Pattern formation material and pattern formation method
    1.
    发明授权
    Pattern formation material and pattern formation method 有权
    图案形成材料和图案形成方法

    公开(公告)号:US06511786B2

    公开(公告)日:2003-01-28

    申请号:US09924093

    申请日:2001-08-08

    IPC分类号: G03F7004

    摘要: A pattern formation material of this invention contains a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator: wherein R1 and R2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom; R3, R4, R5 and R6 are a hydrogen atom or a fluorine atom, at least one of which is a fluorine atom; and R7 is a protecting group released by an acid.

    摘要翻译: 本发明的图案形成材料包含含有由化学式1表示的第一单元和由化学式2表示的第二单元的聚合物和酸产生剂:其中R1和R2相同或不同并选自 烷基,氯原子和含有氯原子的烷基; R3,R4,R5和R6是氢原子或氟原子,其中至少一个是氟原子; 而R7是由酸释放的保护基。

    Pattern formation material and pattern formation method
    2.
    发明授权
    Pattern formation material and pattern formation method 有权
    图案形成材料和图案形成方法

    公开(公告)号:US06753132B2

    公开(公告)日:2004-06-22

    申请号:US10034366

    申请日:2002-01-03

    IPC分类号: G03F700

    摘要: A resist film is formed by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator: Chemical Formula 1: Chemical Formula 2:  wherein R1 and R2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a fluorine atom; R3 is a protecting group released by an acid; and m is an integer of 0 through 5. Subsequently, the resist film is irradiated with exposing light of a wavelength shorter than a 180 nm band for pattern exposure, and a resist pattern is formed by developing the resist film after the pattern exposure.

    摘要翻译: 通过在基板上涂布含有由化学式1表示的第一单元和化学式2表示的第二单元的聚合物的图案形成材料和酸产生剂,形成抗蚀剂膜:化学式1:化学式2 其中R1和R2相同或不同,选自烷基,氯原子和含氟原子的烷基; R3是由酸释放的保护基; m为0〜5的整数。接着,对曝光后的光的波长短于180nm的曝光光照射抗蚀剂膜,通过在图案曝光后使抗蚀剂膜显影而形成抗蚀剂图案。

    Pattern formation material and pattern formation method
    3.
    发明授权
    Pattern formation material and pattern formation method 有权
    图案形成材料和图案形成方法

    公开(公告)号:US06689536B2

    公开(公告)日:2004-02-10

    申请号:US10033899

    申请日:2002-01-03

    IPC分类号: G03C1492

    CPC分类号: G03F7/0046 G03F7/0392

    摘要: A resist film is formed by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator: wherein R1 and R3 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a fluorine atom; R2 is a protecting group released by an acid; and m is an integer of 0 through 5. Subsequently, the resist film is irradiated with exposing light of a wavelength shorter than a 180 nm band for pattern exposure, and a resist pattern is formed by developing the resist film after the pattern exposure.

    摘要翻译: 通过在基板上涂布含有由化学式1表示的第一单元的聚合物和由化学式2表示的第二单元的聚合物形成抗蚀剂膜,其中R1和R3相同 或不同,选自烷基,氯原子和含氟原子的烷基; R2是由酸释放的保护基; m为0〜5的整数。接着,利用曝光时间短于180nm波长的曝光光照射抗蚀剂膜,通过在图案曝光后使抗蚀剂膜显影而形成抗蚀剂图案。

    Pattern formation material and pattern formation method
    4.
    发明授权
    Pattern formation material and pattern formation method 有权
    图案形成材料和图案形成方法

    公开(公告)号:US06645694B2

    公开(公告)日:2003-11-11

    申请号:US09922638

    申请日:2001-08-07

    IPC分类号: G03F7004

    摘要: A pattern formation material of this invention contains a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator: wherein R1 and R2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom; R3, R4, R5 and R6 are a hydrogen atom or a fluorine atom, at least one of which is a fluorine atom; and R7 is a protecting group released by an acid.

