POSITIVE ELECTRODE ACTIVE ELEMENT AND LITHIUM SECONDARY BATTERY
    6.
    发明申请
    POSITIVE ELECTRODE ACTIVE ELEMENT AND LITHIUM SECONDARY BATTERY 审中-公开
    正极电极活性元件和锂二次电池

    公开(公告)号:US20110003206A1

    公开(公告)日:2011-01-06

    申请号:US12819517

    申请日:2010-06-21

    IPC分类号: H01M4/50 H01M4/90

    摘要: A positive electrode active material having a specific surface area of 0.1 to 0.5 m2/g, which contains a large number of crystal grains containing primary particles of 5 to 20 μm in particle diameter, composed of lithium manganate of spinel structure containing lithium and manganese as the constituent elements, and a bismuth compound containing bismuth, wherein the proportion of the primary particles contained in the large number of crystal grains is 70 areal % or more and the proportion of the bismuth contained in the bismuth compound is 0.005 to 0.5 mol % relative to the manganese contained in the lithium manganate.

    摘要翻译: 比表面积为0.1〜0.5m 2 / g的正极活性物质,其含有大量含有粒径为5〜20μm的一次粒子的晶粒,由含有锂和锰的尖晶石结构的锰酸锂构成 构成元素和含有铋的铋化合物,其中大量晶粒中所含的一次粒子的比例为70%以上,铋化合物中所含的铋的比例相对于0.005〜0.5摩尔% 涉及锰酸锂中所含的锰。

    HONEYCOMB-TYPE PIEZOELECTRIC/ELECTROSTRICTIVE ELEMENT
    7.
    发明申请
    HONEYCOMB-TYPE PIEZOELECTRIC/ELECTROSTRICTIVE ELEMENT 有权
    蜂窝型压电/电磁元件

    公开(公告)号:US20080129156A1

    公开(公告)日:2008-06-05

    申请号:US11940662

    申请日:2007-11-15

    IPC分类号: H01L41/047 H01L41/04

    摘要: A honeycomb-type piezoelectric/electrostrictive element includes a honeycomb structure section having a partition wall which partitions cells passing through the honeycomb structure section in an axial direction, and an electrode as an internal electrode disposed on an inner wall surface of the cell to internally cover the entire inner wall surface, wherein the partition wall is formed of a piezoelectric/electrostrictive body, and the honeycomb structure section can be deformed by applying a voltage between the electrodes disposed in the cells adjacent through the partition wall.

    摘要翻译: 蜂窝型压电/电致伸缩元件包括蜂窝结构部分,其具有分隔壁,其沿着轴向隔开通过蜂窝结构部分的电池,以及电极作为设置在电池内壁表面上的内部电极以内部覆盖 整个内壁表面,其中分隔壁由压电/电致伸缩体形成,并且蜂窝结构部分可以通过在设置在邻近隔壁的单元中的电极之间施加电压而变形。

    LAMINATED AND SINTERED CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE CIRCUIT BOARD
    8.
    发明申请
    LAMINATED AND SINTERED CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE CIRCUIT BOARD 有权
    层压和烧结陶瓷电路板,以及包括电路板的半导体封装

    公开(公告)号:US20130026636A1

    公开(公告)日:2013-01-31

    申请号:US13237259

    申请日:2011-09-20

    IPC分类号: H01L23/498 H05K1/09 H05K1/00

    摘要: A circuit board that can decrease thermal stress acting between a semiconductor element and a board in association with temperature alteration and has high mechanical strength (rigidity) as a whole board (including a multilayer wiring layer) is provided. Ceramic base material having a coefficient of thermal expansion close to that of a semiconductor element and inner layer wiring are integrally sintered, and the circuit board is configured so that fine-lined conductor structure corresponding to a multilayer wiring layer in the inner layer wiring has predetermined width, intralayer interval and interlayer interval. Thereby, thermal stress acting between a semiconductor element and the board when the board is exposed to temperature alteration in a condition where it is joined with the semiconductor element is suppressed, rigidity of the board is maintained, and its reliability against temperature cycle is increased.

    摘要翻译: 提供了可以降低与温度变化相关联地在半导体元件和板之间作用的热应力并且具有作为整个板(包括多层布线层)的高机械强度(刚性)的电路板。 具有与半导体元件和内层布线接近的热膨胀系数的陶瓷基材一体烧结,并且电路板被构造成使得与内层布线中的多层布线层相对应的细线导体结构具有预定的 宽度,内膜间隔和层间间隔。 因此,抑制了在与半导体元件接合的状态下板暴露于温度变化时半导体元件与基板之间的热应力,保持板的刚性,并且提高其对温度循环的可靠性。