公开(公告)号：US08748780B2

公开(公告)日：2014-06-10

申请号：US12007892

申请日：2008-01-16

申请人： Shouken Moro ,  Yasuhiro Takaki ,  Masatoshi Kaneda

发明人： Shouken Moro ,  Yasuhiro Takaki ,  Masatoshi Kaneda

IPC分类号： B05C13/00 ,  C23C16/52 ,  B05C11/00 ,  B05D3/02 ,  H01L21/687 ,  G03F7/20 ,  C23C16/00 ,  H01L21/683

CPC分类号： G03F7/70708 ,  B05C11/00 ,  C23C14/541 ,  C23C16/00 ,  C23C16/46 ,  H01L21/67109 ,  H01L21/67288 ,  H01L21/683 ,  H01L21/6838 ,  H01L21/6875

摘要： A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.

摘要翻译： 公开的基板处理装置包括被配置为加热和/或冷却基板的热交换板; 设置在热交换板上的多个突起，以使基板放置在多个突起上，在基板和热交换板之间留有间隙; 吸入部，被配置为通过吸入所述热交换板中形成的多个孔而将所述基板吸引到所述多个突起上; 以及设置在所述热交换板上并且比所述多个突起低的分隔构件，其中所述分隔构件被构造成将所述间隙分成包括所述孔中的至少一个的两个或更多个区域，使得所述两个或 更多的区域被分隔构件二维关闭。

公开(公告)号：US20080171131A1

公开(公告)日：2008-07-17

申请号：US12007892

申请日：2008-01-16

申请人： Shouken Moro ,  Yasuhiro Takaki ,  Masatoshi Kaneda

发明人： Shouken Moro ,  Yasuhiro Takaki ,  Masatoshi Kaneda

IPC分类号： B05C13/00 ,  C23C16/52 ,  B05C11/00 ,  B05D3/02

CPC分类号： G03F7/70708 ,  B05C11/00 ,  C23C14/541 ,  C23C16/00 ,  C23C16/46 ,  H01L21/67109 ,  H01L21/67288 ,  H01L21/683 ,  H01L21/6838 ,  H01L21/6875

摘要： A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.

摘要翻译： 公开的基板处理装置包括被配置为加热和/或冷却基板的热交换板; 设置在热交换板上的多个突起，以使基板放置在多个突起上，在基板和热交换板之间留有间隙; 吸入部，被配置为通过吸入所述热交换板中形成的多个孔而将所述基板吸引到所述多个突起上; 以及设置在所述热交换板上并且比所述多个突起低的分隔构件，其中所述分隔构件被构造成将所述间隙分成包括所述孔中的至少一个的两个或更多个区域，使得所述两个或 更多的区域被分隔构件二维关闭。

公开(公告)号：US08138456B2

公开(公告)日：2012-03-20

申请号：US11742319

申请日：2007-04-30

申请人： Yoshiteru Fukuda ,  Kenichi Shigetomi ,  Shouken Moro

发明人： Yoshiteru Fukuda ,  Kenichi Shigetomi ,  Shouken Moro

IPC分类号： B23K10/00 ,  H05B1/02

CPC分类号： H01L21/67748 ,  H01L21/67005 ,  H01L21/67253 ,  H01L21/6838

摘要： In the present invention, a plurality of suction ports are provided in a heating plate of a heat processing apparatus. The suction ports are provided at a central portion, an intermediate portion, and a peripheral portion of a substrate mounting surface of the heating plate, respectively. The warped state of the substrate before heat-processed is measured, so that when the substrate warps protruding downward, the suction start timing via a suction port corresponding to the outer peripheral portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports, and when the substrate warps protruding upward, the suction start timing via the suction port corresponding to the central portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports. This allows a portion of the substrate bending upward to be sucked first when the substrate is mounted on the heating plate, thereby quickly performing correction of the warpage of the substrate to uniformly heat the substrate.

摘要翻译： 在本发明中，在热处理装置的加热板上设置多个吸入口。 吸入口分别设置在加热板的基板安装面的中央部分，中间部分和周边部分。 测量热处理前的基板的翘曲状态，使得当基板翘曲向下突出时，通过与基板的外周部分相对应的吸入口将吸入开始正时设定为与抽吸相比较早 通过其他吸入口开始定时，并且当基板翘曲向上突出时，通过与基板的中心部分对应的吸入口的吸入开始定时与通过其它吸入口的吸入开始定时相比较早地设定 。 这使得当基板安装在加热板上时，首先将基板的一部分向上弯曲，从而快速地进行基板的翘曲校正以均匀地加热基板。

公开(公告)号：US20070257085A1

公开(公告)日：2007-11-08

申请号：US11742319

申请日：2007-04-30

申请人： Yoshiteru Fukuda ,  Kenichi Shigetomi ,  Shouken Moro

发明人： Yoshiteru Fukuda ,  Kenichi Shigetomi ,  Shouken Moro

IPC分类号： A47J36/02

CPC分类号： H01L21/67748 ,  H01L21/67005 ,  H01L21/67253 ,  H01L21/6838

摘要： In the present invention, a plurality of suction ports are provided in a heating plate of a heat processing apparatus. The suction ports are provided at a central portion, an intermediate portion, and a peripheral portion of a substrate mounting surface of the heating plate, respectively. The warped state of the substrate before heat-processed is measured, so that when the substrate warps protruding downward, the suction start timing via a suction port corresponding to the outer peripheral portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports, and when the substrate warps protruding upward, the suction start timing via the suction port corresponding to the central portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports. This allows a portion of the substrate bending upward to be sucked first when the substrate is mounted on the heating plate, thereby quickly performing correction of the warpage of the substrate to uniformly heat the substrate.

摘要翻译： 在本发明中，在热处理装置的加热板上设置多个吸入口。 吸入口分别设置在加热板的基板安装面的中央部分，中间部分和周边部分。 测量热处理前的基板的翘曲状态，使得当基板翘曲向下突出时，通过与基板的外周部分相对应的吸入口将吸入开始正时设定为与抽吸相比较早 通过其他吸入口开始定时，并且当基板翘曲向上突出时，通过与基板的中心部分相对应的吸入口的吸入开始定时与通过其它吸入口的吸入开始定时相比较早地设定 。 这使得当基板安装在加热板上时，首先将基板的一部分向上弯曲，从而快速地进行基板的翘曲校正以均匀地加热基板。