Method for manufacturing a semiconductor device and apparatus for manufacturing a semiconductor device
    1.
    发明授权
    Method for manufacturing a semiconductor device and apparatus for manufacturing a semiconductor device 失效
    半导体装置的制造方法以及半导体装置的制造装置

    公开(公告)号:US07018932B2

    公开(公告)日:2006-03-28

    申请号:US10377597

    申请日:2003-03-04

    IPC分类号: H01L21/027 G03F9/00

    摘要: A method for manufacturing a semiconductor device including, forming a photosensitive-film on a substrate, carrying the substrate on which the photosensitive-film is formed, to an exposure device provided with a mask in which an on-mask-inspection-mark and an on-mask-device-pattern are formed, selectively exposing the photosensitive-film to light to transfer the on-mask-inspection-mark to the photosensitive-film to form a latent-image of the inspection-mark on the photosensitive-film, heating at least that area of the photosensitive-film in which the latent-image of the inspection-mark is formed, measuring the inspection-mark, changing set-values for the exposure device used for the selective exposure, on the basis of result of the measurement so that exposure conditions conform to the set-values, exposing the photosensitive-film on the basis of the changed set-values to transfer the on-mask-device-pattern to the photosensitive-film to form a latent image of the device-pattern on the photosensitive-film, heating an entire surface of the photosensitive-film, and developing the photosensitive-film.

    摘要翻译: 一种半导体器件的制造方法,其特征在于,在将基板上形成有感光膜的基板上形成感光膜的制造方法,设置在具有掩模检查标记和掩模检查标记的掩模的曝光装置 形成掩模装置图案,选择性地将感光膜曝光以将掩模检查标记转印到感光膜上,以在感光膜上形成检查标记的潜像, 至少加热其中形成有检查标记的潜像的感光膜的面积,测量检查标记,改变用于选择性曝光的曝光装置的设定值,基于 所述测量使得曝光条件符合设定值,基于改变的设定值曝光感光膜以将掩模设备图案转印到感光膜上以形成该设备的潜像 p图案在p 感光膜,加热感光膜的整个表面,并显影感光膜。

    Pattern size evaluation apparatus
    2.
    发明授权
    Pattern size evaluation apparatus 失效
    图案尺寸评估装置

    公开(公告)号:US06423977B1

    公开(公告)日:2002-07-23

    申请号:US09030510

    申请日:1998-02-25

    IPC分类号: G01N2186

    CPC分类号: G01N21/956

    摘要: A pattern size evaluation apparatus comprising an illumination optical system for projecting parallel light rays of a predetermined wavelength on a monitoring area formed on an object, the monitoring area being formed at a position different from a device pattern formed on the object, a light intensity detection optical system for detecting diffracted light from the monitoring area, and a device pattern size evaluation section for evaluating a size of the device pattern based on an intensity of diffracted light from the monitoring area.

    摘要翻译: 一种图案尺寸评估装置,包括用于在形成在物体上的监视区域上投射预定波长的平行光线的照明光学系统,所述监视区域形成在与形成在物体上的装置图案不同的位置,光强度检测 用于检测来自监视区域的衍射光的光学系统,以及用于基于来自监视区域的衍射光的强度来评估装置图案的尺寸的装置图案尺寸评估部。

    Resist pattern forming method
    3.
    发明授权
    Resist pattern forming method 失效
    抗蚀图案形成方法

    公开(公告)号:US06190840B1

    公开(公告)日:2001-02-20

    申请号:US09098469

    申请日:1998-06-17

    IPC分类号: G03F720

    CPC分类号: G03F1/30 G03F1/32 G03F7/16

    摘要: A resist pattern forming method according to this invention is characterized by forming a resist film to have different thicknesses in one region and the other region in accordance with the pattern size or pattern density of a photomask. The resist pattern forming method according to this invention is characterized by selectively forming a resist film in part of a substrate region by applying a resist in part of the region without applying the resist in the remaining region. The resist pattern forming method according to this invention is characterized by selectively forming a resist film on part of a substrate on the basis of the intensity of exposure light observed at the resist film.

