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    Method For Manufacturing Wraparound Shield Write Head Using Hard Masks
    1.
    发明申请
    Method For Manufacturing Wraparound Shield Write Head Using Hard Masks 有权
    使用硬掩模制造绕组屏蔽写头的方法

    公开(公告)号：US20130026131A1

    公开(公告)日：2013-01-31

    申请号：US13193520

    申请日：2011-07-28

    申请人： Shiwen Huang ,  Fenglin Liu ,  Qiping Zhong ,  Kyusik Shin ,  Yingjian Chen

    发明人： Shiwen Huang ,  Fenglin Liu ,  Qiping Zhong ,  Kyusik Shin ,  Yingjian Chen

    IPC分类号： G11B5/127

    CPC分类号： G11B5/3116 ,  G11B5/3163

    摘要： The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.

    摘要翻译： 本公开描述了通过实施三层（三层）硬掩模制造全封装屏蔽镶嵌写头的方法。 根据本发明的实施例，在形成写入头期间，各种硬掩模层用于不同的目的。 本发明的环绕式屏蔽头表现出改进的物理特性，进一步导致改善的性能特征。 根据本发明的硬掩模层的使用允许使用可以比其它工艺中使用的那些方法更加严格地控制的制造工艺。 例如，可以使用较小尺寸的光刻技术。 此外，在使用CMP工艺不如使用本发明可能的沉积或光刻技术那样不受控制的情况下，对某些CMP工艺的依赖是不必要的。

    Method for manufacturing wraparound shield write head using hard masks
    2.
    发明授权
    Method for manufacturing wraparound shield write head using hard masks 有权
    使用硬掩模制造环绕屏蔽写头的方法

    公开(公告)号：US08801943B2

    公开(公告)日：2014-08-12

    申请号：US13193520

    申请日：2011-07-28

    申请人： Shiwen Huang ,  Fenglin Liu ,  Qiping Zhong ,  Kyusik Shin ,  Yingjian Chen

    发明人： Shiwen Huang ,  Fenglin Liu ,  Qiping Zhong ,  Kyusik Shin ,  Yingjian Chen

    IPC分类号： B44C1/22

    CPC分类号： G11B5/3116 ,  G11B5/3163

    摘要： The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.

    摘要翻译： 本公开描述了通过实施三层（三层）硬掩模制造全封装屏蔽镶嵌写头的方法。 根据本发明的实施例，在形成写入头期间，各种硬掩模层用于不同的目的。 本发明的环绕式屏蔽头表现出改进的物理特性，进一步导致改善的性能特征。 根据本发明的硬掩模层的使用允许使用可以比其它工艺中使用的那些方法更加严格地控制的制造工艺。 例如，可以使用较小尺寸的光刻技术。 此外，在使用CMP工艺不如使用本发明可能的沉积或光刻技术那样不受控制的情况下，对某些CMP工艺的依赖是不必要的。

    Process to make PMR writer with leading edge shield (LES) and leading edge taper (LET)
    6.
    发明授权
    Process to make PMR writer with leading edge shield (LES) and leading edge taper (LET) 有权
    使具有前缘屏蔽（LES）和前缘锥度（LET）的PMR写入器的过程

    公开(公告)号：US08400733B2

    公开(公告)日：2013-03-19

    申请号：US12954422

    申请日：2010-11-24

    申请人： Kyusik Shin ,  Qiping Zhong ,  Honglin Zhu ,  Yingjian Chen ,  Liubo Hong ,  Fenglin Liu

    发明人： Kyusik Shin ,  Qiping Zhong ,  Honglin Zhu ,  Yingjian Chen ,  Liubo Hong ,  Fenglin Liu

    IPC分类号： G11B5/147

    CPC分类号： G11B5/3116 ,  G11B5/1278 ,  G11B5/3163

    摘要： Methods for fabrication of leading edge shields and tapered magnetic poles with a tapered leading edge are provided. The leading edge shield may be formed by utilizing a CMP stop layer. The CMP stop layer may aid in preventing over polishing of the magnetic material. For the tapered magnetic poles with a tapered leading edge, a magnetic material is deposited on a planarized surface, a patterned resist material is formed, and exposed magnetic material is etched to form at least one tapered surface of the magnetic material.

    摘要翻译： 提供了具有锥形前缘的前缘屏蔽和锥形磁极的制造方法。 前缘屏蔽可以通过利用CMP停止层形成。 CMP停止层可以有助于防止磁性材料的过度抛光。 对于具有锥形前缘的锥形磁极，磁性材料沉积在平坦化表面上，形成图案化的抗蚀剂材料，并且暴露的磁性材料被蚀刻以形成磁性材料的至少一个锥形表面。

    PROCESS TO MAKE PMR WRITER WITH LEADING EDGE SHIELD (LES) AND LEADING EDGE TAPER (LET)
    9.
    发明申请
    PROCESS TO MAKE PMR WRITER WITH LEADING EDGE SHIELD (LES) AND LEADING EDGE TAPER (LET) 失效
    具有导向边缘屏蔽（LES）和导线边缘（LET）的PMR写入的过程

    公开(公告)号：US20120125886A1

    公开(公告)日：2012-05-24

    申请号：US12954485

    申请日：2010-11-24

    申请人： Liubo Hong ,  Fenglin Liu ,  Qiping Zhong ,  Honglin Zhu

    发明人： Liubo Hong ,  Fenglin Liu ,  Qiping Zhong ,  Honglin Zhu

    IPC分类号： G01R1/16

    CPC分类号： G11B5/315 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/3146 ,  G11B5/3163

    摘要： Methods for fabrication of leading edge shields and tapered magnetic poles with a tapered leading edge are provided. The leading edge shield may be formed by utilizing a CMP stop layer. The CMP stop layer may aid in preventing over polishing of the magnetic material. For the tapered magnetic poles with a tapered leading edge, a magnetic material is deposited on a planarized surface, a patterned resist material is formed, and exposed magnetic material is etched to form at least one tapered surface of the magnetic material.

    摘要翻译： 提供了具有锥形前缘的前缘屏蔽和锥形磁极的制造方法。 前缘屏蔽可以通过利用CMP停止层形成。 CMP停止层可以有助于防止磁性材料的过度抛光。 对于具有锥形前缘的锥形磁极，将磁性材料沉积在平坦化表面上，形成图案化的抗蚀剂材料，并且暴露的磁性材料被蚀刻以形成磁性材料的至少一个锥形表面。