公开(公告)号：US06362877B1

公开(公告)日：2002-03-26

申请号：US08537766

申请日：1995-10-20

申请人： Shigeki Kobayashi ,  Tamio Miyake ,  Koichi Tanaka ,  Norihito Yamamoto ,  Shigeru Tanimura

发明人： Shigeki Kobayashi ,  Tamio Miyake ,  Koichi Tanaka ,  Norihito Yamamoto ,  Shigeru Tanimura

IPC分类号： G01N2100

CPC分类号： H05K13/08 ,  G01R31/281 ,  G01R31/309 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： An X stage (21) arranged on the front edge of a table (11) is movable in the X-axis direction along a rail (23). The X stage (21) supports a light projecting device (70) for illuminating a printed circuit board (PCB) and an imaging device (80) for imaging an inspection area illuminated by the light projecting device (70). An image obtained by the imaging device (80) is displayed on a display device (13). A Y stage (41) is movably provided along a rail (33) on a base (10). A board supporting member (50) for supporting the board (PCB) is pivotably attached to the Y stage (41) at front portion thereof. An inspector judges whether or not soldering is acceptable while seeing the image displayed on the display device (13). When it is judged that soldering is unacceptable, the inspector can correct an unacceptable soldered portion by drawing out the Y stage (41) forward and obliquely raising the board supporting member (50).

摘要翻译： 布置在桌子（11）的前边缘上的X台（21）可沿着轨道（23）在X轴方向上移动。 X台（21）支撑用于照射印刷电路板（PCB）的投光装置（70）和用于对由投光装置（70）照射的检查区域成像的成像装置（80）。 由成像装置（80）获得的图像显示在显示装置（13）上。 Y台（41）沿着轨道（33）可移动地设置在基座（10）上。 用于支撑板（PCB）的板支撑构件（50）在其前部可枢转地附接到Y台（41）。 检查者在看到显示装置（13）上显示的图像时判断是否可以接受焊接。 当判断焊接不可接受时，检查者可以通过向前拉出Y台（41）并倾斜地升高板支撑构件（50）来校正不可接受的焊接部分。

公开(公告)号：US5032735A

公开(公告)日：1991-07-16

申请号：US486019

申请日：1990-03-01

申请人： Shigeki Kobayashi ,  Norihito Yamamoto ,  Koichi Tanaka

发明人： Shigeki Kobayashi ,  Norihito Yamamoto ,  Koichi Tanaka

IPC分类号： G01B11/24 ,  G01N21/88 ,  G01N21/93 ,  G01N21/956 ,  G01R31/309 ,  H05K3/34

CPC分类号： G01R31/309 ,  G01N21/95684

摘要： Disclosed is a method of and apparatus for inspecting a printed circuit board (PCB) for the nature of its soldered parts comprising three ring-shaped light sources which project light of different hues, the highest light source being any hue other than red, to a part mounted on a PCB at different angles and heights from above, a camera to record the reflected images, and a procedure used to check the recorded patterns to determine if the soldering is acceptable.

公开(公告)号：US5764536A

公开(公告)日：1998-06-09

申请号：US574692

申请日：1995-12-19

申请人： Norihito Yamamoto ,  Yukiya Sawanoi ,  Koichi Tanaka

发明人： Norihito Yamamoto ,  Yukiya Sawanoi ,  Koichi Tanaka

IPC分类号： G06T7/00 ,  G06K9/00

CPC分类号： G06T7/0006 ,  G06T2207/10152 ,  G06T2207/30152

摘要： In a device used to inspect substrates visually, an imaging region and a magnification are specified ahead of time for every component and stored as library data in a memory. The memory also contains CAD data, which include the class of each component on the substrate and its location. During initialization, a control unit links the location data for a component extracted from the CAD data to corresponding library data and specifies a field of view and a magnification for every component on the substrate. Using this data, the control unit creates on the substrate a number of viewing zones to be inspected at various magnifications and stores the data specifying these zones in the memory. When a substrate is to be inspected, the control unit uses the data specifying these zones to control the position and magnification of an imaging unit to collect image data from each zone successively and display them on a monitor.

