公开(公告)号：US08837149B2

公开(公告)日：2014-09-16

申请号：US13307029

申请日：2011-11-30

申请人： Shinichi Hirose ,  Taisuke Iwai ,  Yoshitaka Yamaguchi ,  Yohei Yagishita ,  Yukie Sakita ,  Masaaki Norimatsu

发明人： Shinichi Hirose ,  Taisuke Iwai ,  Yoshitaka Yamaguchi ,  Yohei Yagishita ,  Yukie Sakita ,  Masaaki Norimatsu

IPC分类号： H05K7/20 ,  H01L21/50 ,  H01L21/48 ,  H01L23/433 ,  H01L23/42 ,  H01L23/373

CPC分类号： H01L23/433 ,  H01L21/4871 ,  H01L21/50 ,  H01L23/373 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/8336 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10T428/24124 ,  Y10T428/24132 ,  Y10T428/24165 ,  Y10T428/24174 ,  Y10T428/2913 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

摘要翻译： 一种电子部件的制造方法，其特征在于，在第一基板的上方设置包含碳原子数的多个线状结构的热辐射材料和设置在所述多个线状结构体中的热塑性树脂填充层，在所述热辐射上设置吸墨纸 材料，在高于热塑性树脂的熔融温度的温度下进行热处理，并用吸收纸吸收多个线性结构上方的热塑性树脂，除去吸墨纸，并将散热材料粘附到第一衬底上 冷却固化热塑性树脂。

公开(公告)号：US20120236502A1

公开(公告)日：2012-09-20

申请号：US13403156

申请日：2012-02-23

申请人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Masaaki Norimatsu ,  Shinichi Hirose ,  Yohei Yagishita ,  Yukie Sakita

发明人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Masaaki Norimatsu ,  Shinichi Hirose ,  Yohei Yagishita ,  Yukie Sakita

IPC分类号： H05K7/20 ,  B23P11/00 ,  B05D5/12 ,  B32B5/16

CPC分类号： H01L23/433 ,  F28F2013/006 ,  F28F2255/20 ,  H01L23/373 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/10158 ,  H01L2924/16152 ,  Y10T29/49826 ,  Y10T428/249924

摘要： According to an aspect of the embodiments, a sheet-shaped structure includes a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, respectively, and a filling layer that is disposed between the line-shaped structures covered with the covering layer.

摘要翻译： 根据实施例的一个方面，片状结构包括：束结构，其包括多个碳原子的线状结构;覆盖层，其在线状结构的纵向方向上覆盖线状结构; 以及填充层，其设置在被覆盖层覆盖的线状结构之间。

公开(公告)号：US20120218715A1

公开(公告)日：2012-08-30

申请号：US13307029

申请日：2011-11-30

申请人： Shinichi HIROSE ,  Taisuke Iwai ,  Yoshitaka Yamaguchi ,  Yohei Yagishita ,  Yukie Sakita ,  Masaaki Norimatsu

发明人： Shinichi HIROSE ,  Taisuke Iwai ,  Yoshitaka Yamaguchi ,  Yohei Yagishita ,  Yukie Sakita ,  Masaaki Norimatsu

IPC分类号： H05K7/20 ,  H01L21/50

CPC分类号： H01L23/433 ,  H01L21/4871 ,  H01L21/50 ,  H01L23/373 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/8336 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10T428/24124 ,  Y10T428/24132 ,  Y10T428/24165 ,  Y10T428/24174 ,  Y10T428/2913 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

摘要翻译： 一种电子部件的制造方法，其特征在于，在第一基板的上方设置包含碳原子数的多个线状结构的热辐射材料和设置在所述多个线状结构体中的热塑性树脂填充层，在所述热辐射上设置吸墨纸 材料，在高于热塑性树脂的熔融温度的温度下进行热处理，并用吸收纸吸收多个线性结构上方的热塑性树脂，除去吸墨纸，并将散热材料粘附到第一衬底上 冷却固化热塑性树脂。

公开(公告)号：US06865306B2

公开(公告)日：2005-03-08

申请号：US10360739

申请日：2003-02-10

申请人： Masaharu Doi ,  Shinji Taniguchi ,  Masaaki Ohyama ,  Masaaki Norimatsu

发明人： Masaharu Doi ,  Shinji Taniguchi ,  Masaaki Ohyama ,  Masaaki Norimatsu

IPC分类号： G02F1/03 ,  G02F1/225 ,  H04B10/155 ,  G02B6/12

CPC分类号： G02F1/2255 ,  G02F1/0316 ,  H04B10/505

摘要： The invention provides an optical device which can lower the drive voltage which is used as one of the parameters for performance evaluation of the optical device. The optical device includes a substrate having first and second ridges, first and second grooves, a third groove, and first and second banks formed thereon, a Mach-Zehnder optical waveguide formed on the substrate, and an electrode set including first and second signal electrodes and a grounding electrode for controlling light which propagates in the optical wveguide. The grounding electrode extends to the first groove adjacent to the first bank and the second groove adjacent to the second bank. The optical device is applied, for example, to a transmission side apparatus for a long distance optical transmission system.