    摘要翻译: 本发明的图案形成材料包含含有由化学式1表示的第一单元和由化学式2表示的第二单元的聚合物和酸产生剂:其中R 1和R 2相同或不同, 选自烷基,氯原子和包含氯原子的烷基; R 3,R 4,R 5和R 6是氢原子或氟原子,其中至少一个是氟原子; R 7是被酸释放的保护基。

    Pattern formation material and method
    5.
    发明授权
    Pattern formation material and method 有权
    图案形成材料及方法

    公开(公告)号:US06576398B2

    公开(公告)日:2003-06-10

    申请号:US09799068

    申请日:2001-03-06

    IPC分类号: G03C173

    摘要: In the pattern formation method of this invention, a resist film is formed by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator, wherein R1 and R2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom; and R3 is a protecting group released by an acid. Then, the resist film is irradiated with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure, and a resist pattern is formed by developing the resist film after the pattern exposure.

    摘要翻译: 在本发明的图案形成方法中,通过在基板上涂布含有由化学式1表示的第一单元和由化学式2表示的第二单元的聚合物的图案形成材料形成抗蚀剂膜, 发电机,其中R1和R2相同或不同,选自烷基,氯原子和包括氯原子的烷基; R3是由酸释放的保护基。 然后,用曝光的1nm至30nm波长或110nm至180nm波段的曝光光照射抗蚀剂膜,以进行图案曝光,并且在图案曝光后通过显影抗蚀剂膜形成抗蚀剂图案。

    Pattern formation material and method
    6.
    发明授权
    Pattern formation material and method 有权
    图案形成材料及方法

    公开(公告)号:US06737213B2

    公开(公告)日:2004-05-18

    申请号:US09799017

    申请日:2001-03-06

    IPC分类号: G03C173

    摘要: In the pattern formation method of this invention, a resist film is formed by applying, on a substrate, a pattern formation material containing a polymer including a first unit represented by Chemical Formula 1 and a second unit represented by Chemical Formula 2, and an acid generator, wherein R1 and R2 are the same or different and selected from the group consisting of an alkyl group, a chlorine atom and an alkyl group including a chlorine atom; and R3 is a protecting group released by an acid. Then, the resist film is irradiated with exposing light of a wavelength of a 1 nm through 30 nm band or a 110 nm through 180 nm band for pattern exposure, and a resist pattern is formed by developing the resist film after the pattern exposure.

    摘要翻译: 在本发明的图案形成方法中,通过在基板上涂布含有由化学式1表示的第一单元和由化学式2表示的第二单元的聚合物的图案形成材料形成抗蚀剂膜, 发电机,其中R1和R2相同或不同,选自烷基,氯原子和包括氯原子的烷基; R3是由酸释放的保护基。 然后,用曝光的1nm至30nm波长或110nm至180nm波段的曝光光照射抗蚀剂膜,以进行图案曝光,并且在图案曝光后通过显影抗蚀剂膜形成抗蚀剂图案。

    Resist material and pattern formation method
    10.
    发明申请
    Resist material and pattern formation method 审中-公开
    抗蚀材料和图案形成方法

    公开(公告)号:US20050277057A1

    公开(公告)日:2005-12-15

    申请号:US11138880

    申请日:2005-05-27

    IPC分类号: G03C1/492 G03F7/039

    CPC分类号: G03F7/0392 G03F7/0397

    摘要: A resist material has a base polymer containing a compound including a copolymer of a first unit represented by a general formula of the following Chemical Formula 1 and a second unit represented by a general formula of the following Chemical Formula 2: wherein R1, R2, R3, R7, R8 and R9 are the same or different and are a hydrogen atom, a fluorine atom, or a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20; R4 is a straight-chain alkylene group or a branched or cyclic alkylene group with a carbon number not less than 0 and not more than 20; and R5 and R6 are the same or different and are a hydrogen atom, a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20, or a protecting group released by an acid.

    摘要翻译: 抗蚀剂材料具有含有包含由以下化学式1的通式表示的第一单元与由下列化学式2的通式表示的第二单元的共聚物的化合物的基础聚合物:其中R 1 R 2,R 3,R 3,R 7,R 8和R 9, 相同或不同,为氢原子,氟原子或直链烷基,支链或环状烷基或碳数不小于1且不大于1的氟化烷基 20; R 4是直链亚烷基或碳数不小于0且不大于20的支链或环状亚烷基; R 5和R 6相同或不同,为氢原子,直链烷基,支链或环状烷基或氟化烷基, 碳数为1以上且20以下,或被酸释放的保护基。