摘要翻译： 在用于视觉检查底物的装置中，针对每个组件提前指定成像区域和放大倍数，并将其作为库数据存储在存储器中。 存储器还包含CAD数据，其中包括衬底上每个组件的类别及其位置。 在初始化期间，控制单元将从CAD数据提取的部件的位置数据链接到对应的库数据，并且指定基板上的每个部件的视场和放大倍数。 使用该数据，控制单元在基板上创建多个待检查的观看区域，并以指定这些区域的数据存储在存储器中。 当检查基板时，控制单元使用指定这些区域的数据来控制成像单元的位置和放大率，从而连续地从每个区域收集图像数据并将其显示在监视器上。

公开(公告)号：US5831854A

公开(公告)日：1998-11-03

申请号：US587942

申请日：1996-01-17

申请人： Norihito Yamamoto ,  Koichi Tanaka ,  Atsushi Hisano

发明人： Norihito Yamamoto ,  Koichi Tanaka ,  Atsushi Hisano

IPC分类号： G01B11/24 ,  H01L21/66 ,  H05K13/04 ,  H05K13/08

CPC分类号： H05K13/08 ,  H05K13/0486

摘要： A method and device for supporting the repair of defective portions of a substrate when the defective portions have been discovered during an inspection process. A recorder records defective data associated with the defective portions. A data sorter sorts the defective data by grouping together defective data relating to a same type of defect. A data indicator highlights a defective location on the substrate where the defective portions were found in an order determined by defective data relating to the same type of defect or in an order determined by defective data relating to defects requiring the same type of repair. The data indicator also indicates the type of repair required and the tools to be used in the repair of the defective portions.

摘要翻译： 一种用于在检查过程中发现缺陷部分时用于支撑修复基板的缺陷部分的方法和装置。 记录器记录与缺陷部分相关联的缺陷数据。 数据分类器通过将与相同类型的缺陷有关的缺陷数据分组在一起来分类缺陷数据。 数据指示器突出显示基板上的有缺陷的位置，其中以由相同类型的缺陷相关的缺陷数据确定的顺序或以与需要相同类型的修复的缺陷有关的缺陷数据确定的顺序找到缺陷部分。 数据指示器还指示需要修理的类型以及在修理缺陷部分时使用的工具。

公开(公告)号：US09064929B2

公开(公告)日：2015-06-23

申请号：US12153519

申请日：2008-05-20

申请人： Shoji Akiyama ,  Yoshihiro Kubota ,  Atsuo Ito ,  Koichi Tanaka ,  Makoto Kawai ,  Yuuji Tobisaka

发明人： Shoji Akiyama ,  Yoshihiro Kubota ,  Atsuo Ito ,  Koichi Tanaka ,  Makoto Kawai ,  Yuuji Tobisaka

IPC分类号： H01L21/762 ,  H01L21/3065 ,  H01L21/66

CPC分类号： H01L21/76254 ,  H01L21/3065 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/014

摘要： There is disclosed a method for manufacturing an SOI wafer comprising: a step of implanting at least one of a hydrogen ion and a rare gas ion into a donor wafer to form an ion implanted layer; a step of bonding an ion implanted surface of the donor wafer to a handle wafer; a step of delaminating the donor wafer at the ion implanted layer to reduce a film thickness of the donor wafer, thereby providing an SOI layer; and a step of etching the SOI layer to reduce a thickness of the SOI layer, wherein the etching step includes: a stage of performing rough etching as wet etching; a stage of measuring a film thickness distribution of the SOI layer after the rough etching; and a stage of performing precise etching as dry etching based on the measured film thickness distribution of the SOI layer. There can be provided A method for manufacturing an SOI wafer having high film thickness uniformity of an SOI layer with excellent productivity.

摘要翻译： 公开了一种用于制造SOI晶片的方法，包括：将氢离子和稀有气体离子中的至少一种注入施主晶片以形成离子注入层的步骤; 将施主晶片的离子注入表面接合到处理晶片的步骤; 在离子注入层分层施主晶片以降低施主晶片的膜厚，从而提供SOI层的步骤; 以及蚀刻所述SOI层以减小所述SOI层的厚度的步骤，其中所述蚀刻步骤包括：执行粗蚀刻的阶段，如湿蚀刻; 在粗蚀刻之后测量SOI层的膜厚分布的阶段; 以及基于所测量的SOI层的膜厚分布，进行干蚀刻的精确蚀刻的阶段。 可以提供一种以优异的生产率制造具有SOI层的高膜厚均匀性的SOI晶片的方法。