摘要翻译： 本发明提供一种能够降低作为用于光学装置的性能评估的参数之一的驱动电压的光学装置。 光学装置包括具有第一和第二脊的基板，第一和第二凹槽，第三凹槽以及形成在其上的第一和第二凹槽，形成在基板上的马赫 - 曾德光波导，以及包括第一和第二信号电极 以及用于控制在光波导中传播的光的接地电极。 接地电极延伸到与第一组相邻的第一凹槽和与第二组相邻的第二凹槽。 光学装置例如用于长距离光传输系统的发送侧装置。

公开(公告)号：US06049638A

公开(公告)日：2000-04-11

申请号：US989766

申请日：1997-12-12

申请人： Masaaki Norimatsu ,  Naoki Yamamoto ,  Kazunori Miura ,  Kazuhiro Tanaka ,  Goji Nakagawa

发明人： Masaaki Norimatsu ,  Naoki Yamamoto ,  Kazunori Miura ,  Kazuhiro Tanaka ,  Goji Nakagawa

IPC分类号： G02B6/42 ,  H01L31/0232 ,  H01L31/0352 ,  H01L31/105 ,  H01L31/18 ,  G02B6/10

CPC分类号： H01L31/0232 ,  G02B6/4214 ,  G02B6/423 ,  H01L31/035281 ,  H01L31/105 ,  H01L31/184 ,  G02B6/4206 ,  G02B6/4224 ,  G02B6/4232 ,  Y02E10/544

摘要： A photodetector module including a support substrate having a main surface, an optical waveguide mounted on the support substrate and having an end face for emerging a light beam along a first optical path, and a photodetector mounted on the support substrate so that the light beam emerged from the end face of the optical waveguide is incident on the photodetector, the photodetector having a photodetecting portion responding to the light beam incident on the photodetector. The photodetector module further includes a first inclined surface formed on a substrate of the photodetector for refracting the light beam along the first optical path to a second optical path, and a second inclined surface for totally reflecting the light beam along the second optical path to a third optical path substantially perpendicular to the photodetecting portion.

摘要翻译： 一种光电检测器模块，包括具有主表面的支撑基板，安装在支撑基板上并具有用于沿第一光路出射光束的端面的光波导和安装在支撑基板上的光电检测器，使得光束出现 从光波导的端面入射到光电检测器上，光电检测器具有响应入射到光电检测器上的光束的光检测部分。 所述光检测器模块还包括形成在所述光电检测器的基板上的第一倾斜表面，用于将所述光束沿着所述第一光路折射到第二光路;以及第二倾斜表面，用于将所述光束沿着所述第二光路全反射到 基本上垂直于光电检测部分的第三光路。

公开(公告)号：US5883988A

公开(公告)日：1999-03-16

申请号：US825033

申请日：1997-03-26

申请人： Naoki Yamamoto ,  Masaaki Norimatsu ,  Goji Nakagawa ,  Seimi Sasaki

发明人： Naoki Yamamoto ,  Masaaki Norimatsu ,  Goji Nakagawa ,  Seimi Sasaki

IPC分类号： G02B6/42 ,  H01L31/0232 ,  H01L31/10 ,  G02B6/12 ,  G01J1/04

CPC分类号： H01L31/0232 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4202 ,  G02B6/421 ,  G02B6/4224 ,  G02B6/423 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4248 ,  G02B6/4249

摘要： A photoreception device includes an oblique surface on a semiconductor substrate for causing a deflection of an optical beam incident thereto and a photodetection region provided on a first side of the semiconductor substrate for detecting the deflected optical beam, the photodetection region including a first electrode, wherein the photoreception device further includes a second electrode for biasing the photodetection region an a second, opposite side of the semiconductor substrate.

摘要翻译： 光接收器件包括在半导体衬底上的倾斜表面，用于引起入射到其上的光束的偏转，以及设置在半导体衬底的第一侧上用于检测偏转的光束的光检测区域，该光电探测区域包括第一电极，其中 光接收器件还包括用于使光检测区域偏置半导体衬底的第二相对侧的第二电极。

公开(公告)号：US06580843B2

公开(公告)日：2003-06-17

申请号：US09826089

申请日：2001-04-05

申请人： Masaharu Doi ,  Shinji Taniguchi ,  Masaaki Ohyama ,  Masaaki Norimatsu

发明人： Masaharu Doi ,  Shinji Taniguchi ,  Masaaki Ohyama ,  Masaaki Norimatsu

IPC分类号： G02B612

CPC分类号： G02F1/2255 ,  G02F1/0316 ,  H04B10/505

摘要： The invention provides an optical device which can lower the drive voltage which is used as one of the parameters for performance evaluation of the optical device. The optical device includes a substrate having first and second ridges, first and second grooves, a third groove, and first and second banks formed thereon, a Mach-Zehnder optical waveguide formed on the substrate, and an electrode set including first and second signal electrodes and a grounding electrode for controlling light which propagates in the optical waveguide. The grounding electrode extends to the first groove adjacent to the first bank and the second groove adjacent to the second bank. The optical device is applied, for example, to a transmission side apparatus for a long distance optical transmission system.