    摘要翻译: 根据本发明的抗蚀剂图案形成方法的特征在于,根据光掩模的图案尺寸或图案密度,在一个区域和另一个区域中形成具有不同厚度的抗蚀剂膜。 根据本发明的抗蚀剂图案形成方法的特征在于,通过在部分区域中施加抗蚀剂而不在其余区域中施加抗蚀剂,在基底区域的一部分中选择性地形成抗蚀剂膜。 根据本发明的抗蚀剂图案形成方法的特征在于,基于在抗蚀剂膜处观察到的曝光光的强度,在基板的一部分上选择性地形成抗蚀剂膜。

    Exposure mask and manufacturing method thereof
    6.
    发明授权
    Exposure mask and manufacturing method thereof 失效
    曝光掩模及其制造方法

    公开(公告)号:US5866280A

    公开(公告)日:1999-02-02

    申请号:US710408

    申请日:1996-09-17

    CPC分类号: G03F1/26 G03F1/30

    摘要: An exposure mask comprises a phase shift section including a plurality of opening patterns formed by making openings in part of a shading film provided on a transmissive substrate and digging part of the substrate, and a non-phase shift section including at least one opening pattern. The opening pattern of the non-phase shift section has a dig whose amount of digging has been adjusted according to the amount of digging in the opening patterns of the phase shift section.

    摘要翻译: 曝光掩模包括相移部分,其包括通过在设置在透射基板上的遮光膜的一部分上形成开口和挖掘基板的一部分而形成的多个开口图案,以及包括至少一个开口图案的非相移部分。 非相移部分的打开模式具有根据相移部分的打开模式中的挖掘量来调整挖掘量的挖掘。

    Control method for exposure apparatus and control method for semiconductor manufacturing apparatus
    7.
    发明授权
    Control method for exposure apparatus and control method for semiconductor manufacturing apparatus 失效
    半导体制造装置的曝光装置的控制方法和控制方法

    公开(公告)号:US06376139B1

    公开(公告)日:2002-04-23

    申请号:US09671502

    申请日:2000-09-27

    IPC分类号: G03F900

    摘要: A control method for an exposure apparatus, in which an exposure amount and a focus value are set in transferring a circuit pattern on a mask onto a resist formed on a wafer by the exposure apparatus, includes the steps of arranging, on the mask, an exposure amount monitor mark and a focus monitor mark used to separately monitor the effective exposure amount and the focus value on the wafer, transferring the exposure amount monitor mark and the focus monitor mark onto the resist to form an exposure amount monitor pattern and a focus monitor pattern, measuring the states of the exposure amount monitor pattern and the focus monitor pattern at least at one of timings after exposure, after post exposure baking, during a cooling process after baking, during a process after cooling, during development, and after development, on the basis of the measurement results, calculating the difference between an optimum exposure amount value and an exposure amount set value set in the exposure apparatus and the difference between an optimum focus value and a focus set value set in the exposure apparatus in transferring the exposure amount monitor mark and the focus monitor mark onto the resist, and changing the focus set value and the exposure amount set value of the exposure apparatus in accordance with the calculated differences.

    摘要翻译: 一种曝光装置的控制方法,其中设置曝光量和聚焦值以将掩模上的电路图案转印到通过曝光装置在晶片上形成的抗蚀剂上的步骤包括以下步骤:在掩模上布置 曝光量监视标记和用于分别监视晶片上的有效曝光量和聚焦值的聚焦监视器标记,将曝光量监视标记和聚焦监视标记转印到抗蚀剂上以形成曝光量监视器图案和聚焦监视器 至少在曝光后的定时,曝光后烘烤,烧成后的冷却过程中,冷却后,显影处理和显影后的处理中,至少测定曝光量监视器图案和聚焦监视器图案的状态, 基于测量结果,计算最佳曝光量值与曝光设定中设定的曝光量设定值之间的差 以及将曝光量监视标记和聚焦监视标记转印到抗蚀剂上的曝光装置中设置的最佳聚焦值和聚焦设定值之间的差异,并且改变曝光的聚焦设定值和曝光量设定值 仪器按照计算出的差异。