公开(公告)号：US20150148174A1

公开(公告)日：2015-05-28

申请号：US14534470

申请日：2014-11-06

申请人： Koichi Nakamura ,  Koichi Tanaka

发明人： Koichi Nakamura ,  Koichi Tanaka

IPC分类号： F16D41/07 ,  F16H1/28 ,  F16H57/04 ,  B60K17/04

CPC分类号： F16D41/07 ,  B60K1/00 ,  B60K2001/001 ,  B60Y2306/03 ,  F16D41/06 ,  F16D2041/0601 ,  F16D2300/06 ,  F16H1/28 ,  F16H57/0467

摘要： Providing an electric vehicle transaxle suppressing occurrence of wear, seizure, etc. of a one-way clutch as compared to a conventional one. When an electric motor MG is driven and a one-way clutch 34 moves in a rotation axis C1 direction, the one-way clutch 34 comes into contact with a flange portion 46b of an inner race 46 or a supporting portion 30b of a transaxle housing 30 via a sliding washer 74 and, therefore, direct contact is prevented between the one-way clutch 34 and the flange portion 46b of the inner race 46 or the supporting portion 30b and wear, seizure, etc. of the one-way clutch 34 are suppressed.

摘要翻译： 提供一种电动车辆驱动桥，与传统的相比，抑制单向离合器的磨损，咬合等的发生。 当电动机MG被驱动并且单向离合器34沿旋转轴线C1方向移动时，单向离合器34与内座圈46的凸缘部分46b或驱动桥壳体的支撑部分30b接触 因此，单向离合器34与内座圈46或支承部30b的凸缘部46b之间的直接接触被防止，单向离合器34的磨损，咬住等 被压制。

公开(公告)号：US09003926B2

公开(公告)日：2015-04-14

申请号：US13057422

申请日：2009-04-28

申请人： Yoshihiro Mizuno ,  Koichi Tanaka ,  Yusuke Ogata

发明人： Yoshihiro Mizuno ,  Koichi Tanaka ,  Yusuke Ogata

IPC分类号： F16H41/30 ,  F16H47/06 ,  F16H41/02 ,  F16H7/06 ,  F16H45/02 ,  F16H57/04

CPC分类号： F16H41/02 ,  F16H7/06 ,  F16H41/30 ,  F16H45/02 ,  F16H57/0441 ,  Y10T74/19149 ,  Y10T74/19153

摘要： An oil passage structure of a chain-driven oil pump includes three lines of oil passages for supplying oil from the center support to the torque converter, a first oil passage for supplying oil to the torque converter through the inside of an input shaft of the torque converter, a second oil passage for supplying oil to the torque converter through a space defined by the outer periphery surface of the input shaft and the inner periphery surface of a stator shaft, and a third oil passage for supplying oil to the torque converter by bypassing the drive sprocket. The third oil passage is provided on the outer periphery side of the drive sprocket and in a position where it does not interfere with the operation of a chain. Accordingly, it is possible to utilize the flex lock-up to a maximum extent, and to reduce the diameter of the sprocket.

摘要翻译： 链式油泵的油路结构包括从中心支撑件向变矩器供给油的三条油路，用于通过扭矩输入轴的内部向变矩器供给油的第一油路 转换器，用于通过由输入轴的外周面和定子轴的内周面限定的空间向变矩器供给油的第二油路，以及用于通过旁路向变矩器供油的第三油路 驱动链轮。 第三油路设置在驱动链轮的外周侧，并且在不干扰链的操作的位置。 因此，可以最大程度地利用弯曲锁定，并且减小链轮的直径。

公开(公告)号：US08881883B2

公开(公告)日：2014-11-11

申请号：US13460349

申请日：2012-04-30

申请人： Augusto E. Barton ,  William Randall Fong ,  Gary Allen Pinkley ,  Edwin Marcum Pearce, Jr. ,  Kunio Morisawa ,  Kazunori Kaneko ,  Koichi Tanaka

发明人： Augusto E. Barton ,  William Randall Fong ,  Gary Allen Pinkley ,  Edwin Marcum Pearce, Jr. ,  Kunio Morisawa ,  Kazunori Kaneko ,  Koichi Tanaka

IPC分类号： F16H63/38 ,  B60T1/06

CPC分类号： B60T1/062 ,  F16H63/3425 ,  Y10T74/19637

摘要： A park lock of a transmission, including a park gear; a park pawl rotating about a pawl shaft, the park pawl having a pawl portion locking the park gear, the park pawl including a cam contact portion; a park rod responsive to an operation of a controller, the park rod having a cam portion pressing the cam contact portion to have park pawl engage the park gear; a park sleeve receiving the cam portion and defining a first contact point providing a reactive force to the cam contact portion of the park pawl pressing against the cam portion at a second contact point; a pawl torsional spring biasing the park pawl towards disengagement; and a pawl stopper limiting the rotation of the park pawl wherein motions are constrained within a plane of the transmission and components are rotatingly disposed in parallel axis bores in one half of a transmission case.

