通道。 热管的U形部分容纳在翅片组的通道中，并与翅片组热接合。