Palladium plating solution
    1.
    发明申请
    Palladium plating solution 有权
    钯镀液

    公开(公告)号:US20070205109A1

    公开(公告)日:2007-09-06

    申请号:US11711516

    申请日:2007-02-27

    IPC分类号: C25D3/50

    摘要: The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.

    摘要翻译: 本发明提供一种能够形成钯电镀膜的电镀液,其能够进一步提高由镀镍膜,镀钯膜和镀金膜构成的组合物的表面处理中的焊料特性, 金属如铜。 在含有可溶性钯盐和含有锗的液体组合物的导电盐的本发明的钯电镀溶液中,根据钯的还原值,可溶性钯盐的量为0.1g / l至50g / l 金属,导电盐的量为10g / l至400g / l,锗的量为0.1mg / l至1000mg / l。

    Palladium plating solution
    2.
    发明授权
    Palladium plating solution 有权
    钯镀液

    公开(公告)号:US07887692B2

    公开(公告)日:2011-02-15

    申请号:US11711516

    申请日:2007-02-27

    摘要: The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.

    摘要翻译: 本发明提供一种能够形成钯电镀膜的电镀液,其可以进一步提高由镀镍膜,镀钯膜和镀金膜构成的组合物的表面处理中的焊料特性, 金属如铜。 在含有可溶性钯盐和含有锗的液体组合物的导电盐的本发明的钯电镀溶液中,根据钯的还原值,可溶性钯盐的量为0.1g / l至50g / l 金属,导电盐的量为10g / l至400g / l,锗的量为0.1mg / l至1000mg / l。

    Process of optically resoluting optically active platinum complex
compound
    5.
    发明授权
    Process of optically resoluting optically active platinum complex compound 失效
    旋光光学活性铂络合物的光学拆分方法

    公开(公告)号:US5298642A

    公开(公告)日:1994-03-29

    申请号:US43577

    申请日:1993-04-07

    CPC分类号: C07F15/0093

    摘要: Disclosed herein is a process of optically resoluting optically active platinum complex compounds which comprises optically resoluting a d-isomer and an 1-isomer of a cis-Pt(II) complex of a 1,2-cyclohexanediamine isomer characterized in that the mixture of the d-isomer and the 1-isomer is optically resoluted by means of high performance liquid chromatography employing a column packed with a chiral filler.The chiral filler include, for example, a cellulose ester derivative, a cellulose carbamate derivative, an amylose carbamate derivative, a polymethacryl acid ester and .beta.- and .gamma.-cyclodextrin.According to the present invention, the optical resolution of a platinum complex compound essentially consisting of the mixture of two optical isomers which cannot be resoluted in accordance with a normal resolution method due to the small structural difference can be easily performed utilizing the characteristics of a chiral filler.

    摘要翻译: 本文公开了一种光学拆分光学活性铂络合物的方法,其包括旋光拆分1,2-环己烷二胺异构体的顺式-PP(II)络合物的D-异构体和1-异构体,其特征在于, 通过使用填充有手性填料的柱的高效液相色谱法将1-异构体旋光。 手性填料包括例如纤维素酯衍生物,氨基甲酸纤维素衍生物,直链淀粉氨基甲酸酯衍生物,聚甲基丙烯酸酯和(β) - 和(γ) - 环糊精。 根据本发明,可以容易地利用手性的特征,轻易地进行基本上由两种光学异构体的混合物组成的铂配位化合物的光学拆分,所述两种光学异构体由于结构差异小而根据正常分辨率不能解决 填料。