摘要翻译： 变速器的公园锁，包括公园装备; 围绕棘爪轴旋转的驻车爪，所述停车爪具有锁定所述公园齿轮的棘爪部分，所述驻车棘爪包括凸轮接触部分; 响应于控制器的操作的停放杆，所述停放杆具有按压所述凸轮接触部分以具有驻车爪的凸轮部分接合所述驻车齿轮; 接收所述凸轮部分并且限定向所述驻车棘爪的凸轮接触部分提供反作用力的第一接触点，所述第一接触点在第二接触点处抵靠所述凸轮部分; 一个棘爪扭力弹簧将公园爪偏压分离; 以及限制驻车爪的旋转的棘爪止动器，其中运动被限制在变速器的平面内，并且部件在变速箱的一半中旋转地设置在平行的轴孔中。

公开(公告)号：US08765576B2

公开(公告)日：2014-07-01

申请号：US12550340

申请日：2009-08-28

申请人： Shoji Akiyama ,  Atsuo Ito ,  Yoshihiro Kubota ,  Koichi Tanaka ,  Makoto Kawai ,  Yuuji Tobisaka

发明人： Shoji Akiyama ,  Atsuo Ito ,  Yoshihiro Kubota ,  Koichi Tanaka ,  Makoto Kawai ,  Yuuji Tobisaka

IPC分类号： H01L21/30 ,  H01L21/762 ,  H01L21/3105

CPC分类号： H01L21/76254 ,  H01L21/31051 ,  H01L21/76251 ,  H01L31/1892 ,  Y02E10/50

摘要： A method of manufacturing a laminated substrate is provided. The method includes: forming an oxide film on at least a surface of a first substrate having a hardness of equal to or more than 150 GPa in Young's modulus, and then smoothing the oxide film; implanting hydrogen ions or rare gas ions, or mixed gas ions thereof from a surface of a second substrate to form an ion-implanted layer inside the substrate, laminating the first substrate and the second substrate through at least the oxide film, and then detaching the second substrate in the ion-implanted layer to form a laminated substrate; heat-treating the laminated substrate and diffusing outwardly the oxide film.

摘要翻译： 提供一种制造叠层基板的方法。 该方法包括：在杨氏模量下，在硬度为150GPa以上的第一基板的至少表面形成氧化膜，然后平滑氧化膜; 从第二基板的表面注入氢离子或稀有气体离子或其混合气体离子以在基板内部形成离子注入层，至少通过氧化物膜层压第一基板和第二基板，然后将 在离子注入层中形成第二衬底以形成层压衬底; 对层压基板进行热处理并向外扩散氧化膜。

公开(公告)号：US08736053B2

公开(公告)日：2014-05-27

申请号：US13526821

申请日：2012-06-19

申请人： Koichi Tanaka ,  Nobuyuki Kurashima ,  Hajime Iizuka ,  Tetsuya Koyama

发明人： Koichi Tanaka ,  Nobuyuki Kurashima ,  Hajime Iizuka ,  Tetsuya Koyama

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/568 ,  H01L23/3135 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511

摘要： A circuit substrate having a mounting surface on which a semiconductor chip is mounted and at least one connection pad formed on the mounting surface is connected to a support plate having at least one mounting portion with a diameter larger than a diameter of the connection pad, through a truncated-cone-shaped solder layer which is formed from at least one solder ball on the basis of a difference between the diameter of the mounting portion and the diameter of the connection pad.

摘要翻译： 具有安装有半导体芯片的安装面的电路基板和形成在安装面上的至少一个连接焊盘连接到具有至少一个直径大于连接焊盘直径的安装部分的支撑板上，通过 基于安装部分的直径和连接焊盘的直径之间的差异，由至少一个焊球形成的截锥形焊料层。