公开(公告)号：US20120222887A1

公开(公告)日：2012-09-06

申请号：US13474423

申请日：2012-05-17

申请人： Shinichi NIKAIDO ,  Toshiyuki HAYAMI

发明人： Shinichi NIKAIDO ,  Toshiyuki HAYAMI

IPC分类号： H05K1/02 ,  B32B38/10

CPC分类号： H05K3/4652 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4694 ,  H05K2201/0195 ,  H05K2201/09972

摘要： In order to provide a partially multilayered wiring board without exposing circuits of a mother board printed board even if not separately performing protection process, such as gold plating, a partially multilayered wiring board 1 has a first insulating base material 11 having one main surface formed thereon with first conductive circuit patterns 21 and a second insulating base material 12 laminated on the one main surface of the first insulating base material 11 and having one main surface formed thereon with second conductive circuit patterns 22 smaller than a region where the first conductive circuit patterns 21 are formed, wherein the first conductive circuit patterns 21 are covered by other main surface of the second insulating base material 22.

摘要翻译： 即使没有单独执行保护处理（例如镀金），也可以在不暴露母板印刷电路板的电路的情况下提供部分多层布线板，部分多层布线板1具有在其上形成有一个主表面的第一绝缘基材11 在第一绝缘基体材料11的一个主表面层叠有第一导电电路图案21和第二绝缘基底材料12，并且其上形成有一个主表面的第二导电电路图案22比第一导电电路图案21 其中第一导电电路图案21被第二绝缘基材22的其它主表面覆盖。

公开(公告)号：US20080032521A1

公开(公告)日：2008-02-07

申请号：US11781052

申请日：2007-07-20

申请人： Shinichi NIKAIDO ,  Haruo Miyazawa ,  Katsuya Yamagami

发明人： Shinichi NIKAIDO ,  Haruo Miyazawa ,  Katsuya Yamagami

IPC分类号： H01R12/00

CPC分类号： H01R13/2421 ,  H01R12/714 ,  H05K7/1069

摘要： An IC socket includes a plurality of contacts each including a spring formed by winding a conductive material around a winding axis with an effective winding number of at least 1 round, and arms provided on both ends of the spring, and a housing including the same number of holes as the plurality of contacts, the holes each having one of the contacts inserted therein in a state in which the spring is compressed in a direction of the winding axis so as to allow adjacent coil portions in the spring to come into contact with each other and to be electrically conductive.

摘要翻译： IC插座包括多个触点，每个触头包括弹簧，弹簧通过围绕绕线轴线缠绕导电材料而形成，有效绕组数量至少为1圈，并且臂设置在弹簧的两端，以及包括相同数量的壳体 作为多个触点的孔，在弹簧沿着卷绕轴线的方向被压缩的状态下，每个具有插入其中一个触头的孔，以使得弹簧中的相邻线圈部分能够与每个触点接触 另一个并且是导电的。

公开(公告)号：US20100081342A1

公开(公告)日：2010-04-01

申请号：US12493760

申请日：2009-06-29

申请人： Shinichi NIKAIDO ,  Katsuya YAMAGAMI ,  Yasuhiro OUCHI

发明人： Shinichi NIKAIDO ,  Katsuya YAMAGAMI ,  Yasuhiro OUCHI

IPC分类号： H01R13/40 ,  H01R13/405 ,  H01R9/24

CPC分类号： H05K3/326 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/714 ,  H05K1/114 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10378 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： This double-sided connector is provided with: an insulating member having an insulating substrate and an elastomer insert-molded on both faces of the insulating substrate, and a through-hole formed along a thickness direction of the insulating substrate and the elastomer; a conductive member formed on an inner face of the through-hole, both ends of the conductive member exposed at the both faces; and a contact terminal part provided at one end of the conductive member. A protrusion is formed on at least a first face of the two faces of the insulating member and near one of the two ends of the through-hole, the protrusion formed by a part of the elastomer protruding from the first face. The contact terminal part includes a ring part formed around the end of the through-hole on the first face, a sloping part connected to the ring part and extended slantingly toward a top of the protrusion, and an approximately hemispherical point of contact part connected to the sloping part and covering the top.

摘要翻译： 该双面连接器设置有：具有绝缘基板和在绝缘基板的两个表面上插入成型的弹性体的绝缘构件和沿绝缘基板和弹性体的厚度方向形成的通孔; 形成在所述通孔的内表面上的导电构件，所述导电构件的两端在所述两个面上露出; 以及设置在导电构件的一端的接触端子部。 在所述绝缘构件的两个面的至少第一面和所述贯通孔的两端中的一端附近形成突起，所述突起由从所述第一面突出的所述弹性体的一部分形成。 接触端子部包括形成在第一面上的贯通孔的端部周围的环状部，与环状部连接并向着突起的顶部倾斜延伸的倾斜部，以及大致半球形的接触点部， 倾斜部分并覆盖顶部。

公开(公告)号：US20080020624A1

公开(公告)日：2008-01-24

申请号：US11781018

申请日：2007-07-20

申请人： Shinichi NIKAIDO ,  Haruo Miyazawa ,  Katsuya Yamagami

发明人： Shinichi NIKAIDO ,  Haruo Miyazawa ,  Katsuya Yamagami

IPC分类号： H01R4/50

CPC分类号： H05K7/1069 ,  H01R12/52 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10378 ,  H05K2201/10719

摘要： An aspect of the present invention inheres in an IC socket includes a plate-like socket base body which includes through hole forming portions having a plurality of contact housing holes formed so as to penetrate the plate-like socket base in a front-to-back direction, and having through holes formed around the respective contact housing holes so as to penetrate the plate-like socket base in the front-to-back direction, and a plated layer formed continuously on an inner wall of the through hole, on the front and back surfaces of the through hole forming portion, and on a surface of the contact piece.

摘要翻译： 本发明的集成电路插座的一个方面包括一个板状插座底座本体，它包括通孔形成部分，该通孔形成部分具有多个接触容纳孔，该多个接触容纳孔形成为以前后方式穿过该板状插座底座 方向，并且具有围绕各个接触容纳孔形成的通孔，以便沿着前后方向穿透板状插座基座，以及在前面的通孔的内壁上连续形成的镀层 和通孔形成部分的后表面以及接触片的表面上。